类别是'category.片上系统(SoC)' (7695)

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表面安装

越来越多的功能

外壳材料

供应商器件包装

介电材料

终端数量

第一种连接器安装类型

第二个连接器安装类型

厂商

Voltage Rating AC

操作温度

包装

系列

尺寸/尺寸

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零件状态

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终端

温度系数

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类型

电阻

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组成

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应用

功率(瓦特)

HTS代码

电容量

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子类别

额定电流

技术

电压 - 供电

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

样式

Reach合规守则

外壳完成

引脚数量

外壳尺寸-插入

JESD-30代码

功能

输出的数量

资历状况

输出类型

工作电源电压

失败率

引线间距

电源

温度等级

注意

界面

速度

内存大小

外壳尺寸,MIL

配件类型

核心处理器

周边设备

程序内存大小

连接方式

建筑学

数据总线宽度

输入数量

座位高度-最大

使用的 IC/零件

提供的内容

可编程逻辑类型

产品类别

第一个连接器

第二个连接器

波长

筛选水平

速度等级

主要属性

寄存器数量

嵌入式

次要属性

逻辑单元数

核数量

闪光大小

接近检测

特征

产品类别

座位高度(最大)

长度

宽度

触点表面处理厚度 - 配套

评级结果

AGFB022R31C3E3E
AGFB022R31C3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Analog Devices Inc./Maxim Integrated

Box

活跃

720

0°C ~ 100°C (TJ)

-

电源管理

Power Supply Supervisor/Tracker/Sequencer

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

MAX34460

Board(s)

12 Channel Sequencer and Monitor

-

-

AGFB019R25A3I3E
AGFB019R25A3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

TE Connectivity Deutsch 连接器

活跃

D38999/24MC

Bag

480

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XCZU11EG-L1FFVC1156I
XCZU11EG-L1FFVC1156I
AMD 数据表

899 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Vishay Sfernice

Bag

活跃

360

XCZU11

-40°C ~ 100°C (TJ)

RCMS

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

CYW4373IUBGT
CYW4373IUBGT
Cypress 数据表

N/A

-

最小起订量: 1

最小包装量: 1

面板安装

Free Hanging (In-Line)

Amphenol Custom Cable

Female

Bag

50 Ohms

Q-2F02R0

Bulkhead - Front Side Nut

活跃

Male

11 GHz

-

RG-58

-

-

Black

-

SMA to N-Type

SMA Jack, Right Angle

N-Type Plug, Right Angle

Shielded

48.0 (1.2m) 4.0

10AS027H4F34E3LG
10AS027H4F34E3LG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Axial

YES

Axial

1152

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

5.43

0.93 V

INTEL CORP

Vishay Foil Resistors (Division of Vishay Precision Group)

活跃

SQUARE

BGA

10AS027H4F34E3LG

100 °C

0.87 V

未说明

0.9 V

BGA1152,34X34,40

Bulk

活跃

384

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964972

Intel

Intel / Altera

Arria 10 SoC

Details

-55°C ~ 125°C

Tray

HZ

0.500 Dia x 1.500 L (12.70mm x 38.10mm)

±0.005%

活跃

4

±0.2ppm/°C

100 Ohms

金属箔

2.5W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

-

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

Non-Inductive

SoC FPGA

-

35 mm

35 mm

XCZU6CG-2FFVC900I
XCZU6CG-2FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.8500 V

0.808 V

0.892 V

204

Tray

XCZU6

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU6EG-L1FFVC900I
XCZU6EG-L1FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.8500 V

0.808 V

0.892 V

204

Tray

XCZU6

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XC7Z012S-1CLG485C
XC7Z012S-1CLG485C
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

485-LFBGA, CSPBGA

485-CSPBGA (19x19)

AMD

Tray

XC7Z012

活跃

55000

RISC

1.8 V

CSBGA

1

1.0000 V

0.95 V

150

1.05 V

150

0 to 85 °C

Zynq®-7000

485

2.3, 4.9 V

JTAG

667MHz

256 KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

1

Artix™-7 FPGA, 55K Logic Cells

68800

-

M2S050T-FGG484I
M2S050T-FGG484I
Microchip 数据表

466 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

1.14 V

1.26 V

267

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

XCZU11EG-L2FFVC1156E
XCZU11EG-L2FFVC1156E
AMD 数据表

196 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

360

Tray

XCZU11

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

M2S025T-FG484I
M2S025T-FG484I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

1.14 V

1.26 V

Non-Compliant

267

Tray

M2S025

活跃

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 25K Logic Modules

256KB

XCZU9EG-L1FFVC900I
XCZU9EG-L1FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU9

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU2EG-1SFVA625E
XCZU2EG-1SFVA625E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

103,320

FCBGA

0.8500 V

0.808 V

180

0.892 V

180

Tray

XCZU2

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

625

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

1

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

94,464

-

XCZU6CG-1FFVC900I
XCZU6CG-1FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.85 V

0.808 V

0.892 V

204

Tray

XCZU6

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU6CG-2FFVB1156I
XCZU6CG-2FFVB1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.808 V

0.892 V

328

Bulk

XCZU6

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU15EG-1FFVC900E
XCZU15EG-1FFVC900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.8500 V

0.808 V

0.892 V

204

Tray

XCZU15

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

AGFC023R25A1I1V
AGFC023R25A1I1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

通孔

Radial

-

Polypropylene (PP), Metallized

Nichicon

-

480

250V

Bulk

活跃

-25°C ~ 85°C

EEC

2.283 L x 1.024 W (58.00mm x 26.00mm)

-5%, +10%

PC引脚

通用型

22 µF

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

-

1.614 (41.00mm)

-

XCZU7EG-L1FFVF1517I
XCZU7EG-L1FFVF1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

PEI-Genesis

Bulk

活跃

464

XCZU7

-40°C ~ 100°C (TJ)

*

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU48DR-1FSVE1156I
XCZU48DR-1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Knowles Syfer

Tape & Reel (TR)

活跃

366

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU46DR-L2FSVH1760I
XCZU46DR-L2FSVH1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

6-WDFN

6-DFN (2x2)

ams欧司朗

574

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Obsolete

-30°C ~ 70°C

-

Ambient

2.7V ~ 3.6V

SMBus

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

640nm

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU7EV-L2FFVC1156E
XCZU7EV-L2FFVC1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1156-BBGA, FCBGA

-

铝合金

1156-FCBGA (35x35)

ITT Cannon, LLC

Silver

360

50V

Bulk

Metal

CA310

活跃

-55°C ~ 125°C

MIL-DTL-5015, CA

Crimp

Plug, Male Pins

10

橄榄色

Threaded

22A

N (Normal)

-

IP65 - Dust Tight, Water Resistant

橄榄色镉

18-19

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

Shrink Boot Adapter

-

XCZU48DR-L1FSVE1156I
XCZU48DR-L1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

PEI-Genesis

Bulk

活跃

366

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

LS1046AMN3T1A
LS1046AMN3T1A
Teledyne LeCroy 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XCZU46DR-2FSVH1760E
XCZU46DR-2FSVH1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

--

574

Tray

活跃

0°C ~ 100°C (TJ)

--

活跃

533MHz, 1.333GHz

256KB

--

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EG-3FBVB900E
XCZU5EG-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

*

活跃

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-