类别是'category.片上系统(SoC)' (7695)

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M2S060TS-1FGG676T2
M2S060TS-1FGG676T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

微芯片技术

Panel

387

M2S060

活跃

JHSN_DRIV_VSD-II

VS027431B-SM1P3

Johnson Controls

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100, SmartFusion®2

15.3125

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

320 Hz

1

FPGA - 60K Logic Modules

256KB

480 VAC

9.40625

M2S025TS-1VFG256T2
M2S025TS-1VFG256T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

C7772G1004/U

Honeywell

无显示

1.2000 V

138

Tray

M2S025

活跃

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

Indoor

10 kOhm NTC

Temperature

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

256KB

M2S050T-VFG400
M2S050T-VFG400
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

微芯片技术

Lower Mount

0-1,500 psi

NOSHOK

1.2000 V

207

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

1/4 NPT

2.5

25-410-1500-psi/kg/cm2

0 to 85 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

XCZU19EG-L1FFVC1760I
XCZU19EG-L1FFVC1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

MUBADP330

Cutler Hammer, Div of Eaton Co

512

Tray

XCZU19

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCZU11EG-L1FFVC1760I
XCZU11EG-L1FFVC1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

Aluminum

AMD

(2) GFCI

P-E5P1-M3RF0

Grace Technologies

512

Tray

XCZU11

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

IP65

XCZU11EG-1FFVB1517I
XCZU11EG-1FFVB1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU11

活跃

U-91485

Turck

0.8500 V

0.808 V

0.892 V

488

Tray

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCZU7EV-L2FBVB900E
XCZU7EV-L2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Miscellaneous

0.8500 V

0.825 V

0.876 V

204

Tray

XCZU7

活跃

0 to 110 °C

Zynq® UltraScale+™ MPSoC EV

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU3CG-L2SBVA484E
XCZU3CG-L2SBVA484E
AMD 数据表

80 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

Aluminum

AMD

(1) 120V Receptacle

P-D4-H3R3

Grace Technologies

82

Tray

XCZU3

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

IP65

M2S050-1FG896I
M2S050-1FG896I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

896-BGA

896-FBGA (31x31)

微芯片技术

Electri-Flex

1.2000 V

377

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

-40 to 100 °C

SmartFusion®2

896

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

A2F200M3F-1PQG208I
A2F200M3F-1PQG208I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

A2F200M3F-1PQG208I

100 MHz

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.59

1.5000 V

1.425 V

200000

1.575 V

MCU - 22, FPGA - 66

Tray

A2F200

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

-40 to 100 °C

SmartFusion®

Pure Matte Tin (Sn)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

66

不合格

1.5,1.8,2.5,3.3 V

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

4608 CLBS, 200000 GATES

4.1 mm

现场可编程门阵列

1

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

28 mm

28 mm

XCZU11EG-1FFVB1517E
XCZU11EG-1FFVB1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU11

活跃

RSM40RKM50-10M/S1587/BL67

Turck

0.8500 V

0.808 V

0.892 V

488

Tray

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XAZU3EG-L1SFVC784I
XAZU3EG-L1SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XAZU3

活跃

7000-08701-3170750

Murrelektronik

0.7200 V

0.698 V

0.742 V

128

Tray

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

1L

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU9EG-3FFVB1156E
XCZU9EG-3FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Bridgeport Fittings Inc

0.9000 V

0.873 V

0.927 V

328

Tray

XCZU9

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU7CG-2FFVF1517E
XCZU7CG-2FFVF1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

M1D458FRRJ45BM-1M

Murrelektronik

464

Tray

XCZU7

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU11EG-L1FFVF1517I
XCZU11EG-L1FFVF1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

-30 Hg-0 psi

NOSHOK

464

Tray

XCZU11

活跃

1/2 NPT

4

40-410-30-vac/bar

Center Back Mount

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

A2F200M3F-1FG256
A2F200M3F-1FG256
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

DIL2MKV-00(24V50/60HZ)

Klockner-Moeller, Div of Eaton

MCU - 25, FPGA - 66

Tray

A2F200

活跃

0°C ~ 85°C (TJ)

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

XCZU5EG-L2SFVC784E
XCZU5EG-L2SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

XCZU5

活跃

252

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU4CG-2FBVB900I
XCZU4CG-2FBVB900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

FCBGA

0.8500 V

0.808 V

204

0.892 V

204

Tray

XCZU4

活跃

Industrial grade

192,150

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

900

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

M2S150-FCV484I
M2S150-FCV484I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

微芯片技术

活跃

-

166 MHz

146124 LE

-

64 kB

1.2000 V

273

Tray

M2S150

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 150K Logic Modules

1 Core

512KB

M2S025TS-1VFG400T2
M2S025TS-1VFG400T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

微芯片技术

1.2000 V

207

Tray

M2S025

活跃

40

M2S025TS-1VFG400T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.81

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

1

FPGA - 25K Logic Modules

256KB

A2F500M3G-CSG288
A2F500M3G-CSG288
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

288-CSP (11x11)

微芯片技术

1.5000 V

1.425 V

500000

1.575 V

MCU - 31, FPGA - 78

Tray

A2F500

活跃

0 to 85 °C

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

XCZU7EG-L2FBVB900E
XCZU7EG-L2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Tray

XCZU7

活跃

204

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU7EG-L1FFVC1156I
XCZU7EG-L1FFVC1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

XCZU7

活跃

360

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU4EV-1FBVB900I
XCZU4EV-1FBVB900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU4

活跃

0.8500 V

0.808 V

0.892 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XAZU2EG-L1SFVC784I
XAZU2EG-L1SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

XAZU2

活跃

128

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-