category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core										厂商																													操作温度	包装	系列	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	电源	温度等级	最大电源电压	最小电源电压	内存大小	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	逻辑元件/单元数	速度等级	主要属性	最大结点温度（Tj）
M2S050TS-1FG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	-	-	64 kB	56340 LE	有	4695 LAB	27	377	Tray	M2S050	活跃			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 50K Logic Modules			1 Core	256KB
M2S010-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	-	-	64 kB	12084 LE	有	1007 LAB	微芯片技术	90	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-40 to 100 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	160	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules		9744	1 Core	256KB		17 mm	17 mm
M2S025-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules			1 Core	256KB
M2S150TS-1FCS536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	12177 LAB	90	微芯片技术	1.2000 V	293	Tray	M2S150	活跃	FBGA-536	网格排列	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S150TS-1FCS536I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	-40 to 100 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240		not_compliant			536	S-PBGA-B536							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列		1	FPGA - 150K Logic Modules			1 Core	512KB
M2S025TS-VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules			1 Core	256KB
M2S050T-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	1.2000 V	207	Tray	M2S050	活跃				0 to 85 °C	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1	FPGA - 50K Logic Modules			1 Core	256KB
M2S010TS-VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	-	-	64 kB	12084 LE	有	1007 LAB	90	195	Tray	M2S010	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 10K Logic Modules			1 Core	256KB
M2S060TS-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	395	FLASH	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	Details	0°C ~ 85°C (TJ)	Tray	SmartFusion2					85 °C	0 °C									166 MHz								3.45 V	1.14 V	256 kB	166MHz	1.3 MB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				56520		FPGA - 60K Logic Modules	85 °C		1 Core	256KB	2.44 mm
M2S025TS-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	90	207	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules			1 Core	256KB
M2S025T-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	-	-	64 kB	27696 LE	有	2308 LAB	微芯片技术	60	1.14 V	1.26 V	267	Tray	M2S025	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S025T-FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B484	267	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列		STD	FPGA - 25K Logic Modules		27696	1 Core	256KB		23 mm	23 mm
M2S010TS-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	12084 LE	有	1007 LAB	微芯片技术	60	233	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S010TS-FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B484	233	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列			FPGA - 10K Logic Modules		12084	1 Core	256KB		23 mm	23 mm
M2S025T-VFG256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	YES	256-FPBGA (17x17)	256	ARM Cortex M3	2308 LAB	119	微芯片技术	1.2000 V	138	Tray	M2S025	活跃	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	5.78	1.26 V	MICROSEMI CORP	活跃	SQUARE	LFBGA	M2S025T-VFG256I	有	1.14 V	1.2 V	BGA256,16X16,32	PLASTIC/EPOXY	3	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant		40		S-PBGA-B256	138	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列		STD	FPGA - 25K Logic Modules		27696	1 Core	256KB		14 mm	14 mm
M2S025TS-VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	有	2308 LAB	90	微芯片技术	207	Tray	M2S025	活跃	有	M2S025TS-VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82	85 °C	1.14 V	40	1.2 V	BGA400,20X20,32	PLASTIC/EPOXY	3	GRID ARRAY, LOW PROFILE, FINE PITCH	LFBGA, BGA400,20X20,32	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)					CMOS	BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B400	207	不合格	1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列			FPGA - 25K Logic Modules		27696	1 Core	256KB		17 mm	17 mm
M2S090T-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	-	-	64 kB	86316 LE	有	7193 LAB	微芯片技术	60	267	Tray	M2S090	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	30	1.14 V	125 °C	无	M2S090T-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0		3A001.A.2.C	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484	267	不合格	1.2 V	MILITARY			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules		86316	1 Core	512KB		23 mm	23 mm
M2S050TS-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	60	微芯片技术	267	Tray	M2S050	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S050TS-FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	无		Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		2.44 mm	现场可编程门阵列			FPGA - 50K Logic Modules			1 Core	256KB		23 mm	23 mm
M2S150TS-1FCSG536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	有	12177 LAB	90	微芯片技术	293	Tray	M2S150	活跃	5.82	1.26 V	MICROSEMI CORP	活跃	SQUARE	BGA	M2S150TS-1FCSG536	有	85 °C	1.14 V	40	1.2 V	PLASTIC/EPOXY	3	网格排列	FBGA-536		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	有		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		BOTTOM	BALL	250		compliant				S-PBGA-B536				OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列			FPGA - 150K Logic Modules			1 Core	512KB
M2S050T-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	-	-	64 kB	56340 LE	有	4695 LAB	微芯片技术	90	1.2000 V	1.14 V	1.26 V	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S050T-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.3		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-40 to 100 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	160	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列		1	FPGA - 50K Logic Modules		48672	1 Core	256KB		17 mm	17 mm
M2S025TS-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	60	267	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules			1 Core	256KB
M2S010-1VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	12084 LE	有	1007 LAB	微芯片技术	119	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	无	M2S010-1VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B256	138	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列			FPGA - 10K Logic Modules		12084	1 Core	256KB		14 mm	14 mm
M2S025TS-1VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	ARM Cortex M3	2308 LAB	微芯片技术	119	138	Tray	M2S025	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S025TS-1VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	无		Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01		BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B256							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		1.56 mm	现场可编程门阵列			FPGA - 25K Logic Modules			1 Core	256KB		14 mm	14 mm
M2S010-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	ARM Cortex M3	1007 LAB	119	微芯片技术	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	85 °C	无	M2S010-VF256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	12084 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B256	138	不合格	1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列			FPGA - 10K Logic Modules		12084	1 Core	256KB		14 mm	14 mm
M2S025-1VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	90	207	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	Details	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1	FPGA - 25K Logic Modules			1 Core	256KB
M2S150T-FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	ARM Cortex M3	微芯片技术	-	64 kB	146124 LE	有	12177 LAB	84	273	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 150K Logic Modules			1 Core	512KB
M2S060T-1FGG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	-	-	166 MHz	Details	微芯片技术	This product may require additional documentation to export from the United States.	1.2000 V	387	Tray	M2S060	活跃	MICROSEMI CORP	1.26 V	5.8	活跃	SQUARE	BGA	M2S060T-1FGG676I	有	1.14 V	40	1.2 V	BGA676,26X26,40	PLASTIC/EPOXY	3	网格排列	FBGA-676	SmartFusion2	40	4710 LAB	有	56520 LE	64 kB	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B676	387	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	387	2.44 mm	现场可编程门阵列		1	FPGA - 60K Logic Modules		56520	1 Core	256KB		27 mm	27 mm
M2S090T-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	-	64 kB	86316 LE	有	7193 LAB	微芯片技术	60	1.2000 V	267	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S090T-1FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-40 to 100 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484	267	不合格	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列		1	FPGA - 90K Logic Modules		86316	1 Core	512KB		23 mm	23 mm