category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量			Core																										厂商																																															操作温度	包装	系列	JESD-609代码	零件状态	类型	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	引脚数量	JESD-30代码	输出的数量	资历状况
M2S025T-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S025T-FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	MSL 3 - 168 hours	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant		S-PBGA-B325	180	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	现场可编程门阵列		592Kbit			FPGA - 25K Logic Modules							27696		1 Core			256KB						11 mm	11 mm
M2S050T-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	267	Tray	M2S050	活跃				This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						1		FPGA - 50K Logic Modules									1 Core			256KB
M2S060TS-FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	387	Tray	M2S060	活跃				This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 60K Logic Modules									1 Core			256KB
M2S025T-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	2308 LAB	1.2000 V	1.14 V	1.26 V	267	Tray	M2S025	活跃				60	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	-40 to 100 °C	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						1		FPGA - 25K Logic Modules									1 Core			256KB
M2S090TS-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	86316 LE	有	7193 LAB	60	267	Tray	M2S090	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S090TS-1FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)			CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	267	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列					FPGA - 90K Logic Modules							86316		1 Core			512KB						23 mm	23 mm
M2S025-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	207	Tray	M2S025	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S025-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	90	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400	207	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列					FPGA - 25K Logic Modules							27696		1 Core			256KB						17 mm	17 mm
M2S150TS-1FC1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	微芯片技术	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	30	1.14 V	无	M2S150TS-1FC1152I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B1152	574	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574	2.9 mm	现场可编程门阵列					FPGA - 150K Logic Modules							146124		1 Core			512KB						35 mm	35 mm
M2S010TS-VFG256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 10K Logic Modules									1 Core			256KB
M2S025-VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 25K Logic Modules									1 Core			256KB
M2S050-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	64 kB	56340 LE	有	4695 LAB	176	1.2000 V	1.14 V	1.26 V	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S050-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		S-PBGA-B325	200	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列			STD		FPGA - 50K Logic Modules							56340		1 Core			256KB						11 mm	11 mm
M2S005S-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	119	161	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	-		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 5K Logic Modules									1 Core			128KB
M2S025-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	64 kB	27696 LE	有	2308 LAB	176	1.2000 V	1.26 V	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S025-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		S-PBGA-B325	180	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	现场可编程门阵列					FPGA - 25K Logic Modules							27696		1 Core			256KB						11 mm	11 mm
M2S005-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	MSL 3 - 168 hours	209	Tray	M2S005	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					191Kbit			FPGA - 5K Logic Modules									1 Core			128KB
M2S010-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S010-1FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	233	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列			1		FPGA - 10K Logic Modules							9744		1 Core			256KB						23 mm	23 mm
M2S060T-1FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	微芯片技术	40	SmartFusion2	387	Tray	M2S060	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S060T-1FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B676	387	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	387	2.44 mm	现场可编程门阵列					FPGA - 60K Logic Modules							56520		1 Core			256KB						27 mm	27 mm
M2S060T-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	64 kB	-	-	166 MHz	N	This product may require additional documentation to export from the United States.	267	Tray	M2S060	活跃			SmartFusion2	60	4710 LAB	有	56520 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 60K Logic Modules									1 Core			256KB
