类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 端子形状 | 越来越多的功能 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 零件状态 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电容量 | 子类别 | 包装方式 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 电阻器类型 | Reach合规守则 | 频率 | 基本部件号 | 参考标准 | JESD-30代码 | 输出的数量 | 资历状况 | 额定功率损耗(P) | 工作电源电压 | 电源 | 温度等级 | 电压 | 额定温度 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 端子放置位置 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 核心架构 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 主要属性 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 核数量 | 闪光大小 | 电路最大直流电压 | 电路最大有效值电压 | 能量吸收能力-Max | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 无铅 | |||||||||||||||||||||||||||||||||||||||
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![]() | 5CSEMA5F31C8N | ALTERA | 数据表 | 2895 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | BGA896,30X30,40 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA896,30X30,40 | MCU - 181, FPGA - 288 | Compliant | 2.05 | 1.13 V | INTEL CORP | 活跃 | Intel Corporation | SQUARE | BGA | 5CSEMA5F31C8N | 有 | 85 °C | 1.07 V | 未说明 | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5CSEMA5 | S-PBGA-B896 | 288 | 不合格 | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 3.3 V | 1.8 V | 556.3 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | 85000 | 85000 | 800 MHz | 32075 | 8 | FPGA - 85K Logic Elements | 128300 | 85000 | -- | 31 mm | 31 mm | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA4U23A7N | ALTERA | 数据表 | 2179 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | BGA672,28X28,32 | PLASTIC/EPOXY | GRID ARRAY, FINE PITCH | FBGA, BGA672,28X28,32 | MCU - 181, FPGA - 145 | 5.57 | 1.13 V | INTEL CORP | 活跃 | Intel Corporation | SQUARE | FBGA | 5CSEBA4U23A7N | 有 | 125 °C | 1.07 V | 未说明 | 1.1 V | -40 °C | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA4U19A7N | ALTERA | 数据表 | 2870 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-FBGA | 484-UBGA (19x19) | MCU - 151, FPGA - 66 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA2U23A7N | ALTERA | 数据表 | 2503 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | 活跃 | INTEL CORP | 1.13 V | 5.57 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | -40 °C | 1.1 V | 未说明 | 1.07 V | 125 °C | 有 | 5CSEMA2U23A7N | FBGA | SQUARE | Intel Corporation | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | +/-5% | 活跃 | 10pF | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA4U23C7N | ALTERA | 数据表 | 2298 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA2U23C6N | ALTERA | 数据表 | 2457 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9 | INTEL CORP | 1.13 V | 5.57 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEMA2U23C6N | FBGA | SQUARE | Intel Corporation | 活跃 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA2U23C7N | ALTERA | 数据表 | 2305 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 25K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA2U23I7N | ALTERA | 数据表 | 2556 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | 活跃 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 25K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA2U23C8N | ALTERA | 数据表 | 2781 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | 1.13 V | 5.56 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEMA2U23C8N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA2U23C7N | ALTERA | 数据表 | 2155 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 25K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U23C6N | ALTERA | 数据表 | 2915 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | LUG | CHASSIS MOUNT | 672 | 672-UBGA (23x23) | 2 | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 2.04 | Radial | -55 | 85 | 光盘包 | D | MCU - 181, FPGA - 145 | Compliant | FBGA, BGA672,28X28,32 | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSEBA6U23C6N | FBGA | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | e0 | 活跃 | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | BULK | METAL OXIDE FILM | BOTTOM | BALL | 未说明 | 0.8 mm | VARISTOR | compliant | 925 MHz | 5CSEBA6 | CECC42000 | S-PBGA-B672 | 145 | 不合格 | 1 | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 85 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | RADIAL | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | 110000 | ARM | 800 MHz | 41509 | 6 | FPGA - 110K Logic Elements | 110000 | -- | 505 | 390 | 228 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC2C6U23C6N | ALTERA | 数据表 | 2908 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | 1.13 V | 2.06 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSXFC2C6U23C6N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSXFC2 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC6C6U23C8N | ALTERA | 数据表 | 2720 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | 1.13 V | 2.01 