类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 零件状态 | 端子表面处理 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 收发器数量 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||
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![]() | XCVM1802-1LSEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2LLEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H2F34E1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 384 | 有 | 2 x 32 kB | 1.2 GHz | 320000 LE | + 100 C | 0 C | 24 | SMD/SMT | 40000 LAB | 965340 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 320K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-780 | YES | 780 | 1.2 GHz | 220000 LE | 1 | SMD/SMT | 27500 LAB | 973474 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS022E3F29I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 288 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 288 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | |||||||||||||||||
![]() | XCVM1802-1LSIVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB5E4F31C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXMB5E4F31C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.13 V | 5.28 | MCU - 208, FPGA - 250 | BGA, BGA896,30X30,40 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB5 | S-PBGA-B896 | 540 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||
![]() | 5ASXFB3H4F40C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXFB3H4F40C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.13 V | 5.28 | MCU - 208, FPGA - 540 | BGA, BGA1517,39X39,40 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1517 | 540 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||
![]() | 5ASTMD5E3F31I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | MCU - 208, FPGA - 250 | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.1 V | 未说明 | 1.07 V | 100 °C | 有 | 5ASTMD5E3F31I5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.29 | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASTMD5 | S-PBGA-B896 | 540 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||
![]() | 5ASTFD5K3F40I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | MCU - 208, FPGA - 540 | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 1.1 V | 未说明 | 1.07 V | 100 °C | 有 | 5ASTFD5K3F40I5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.29 | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 现场可编程门阵列 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASTFD5 | S-PBGA-B1517 | 540 | 不合格 | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||
![]() | 5ASXMB3E6F31C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 1.07 V | 85 °C | 有 | 5ASXMB3E6F31C6N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | MCU - 208, FPGA - 250 | BGA, BGA896,30X30,40 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1 mm | not_compliant | 5ASXMB3 | S-PBGA-B896 | 540 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA6F31I7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BGA | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | 活跃 | 5CSEMA6 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA6U23A7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | -40 °C | 1.1 V | 未说明 | 1.07 V | 125 °C | 有 | 5CSEMA6U23A7N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.55 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSEMA6 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||
![]() | 5CSXFC4C6U23A7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | -40 °C | 1.1 V | 未说明 | 1.07 V | 125 °C | 有 | 5CSXFC4C6U23A7N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.58 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||
![]() | 5CSEBA5U23C7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 5CSEBA5 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 85K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA4U19I7 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | BGA484,22X22,32 | 1.1 V | 未说明 | 1.07 V | 无 | 5CSEBA4U19I7 | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.58 | MCU - 151, FPGA - 66 | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B484 | 66 | 不合格 | 1.1,1.2/3.3,2.5 V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA2U19I7N | ALTERA | 数据表 | 721 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA | 484-UBGA (19x19) | MCU - 151, FPGA - 66 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | 活跃 | 5CSEBA2 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 25K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-L1FFVB1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 活跃 | 644 | Tray | XCZU19 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA006R16A2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 384 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID019R18A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | Tray | 480 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-2FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 活跃 | 204 | Tray | XCZU4 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24C2E2VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F27E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-672 | YES | 672 | 220000 LE | 1 | SMD/SMT | 27500 LAB | 973471 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS022E3F27E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 240 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm |
XCVM1802-1LSEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-2LLEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
10AS032H2F34E1HG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS022E3F29I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
XCVM1802-1LSIVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
5ASXMB5E4F31C6N
ALTERA
分类:Embedded - System On Chip (SoC)
5ASXFB3H4F40C6N
ALTERA
分类:Embedded - System On Chip (SoC)
5ASTMD5E3F31I5N
ALTERA
分类:Embedded - System On Chip (SoC)
5ASTFD5K3F40I5N
ALTERA
分类:Embedded - System On Chip (SoC)
5ASXMB3E6F31C6N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSEMA6F31I7N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSEMA6U23A7N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSXFC4C6U23A7N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSEBA5U23C7N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSEBA4U19I7
ALTERA
分类:Embedded - System On Chip (SoC)
5CSEBA2U19I7N
ALTERA
分类:Embedded - System On Chip (SoC)
XCVC1902-2LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCZU19EG-L1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
AGFA006R16A2I2V
Intel
分类:Embedded - System On Chip (SoC)
AGID019R18A2E3V
Intel
分类:Embedded - System On Chip (SoC)
XCZU4EG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
AGFB027R25A2I3E
Intel
分类:Embedded - System On Chip (SoC)
XCVM1502-1MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
AGFA012R24C2E2VAA
Intel
分类:Embedded - System On Chip (SoC)
10AS022E3F27E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
