category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量			Core																厂商																																													操作温度	包装	系列	JESD-609代码	无铅代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量
XQZU48DR-1FSQE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-1156	ARM Cortex A53, ARM Cortex R5F		256 kB	930300 LE	- 40 C	+ 100 C	13 Mb	53160 LAB	1					SMD/SMT	2 x 32 kB, 2 x 32 kB	2 x 32 kB, 2 x 32 kB																							850 mV																			16 Transceiver				6 Core
MAX32655GXG T	Maxim Integrated	数据表	N/A	-	最小起订量: 1 最小包装量: 1	CTBGA-CU-81	2500							Details		Reel
M2S010-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	1.26 V	5.3		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S010-1FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484	233	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列			1		FPGA - 10K Logic Modules		9744	1 Core	256KB		23 mm	23 mm
M2S090T-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	325-FCBGA (11x13.5)	ARM Cortex M3	微芯片技术	180	Tray	活跃	M2S090				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	SMARTFUSION2	100C	Industrial	FCBGA	-40C to 100C	180	86316	65nm	1.26(V)	1.2(V)	无	1.14(V)	-40C	有	86316	表面贴装	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																325									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 90K Logic Modules			1 Core	512KB
M2S090T-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2000 V	267	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S090T-FGG484I	BGA	SQUARE	-40 to 100 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B484	267	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列			STD		FPGA - 90K Logic Modules		86316	1 Core	512KB		23 mm	23 mm
M2S050T-FGG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	微芯片技术	5.76	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	1.2000 V	377	Tray	M2S050	活跃	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	40	1.14 V	有	M2S050T-FGG896I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	-40 to 100 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B896	377	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	2.44 mm	现场可编程门阵列			STD		FPGA - 50K Logic Modules		56340	1 Core	256KB		31 mm	31 mm
M2S090T-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	85 °C	有	M2S090T-FCSG325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.78	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		40		R-PBGA-B325	180	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列					FPGA - 90K Logic Modules		86316	1 Core	512KB		13.5 mm	11 mm
M2S150TS-FCV484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	ARM Cortex M3	微芯片技术	-	-	64 kB	146124 LE	有	12177 LAB	84	273	Tray	M2S150	活跃	FBGA,	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S150TS-FCV484I	FBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	无	Tin/Lead (Sn/Pb)			LG-MIN,WD-MIN	8542.39.00.01		BOTTOM	BALL	240	0.8 mm	compliant				S-PBGA-B484								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		3.15 mm	现场可编程门阵列					FPGA - 150K Logic Modules			1 Core	512KB		19 mm	19 mm
M2S050TS-FG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	27	377	Tray	M2S050	活跃			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 50K Logic Modules			1 Core	256KB
M2S005-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	60	0.377729 oz	6,060	FPBGA	1.2000 V	1.14 V	209	1.26 V	表面贴装	209	活跃	M2S005	Tray	Industrial grade				Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	-40 to 100 °C	Tray	SmartFusion2																484									166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					Industrial	STD		FPGA - 5K Logic Modules			1 Core	128KB
M2S010TS-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	MICROSEMI CORP	1.26 V	5.82	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	FLASH	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	85 °C	有	M2S010TS-FGG484	BGA	SQUARE	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	166 MHz			S-PBGA-B484	233	不合格		1.2 V	OTHER	3.6 V	1.4 V	256 kB	166MHz	64 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列					FPGA - 10K Logic Modules	85 °C	12084	1 Core	256KB	2.44 mm	23 mm	23 mm
M2S005-1TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	84 I/O	- 40 C	+ 100 C	191 kbit	有	505 LAB	60	0.046530 oz	Tray	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																				1.2 V					166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 5K Logic Modules			1 Core	128KB
M2S090TS-1FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	微芯片技术	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	M2S090TS-1FGG676	BGA	SQUARE	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)					CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B676	425	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列					FPGA - 90K Logic Modules		86316	1 Core	512KB		27 mm	27 mm
M2S005-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	161	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	119	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 5K Logic Modules			1 Core	128KB
M2S150TS-1FCG1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	146124 LE	有	12177 LAB	24	574	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 150K Logic Modules			1 Core	512KB
M2S060TS-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S060TS-FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325	200	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列					FPGA - 60K Logic Modules		56520	1 Core	256KB		11 mm	11 mm
M2S025TS-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	微芯片技术	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S025TS-1VFG256	LFBGA	SQUARE	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B256	138	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列					FPGA - 25K Logic Modules		27696	1 Core	256KB		14 mm	14 mm
M2S010T-1VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	无	M2S010T-1VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B256	138	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列					FPGA - 10K Logic Modules		12084	1 Core	256KB		14 mm	14 mm
M2S090TS-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	85 °C	有	M2S090TS-1FCSG325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		40		R-PBGA-B325	180	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列					FPGA - 90K Logic Modules		86316	1 Core	512KB		13.5 mm	11 mm
M2S060-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	SmartFusion2	207	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 60K Logic Modules			1 Core	256KB
M2S025TS-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	60	267	FLASH	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2				85 °C	0 °C									166 MHz									3.45 V	1.14 V	256 kB	166MHz	64 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				27696				FPGA - 25K Logic Modules	125 °C		1 Core	256KB	2.44 mm
M2S050TS-1FG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	27	377	Tray	M2S050	活跃			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 50K Logic Modules			1 Core	256KB
M2S010-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	90	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010-1VF400I	-40 to 100 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	160	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列			1		FPGA - 10K Logic Modules		9744	1 Core	256KB		17 mm	17 mm
M2S025-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 25K Logic Modules			1 Core	256KB
M2S150TS-1FCS536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	1.2000 V	293	Tray	M2S150	活跃	FBGA-536	网格排列	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S150TS-1FCS536I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	-40 to 100 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240		not_compliant			536	S-PBGA-B536								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列			1		FPGA - 150K Logic Modules			1 Core	512KB