类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 房屋材料 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | 端子表面处理 | 应用 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 深度 | Reach合规守则 | 输出量 | 引脚数量 | JESD-30代码 | 功能 | 输出的数量 | 资历状况 | 电源 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 最高频率 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 核数量 | 等效门数 | 闪光大小 | 输入电压(交流电) | 知识产权评级 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||
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![]() | M2S060TS-1FGG676T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | Panel | 387 | M2S060 | 活跃 | JHSN_DRIV_VSD-II | VS027431B-SM1P3 | Johnson Controls | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 15.3125 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 320 Hz | 1 | FPGA - 60K Logic Modules | 256KB | 480 VAC | 9.40625 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1VFG256T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | C7772G1004/U | Honeywell | 无显示 | 1.2000 V | 138 | Tray | M2S025 | 活跃 | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | Indoor | 10 kOhm NTC | Temperature | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-VFG400 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | Lower Mount | 0-1,500 psi | NOSHOK | 1.2000 V | 207 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 1/4 NPT | 2.5 | 25-410-1500-psi/kg/cm2 | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-L1FFVC1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | MUBADP330 | Cutler Hammer, Div of Eaton Co | 512 | Tray | XCZU19 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-L1FFVC1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Aluminum | AMD | (2) GFCI | P-E5P1-M3RF0 | Grace Technologies | 512 | Tray | XCZU11 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | IP65 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVB1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | XCZU11 | 活跃 | U-91485 | Turck | 0.8500 V | 0.808 V | 0.892 V | 488 | Tray | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-L2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Miscellaneous | 0.8500 V | 0.825 V | 0.876 V | 204 | Tray | XCZU7 | 活跃 | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-L2SBVA484E | AMD | 数据表 | 80 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Aluminum | AMD | (1) 120V Receptacle | P-D4-H3R3 | Grace Technologies | 82 | Tray | XCZU3 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | IP65 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-1FG896I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BGA | 896-FBGA (31x31) | 微芯片技术 | Electri-Flex | 1.2000 V | 377 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | -40 to 100 °C | SmartFusion®2 | 896 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 有 | 微芯片技术 | A2F200M3F-1PQG208I | 100 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.59 | 1.5000 V | 1.425 V | 200000 | 1.575 V | MCU - 22, FPGA - 66 | Tray | A2F200 | 活跃 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.5 V | 30 | 1.425 V | -40 to 100 °C | SmartFusion® | 有 | Pure Matte Tin (Sn) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 66 | 不合格 | 1.5,1.8,2.5,3.3 V | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | 现场可编程门阵列 | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVB1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | XCZU11 | 活跃 | RSM40RKM50-10M/S1587/BL67 | Turck | 0.8500 V | 0.808 V | 0.892 V | 488 | Tray | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU3EG-L1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | XAZU3 | 活跃 | 7000-08701-3170750 | Murrelektronik | 0.7200 V | 0.698 V | 0.742 V | 128 | Tray | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9EG-3FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Bridgeport Fittings Inc | 0.9000 V | 0.873 V | 0.927 V | 328 | Tray | XCZU9 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-2FFVF1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | M1D458FRRJ45BM-1M | Murrelektronik | 464 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-L1FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | -30 Hg-0 psi | NOSHOK | 464 | Tray | XCZU11 | 活跃 | 1/2 NPT | 4 | 40-410-30-vac/bar | Center Back Mount | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1FG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | DIL2MKV-00(24V50/60HZ) | Klockner-Moeller, Div of Eaton | MCU - 25, FPGA - 66 | Tray | A2F200 | 活跃 | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-L2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Tray | XCZU5 | 活跃 | 252 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-2FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | FCBGA | 0.8500 V | 0.808 V | 204 | 0.892 V | 204 | Tray | XCZU4 | 活跃 | Industrial grade | 192,150 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 900 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-FCV484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA | 484-FBGA (19x19) | 微芯片技术 | 活跃 | - | 166 MHz | 146124 LE | - | 64 kB | 1.2000 V | 273 | Tray | M2S150 | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1VFG400T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 1.2000 V | 207 | Tray | M2S025 | 活跃 | 40 | 有 | M2S025TS-1VFG400T2 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.81 | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | 有 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-CSG288 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | 微芯片技术 | 1.5000 V | 1.425 V | 500000 | 1.575 V | MCU - 31, FPGA - 78 | Tray | A2F500 | 活跃 | 0 to 85 °C | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-L2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Tray | XCZU7 | 活跃 | 204 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-L1FFVC1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | XCZU7 | 活跃 | 360 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-1FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU4 | 活跃 | 0.8500 V | 0.808 V | 0.892 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU2EG-L1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Tray | XAZU2 | 活跃 | 128 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - |
M2S060TS-1FGG676T2
Microchip
分类:Embedded - System On Chip (SoC)
M2S025TS-1VFG256T2
Microchip
分类:Embedded - System On Chip (SoC)
M2S050T-VFG400
Microchip
分类:Embedded - System On Chip (SoC)
XCZU19EG-L1FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
XCZU11EG-L1FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
XCZU11EG-1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
XCZU7EV-L2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU3CG-L2SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
M2S050-1FG896I
Microchip
分类:Embedded - System On Chip (SoC)
A2F200M3F-1PQG208I
Microchip
分类:Embedded - System On Chip (SoC)
XCZU11EG-1FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
XAZU3EG-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
XCZU9EG-3FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU7CG-2FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
XCZU11EG-L1FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
A2F200M3F-1FG256
Microchip
分类:Embedded - System On Chip (SoC)
XCZU5EG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4CG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
M2S150-FCV484I
Microchip
分类:Embedded - System On Chip (SoC)
M2S025TS-1VFG400T2
Microchip
分类:Embedded - System On Chip (SoC)
A2F500M3G-CSG288
Microchip
分类:Embedded - System On Chip (SoC)
XCZU7EG-L2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU7EG-L1FFVC1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EV-1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
XAZU2EG-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