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSXFC6C6U23C8N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSXFC6 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB5H4F40I3N | ALTERA | 数据表 | 258 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | 生命周期结束 | INTEL CORP | 1.18 V | 5.28 | MCU - 208, FPGA - 540 | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 1.15 V | 未说明 | 1.12 V | 100 °C | 有 | 5ASXFB5H4F40I3N | BGA | SQUARE | Intel Corporation | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXFB5 | S-PBGA-B1517 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX210HU3F50I3VGAS | ALTERA | 数据表 | 555 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-2397 | - | 4 x 32 kB | 1 GHz | 2100000 LE | 704 I/O | + 100 C | - 40 C | 1 | SMD/SMT | 26250 LAB | 999A3J | Intel | Intel / Altera | Stratix | Details | 4 x 32 kB | Tray | Stratix 10 SX | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 96 Transceiver | 4 Core | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280HN2F43E2VGAS | ALTERA | 数据表 | 756 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | - | 4 x 32 kB | 1 GHz | 2800000 LE | 688 I/O | + 100 C | 0 C | 1 | SMD/SMT | 350000 LAB | 999A2P | Intel | Intel / Altera | Stratix | Details | 4 x 32 kB | Tray | Stratix 10 SX | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 48 Transceiver | 4 Core | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX085HN2F43I2LGAS | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | - | 4 x 32 kB | 1 GHz | 850000 LE | 688 I/O | + 100 C | - 40 C | 1 | SMD/SMT | 106250 LAB | 999GHJ | Intel | Intel / Altera | Stratix | Details | 4 x 32 kB | Tray | 1SX085HN | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 48 Transceiver | 4 Core | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-1FSVF1760E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SMD | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | Y | ECE/EXCEL CELL ELECTRONIC CORP | 622 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 106.5mm (4.193 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-1FFVH1760E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, w/Stud Can | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | 活跃 | Y | BARKER MICROFARADS INC | 574 | 0°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-1FSVG1517E | Xilinx | 数据表 | 360 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 有 | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-2FFG676I | AMD | 数据表 | 887 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 有 | 活跃 | XC7Z045 | Tray | 130 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A2I2V | Intel | 数据表 | 748 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 有 | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1502-1LSEVSVA2785 | AMD | 数据表 | 525 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2785-BFBGA | 2785-BGA (50x50) | AMD | 有 | 702 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal® Premium | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z100-L2FFG900I | AMD | 数据表 | 831 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 有 | 130 | Tray | XC7Z100 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 444K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R25A3E3E | Intel | 数据表 | 905 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 有 | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - |
5CSEMA5F31C8N
ALTERA
分类:Embedded - System On Chip (SoC)
1,417.974106
5CSEBA4U23A7N
ALTERA
分类:Embedded - System On Chip (SoC)
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ALTERA
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ALTERA
分类:Embedded - System On Chip (SoC)
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5CSEMA2U23C8N
ALTERA
分类:Embedded - System On Chip (SoC)
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ALTERA
分类:Embedded - System On Chip (SoC)
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ALTERA
分类:Embedded - System On Chip (SoC)
2,905.158930
5CSXFC2C6U23C6N
ALTERA
分类:Embedded - System On Chip (SoC)
1,513.357001
5CSXFC6C6U23C8N
ALTERA
分类:Embedded - System On Chip (SoC)
2,054.915173
5ASXFB5H4F40I3N
ALTERA
分类:Embedded - System On Chip (SoC)
1SX210HU3F50I3VGAS
ALTERA
分类:Embedded - System On Chip (SoC)
103,654.376923
1SX280HN2F43E2VGAS
ALTERA
分类:Embedded - System On Chip (SoC)
122,767.305223
1SX085HN2F43I2LGAS
ALTERA
分类:Embedded - System On Chip (SoC)
XCZU49DR-1FSVF1760E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU46DR-1FFVH1760E
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU47DR-1FSVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z045-2FFG676I
AMD
分类:Embedded - System On Chip (SoC)
18,516.869891
AGFA023R25A2I2V
Intel
分类:Embedded - System On Chip (SoC)
136,376.633598
XCVP1502-1LSEVSVA2785
AMD
分类:Embedded - System On Chip (SoC)
181,918.866880
XC7Z100-L2FFG900I
AMD
分类:Embedded - System On Chip (SoC)
23,688.300243
AGFB027R25A3E3E
Intel
分类:Embedded - System On Chip (SoC)
115,328.841614
