类别是'category.片上系统(SoC)' (7695)

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JESD-609代码

无铅代码

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电压 - 供电

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无线电频率系列/标准

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M2S010-FG484I
M2S010-FG484I
Microchip Technology 数据表

109 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

活跃

微芯片技术

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S010-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

60

233

Tray

M2S010

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

M2S025T-FCSG325I
M2S025T-FCSG325I
Microchip Technology 数据表

150 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

M2S025

微芯片技术

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

M2S025T-FCSG325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

-

180

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

592Kbit

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S025T-1FCSG325
M2S025T-1FCSG325
Microchip Technology 数据表

2653 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

180

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S025T-FCS325
M2S025T-FCS325
Microchip Technology 数据表

2345 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

M2S025T-FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

MSL 3 - 168 hours

180

Tray

M2S025

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

592Kbit

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S050T-1FGG484
M2S050T-1FGG484
Microchip Technology 数据表

2039 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

4695 LAB

60

267

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

M2S060TS-FG676
M2S060TS-FG676
Microchip Technology 数据表

2242 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

40

SmartFusion2

387

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S025T-1FG484I
M2S025T-1FG484I
Microchip Technology 数据表

2244 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

60

This product may require additional documentation to export from the United States.

N

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

M2S090TS-1FG484
M2S090TS-1FG484
Microchip Technology 数据表

2000 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

M2S090

活跃

微芯片技术

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

M2S090TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

60

267

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S025-VF400I
M2S025-VF400I
Microchip Technology 数据表

330 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S025-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

17 mm

17 mm

M2S150TS-1FC1152I
M2S150TS-1FC1152I
Microchip Technology 数据表

554 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-1152

YES

1152-FCBGA (35x35)

1152

ARM Cortex M3

微芯片技术

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

M2S150TS-1FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

146124 LE

12177 LAB

24

574

Tray

M2S150

活跃

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

M2S010TS-VFG256I
M2S010TS-VFG256I
Microchip Technology 数据表

359 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-256

256-FPBGA (17x17)

ARM Cortex M3

微芯片技术

138

Tray

M2S010

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

119

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S025-VF256I
M2S025-VF256I
Microchip Technology 数据表

2664 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

119

138

Tray

M2S025

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S050-FCSG325
M2S050-FCSG325
Microchip Technology 数据表

3000 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

1.26 V

200

Tray

微芯片技术

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S050-FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56340 LE

4695 LAB

176

1.2000 V

1.14 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S005S-1VFG256
M2S005S-1VFG256
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

256-FPBGA (17x17)

ARM Cortex M3

微芯片技术

505 LAB

119

161

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S025-FCSG325
M2S025-FCSG325
Microchip Technology 数据表

191 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

180

Tray

M2S025

微芯片技术

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S025-FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

1.2000 V

1.26 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S005-1FGG484
M2S005-1FGG484
Microchip Technology 数据表

108 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

6060 LE

505 LAB

60

MSL 3 - 168 hours

209

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

191Kbit

FPGA - 5K Logic Modules

1 Core

128KB

M2S010-1FG484
M2S010-1FG484
Microchip Technology 数据表

5000 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

1.2000 V

1.14 V

1.26 V

233

微芯片技术

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

M2S010-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

M2S060T-1FG676
M2S060T-1FG676
Microchip Technology 数据表

2208 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

活跃

微芯片技术

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

M2S060T-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

40

SmartFusion2

387

Tray

M2S060

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

387

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

M2S060T-1FG484I
M2S060T-1FG484I
Microchip Technology 数据表

2553 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

267

Tray

M2S060

活跃

SmartFusion2

60

4710 LAB

56520 LE

64 kB

-

-

166 MHz

N

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S025-VFG256
M2S025-VFG256
Microchip Technology 数据表

2474 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LBGA

YES

256-FPBGA (17x17)

256

ARM Cortex M3

活跃

微芯片技术

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

M2S025-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

27696 LE

2308 LAB

119

1.2000 V

138

Tray

M2S025

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

STD

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

M2S050T-FG896
M2S050T-FG896
Microchip Technology 数据表

2657 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-896

896-FBGA (31x31)

ARM Cortex M3

微芯片技术

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

377 I/O

0 C

+ 85 C

1.314 Mbit

64 kB

4695 LAB

27

Tray

M2S050

Obsolete

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

M2S010S-TQG144
M2S010S-TQG144
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-144

144-TQFP (20x20)

ARM Cortex M3

微芯片技术

166 MHz

-

-

64 kB

12084 LE

84 I/O

0 C

+ 85 C

400 kbit

1007 LAB

60

1.2000 V

Tray

M2S010

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

0 to 85 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S060T-1FGG484M
M2S060T-1FGG484M
Microchip Technology 数据表

2091 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

+ 125 C

1314 kbit

4710 LAB

60

SmartFusion2

微芯片技术

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-55 °C

1.2 V

40

1.14 V

125 °C

M2S060T-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56520 LE

267 I/O

- 55 C

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

23 mm

23 mm

M2S060TS-1FGG484M
M2S060TS-1FGG484M
Microchip Technology 数据表

600 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

+ 125 C

1314 kbit

4710 LAB

60

SmartFusion2

微芯片技术

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-55 °C

1.2 V

40

1.14 V

125 °C

M2S060TS-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56520 LE

267 I/O

- 55 C

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

23 mm

23 mm

ESP32-C3FH4
ESP32-C3FH4
Espressif Systems 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

QFN-32

RISC-V

Espressif Systems

325 mA

- 40 C

+ 105 C

400 kB

SRAM

GPIO, I2C, I2S, SPI, UART

160 MHz

SMD/SMT

5000

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

Details

150 Mbps

3 V

3.6 V

87 mA

-40°C ~ 105°C (TA)

切割胶带

ESP32

Bluetooth, Wi-Fi

3V ~ 3.6V

2.402GHz ~ 2.48GHz

2.4 GHz

4MB Flash, 400kB SRAM, 384kB ROM

Flash

4 MB

18 dBm

54Mbps

32 bit

-

802.11b/g/n, Bluetooth v5.0

21dBm

Bluetooth, WiFi

不包括天线

- 105 dBm

6 Channel

GPIO, I²C, I²S, SPI, JTAG, UART, USB

84mA ~ 87mA

276mA ~ 335mA

-

12 bit

0.85 mm

5 mm

5 mm