M2S025-VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	YES	256-FPBGA (17x17)	256	ARM Cortex M3	微芯片技术	119	1.2000 V	138	Tray	M2S025	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S025-VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant		S-PBGA-B256	138	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列			STD		FPGA - 25K Logic Modules							27696		1 Core			256KB						14 mm	14 mm
M2S050T-FG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	56340 LE	377 I/O	0 C	+ 85 C	1.314 Mbit	64 kB	有	4695 LAB	27	Tray	M2S050	Obsolete				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD		FPGA - 50K Logic Modules									1 Core			256KB
i.MX 6UltraLite \| MCIMX6G3CVM05AB	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Compliant	5A992C		8542.31.00.01	有	无	无	表面贴装	0.98(Max)	14		14	289	MAP-BGA							Tray			活跃											289
ADSP-CM419F	Analog Devices, Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	240	32	Microprocessor	1	-40	105	CAN/I2C/SPI/UART	1	0	4	0	0	有	表面贴装	1.01	15	15	210	BGA	CSP-BGA	Ball							Compliant	3A991.a.2		8542.31.00.01	无	无	ADSP-CM41xF		Tray			Obsolete	应用处理器										210								160KB			Flash	1MB						ARM					0				0									1	1	1	ARM Cortex M4
MCIMX6S6AVM08ABR	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	800	32	Microprocessor	2	-40	125	CAN/Ethernet/I2C/I2S/SPI/UART/USB	4	3	5	0	有	10Mbps/100Mbps/1000Mbps	表面贴装	1.16	21	21	624	BGA	MAP-BGA	Ball							Compliant	5A992C		8542.31.00.01	有	有	i.MX 6Solo		卷带			NRND	应用处理器										624								128KB			ROM	96KB						ARM					1				4									4	2	4	ARM Cortex A9
MIMXRT1021CAG4AR	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8542.31.00.01	无	无	396	32	Microprocessor	1	-40	105	CAN/Ethernet/I2C/SPI/UART/USB	4	0	8	16KB	16KB	0	0	有	10Mbps/100Mbps	表面贴装	1.45(Max)	20	20	144	QFP		LQFP	Gull-wing						Compliant	5A992c.			卷带			活跃	应用处理器										144								256KB			ROM	96KB						ARM					1				1									4	2		ARM Cortex M7
MIMXRT1064DVJ6A	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8542.31.00.01	无	无	i.MX	600	32	Microcontroller	0	85	CAN/Ethernet/I2C/I2S/SPI/UART/USB	4	3	8	32KB	32KB	0	0	有	10Mbps/100Mbps	表面贴装	1.18(Max)	12	12	196	BGA		LFBGA	Ball						Compliant	5A992C			Tray			NRND	应用处理器										196								1MB			Flash	4MB						ARM					2				1									4	3	4	ARM Cortex M7
MSCMMX6XYCM08AA	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8542.31.00.01	无	无	i.MX 6SoloX	800	32	Microprocessor	-40	105	CAN/Ethernet/I2C/I2S/SPI/UART/USB	4	5	6	32KB\|16KB	32KB\|16KB	0	0	有	MMPF0100	表面贴装	0.73(Max)	13	13	265	BGA		BGA	Ball						Compliant	5A992						Obsolete	应用处理器										265												96KB						ARM					1				2									5	2		ARM Cortex A9\|ARM Cortex M4
MCIMX6X2CVN08AB	Freescale Semiconductor, Inc. (NXP Semiconductors)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-MAPBGA (17x17)	飞思卡尔半导体		8542.31.00.01	无	无	i.MX 6SoloX	800/227	32	Microprocessor	3	-40	105	CAN/Ethernet/I2C/I2S/SPI/UART/USB	4	3	6	16KB\|32KB	16KB\|32KB	0	0	有	10Mbps/100Mbps/1000Mbps	表面贴装	1.12	17	17	400	BGA	PBGA	Ball	Bulk	活跃				Compliant	5A992c.	-40°C ~ 105°C (TA)	Tray	i.MX6SX		NRND	System-On-Chip										400							200MHz, 800MHz	176KB	ARM® Cortex®-A9, ARM® Cortex®-M4		ROM	96KB						ARM			1.8V, 2.5V, 2.8V, 3.15V		2	2 Core, 32-Bit	有	LPDDR2, LVDDR3, DDR3	3	AC97, CAN, I²C, I²S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART		Multimedia; NEON™ MPE		A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE	Keypad, LCD		-	5	2	8	ARM Cortex M4\|ARM Cortex A9

M2S025T-FCS325

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S050T-1FGG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S060TS-FG676

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S025T-1FG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S090TS-1FG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S025-VF400I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S150TS-1FC1152I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S010TS-VFG256I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S025-VF256I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S050-FCSG325

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S005S-1VFG256

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S025-FCSG325

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S005-1FGG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S010-1FG484

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S060T-1FG676

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S060T-1FG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S025-VFG256

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S050T-FG896

Microchip Technology

分类:Embedded - System On Chip (SoC)
i.MX 6UltraLite | MCIMX6G3CVM05AB

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
ADSP-CM419F

Analog Devices, Inc.

分类:Embedded - System On Chip (SoC)
MCIMX6S6AVM08ABR

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
MIMXRT1021CAG4AR

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
MIMXRT1064DVJ6A

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
MSCMMX6XYCM08AA

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)
MCIMX6X2CVN08AB

Freescale Semiconductor, Inc. (NXP Semiconductors)

分类:Embedded - System On Chip (SoC)