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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量												厂商																													操作温度	包装	系列	JESD-609代码	零件状态	端子表面处理	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	产品类别	收发器数量	主要属性	逻辑块数量
XCVM1802-1LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思		726	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ Prime																			400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ Prime FPGA, 1.9M Logic Cells				-
XCVM1802-2LLEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思		726	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ Prime																			450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ Prime FPGA, 1.9M Logic Cells				-
10AS032H2F34E1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	384	有	2 x 32 kB	1.2 GHz	320000 LE	+ 100 C	0 C	24	SMD/SMT	40000 LAB	965340		Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-			0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃			SOC - Systems on a Chip											950 mV			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					SoC FPGA	24 Transceiver	FPGA - 320K Logic Elements			2 Core	--	SoC FPGA
10AS022E3F29I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	1.2 GHz	220000 LE	1	SMD/SMT	27500 LAB	973474		Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F29I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46		288	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant		S-PBGA-B780	288	不合格		0.9 V	INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288		3.35 mm	现场可编程门阵列	SoC FPGA		FPGA - 220K Logic Elements		220000	2 Core	--	SoC FPGA	29 mm	29 mm
XCVM1802-1LSIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思		770	Tray	活跃		-40°C ~ 100°C (TJ)		Versal™ Prime																			400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ Prime FPGA, 1.9M Logic Cells				-
5ASXMB5E4F31C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXMB5E4F31C6N		BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	1.13 V	5.28	MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	0°C ~ 85°C (TJ)	Tray	Arria V SX	e1	Obsolete	Tin/Silver/Copper (Sn/Ag/Cu)				BOTTOM	BALL	未说明	1 mm	compliant	5ASXMB5	S-PBGA-B896	540				商业扩展	700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	17434 CLBS	2.7 mm	现场可编程门阵列			FPGA - 462K Logic Elements	17434	462000		--		31 mm	31 mm
5ASXFB3H4F40C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXFB3H4F40C6N		BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	1.13 V	5.28	MCU - 208, FPGA - 540	BGA, BGA1517,39X39,40	0°C ~ 85°C (TJ)	Tray	Arria V SX	e1	Obsolete	Tin/Silver/Copper (Sn/Ag/Cu)				BOTTOM	BALL	未说明	1 mm	compliant	5ASXFB3	S-PBGA-B1517	540				商业扩展	700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列			FPGA - 350K Logic Elements	13207	350000		--		40 mm	40 mm
5ASTMD5E3F31I5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	-40 °C	1.1 V	未说明	1.07 V	100 °C	有		5ASTMD5E3F31I5N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.29	-40°C ~ 100°C (TJ)	Tray	Arria V ST	e1	活跃	Tin/Silver/Copper (Sn/Ag/Cu)				BOTTOM	BALL	未说明	1 mm	compliant	5ASTMD5	S-PBGA-B896	540				INDUSTRIAL	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	17434 CLBS	2.7 mm	现场可编程门阵列			FPGA - 350K Logic Elements	17434	462000		--		31 mm	31 mm
5ASTFD5K3F40I5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	1.1 V	未说明	1.07 V	100 °C	有		5ASTFD5K3F40I5N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.29	-40°C ~ 100°C (TJ)	Tray	Arria V ST	e1	活跃	Tin/Silver/Copper (Sn/Ag/Cu)		现场可编程门阵列		BOTTOM	BALL	未说明	1 mm	compliant	5ASTFD5	S-PBGA-B1517	540	不合格		1.1,1.2/3.3,2.5 V	INDUSTRIAL	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	17434 CLBS	2.7 mm	现场可编程门阵列			FPGA - 462K Logic Elements	17434	462000		--		40 mm	40 mm
5ASXMB3E6F31C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	1.07 V	85 °C	有	5ASXMB3E6F31C6N		BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.28	MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	0°C ~ 85°C (TJ)	Tray	Arria V SX	e1	活跃	Tin/Silver/Copper (Sn/Ag/Cu)				BOTTOM	BALL		1 mm	not_compliant	5ASXMB3	S-PBGA-B896	540				商业扩展	700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列			FPGA - 350K Logic Elements	13207	350000		--		31 mm	31 mm
5CSEMA6F31I7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BGA	896-FBGA (31x31)		MCU - 181, FPGA - 288			-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE		活跃										5CSEMA6							800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							FPGA - 110K Logic Elements				--
5CSEMA6U23A7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	-40 °C	1.1 V	未说明	1.07 V	125 °C	有		5CSEMA6U23A7N	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.55	-40°C ~ 125°C (TJ)	Tray	Automotive, AEC-Q100, Cyclone® V SE		活跃			现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant	5CSEMA6	S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	AUTOMOTIVE	700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145		1.85 mm	现场可编程门阵列			FPGA - 110K Logic Elements		110000		--		23 mm	23 mm
5CSXFC4C6U23A7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	-40 °C	1.1 V	未说明	1.07 V	125 °C	有		5CSXFC4C6U23A7N	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.58	-40°C ~ 125°C (TJ)	Tray	Automotive, AEC-Q100, Cyclone® V SE		活跃			现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	AUTOMOTIVE	700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145		1.85 mm	现场可编程门阵列			FPGA - 40K Logic Elements		40000		--		23 mm	23 mm
5CSEBA5U23C7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145			0°C ~ 85°C (TJ)	Tray	Cyclone® V SE		活跃										5CSEBA5							800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							FPGA - 85K Logic Elements				--
5CSEBA4U19I7	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484-UBGA (19x19)	484	BGA484,22X22,32	1.1 V	未说明	1.07 V	无	5CSEBA4U19I7	FBGA		SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.58	MCU - 151, FPGA - 66	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE		活跃		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		S-PBGA-B484	66	不合格		1.1,1.2/3.3,2.5 V		800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	66		1.9 mm	现场可编程门阵列			FPGA - 40K Logic Elements		40000		--		19 mm	19 mm
5CSEBA2U19I7N	ALTERA	数据表	721 In Stock	-	最小起订量: 1 最小包装量: 1	484-FBGA	484-UBGA (19x19)		MCU - 151, FPGA - 66			-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE		活跃										5CSEBA2							800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							FPGA - 25K Logic Elements				--
XCVC1902-2LSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD		770	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ AI Core																			450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.9M Logic Cells				-
XCZU19EG-L1FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	活跃			644	Tray	XCZU19	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				-
AGFA006R16A2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		384	Tray	活跃		-40°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 573K Logic Elements				-
AGID019R18A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		活跃	Tray	480		0°C ~ 100°C (TJ)		Agilex I																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.9M Logic Elements				-
XCZU4EG-2FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	活跃			204	Tray	XCZU4	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																			533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				-
AGFB027R25A2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		624	Tray	活跃		-40°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.7M Logic Elements				-
XCVM1502-1MSIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD		608	Tray	活跃				Versal™ Prime																			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ Prime FPGA, 1M Logic Cells				-
AGFA012R24C2E2VAA	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		744	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.2M Logic Elements				-
10AS022E3F27E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-672	YES	672	220000 LE	1	SMD/SMT	27500 LAB	973471		Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F27E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46		240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant		S-PBGA-B672	240	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240		3.25 mm	现场可编程门阵列	SoC FPGA		FPGA - 220K Logic Elements		220000	2 Core	--	SoC FPGA	27 mm	27 mm