类别是'category.片上系统(SoC)' (7695)
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![]() | M2S010-FG484I | Microchip Technology | 数据表 | 109 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 活跃 | 微芯片技术 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | M2S010-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 60 | 233 | Tray | M2S010 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-FCSG325I | Microchip Technology | 数据表 | 150 In Stock | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | M2S025 | 微芯片技术 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 有 | M2S025T-FCSG325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | - | 180 | Tray | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | 现场可编程门阵列 | 592Kbit | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1FCSG325 | Microchip Technology | 数据表 | 2653 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | ARM Cortex M3 | 微芯片技术 | 180 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-FCS325 | Microchip Technology | 数据表 | 2345 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S025T-FCS325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | MSL 3 - 168 hours | 180 | Tray | M2S025 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | 现场可编程门阵列 | 592Kbit | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1FGG484 | Microchip Technology | 数据表 | 2039 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 4695 LAB | 60 | 267 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-FG676 | Microchip Technology | 数据表 | 2242 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | 676-FBGA (27x27) | ARM Cortex M3 | 微芯片技术 | 40 | SmartFusion2 | 387 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1FG484I | Microchip Technology | 数据表 | 2244 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S025 | 活跃 | 60 | This product may require additional documentation to export from the United States. | N | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-1FG484 | Microchip Technology | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | M2S090 | 活跃 | 微芯片技术 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090TS-1FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 267 | Tray | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-VF400I | Microchip Technology | 数据表 | 330 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S025-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 207 | Tray | M2S025 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-1FC1152I | Microchip Technology | 数据表 | 554 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | 微芯片技术 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 无 | M2S150TS-1FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 574 | Tray | M2S150 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-VFG256I | Microchip Technology | 数据表 | 359 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 138 | Tray | M2S010 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 119 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-VF256I | Microchip Technology | 数据表 | 2664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 138 | Tray | M2S025 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-FCSG325 | Microchip Technology | 数据表 | 3000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 1.26 V | 200 | Tray | 微芯片技术 | M2S050 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S050-FCSG325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 1.2000 V | 1.14 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1VFG256 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-256 | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 505 LAB | 119 | 161 | Tray | M2S005 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-FCSG325 | Microchip Technology | 数据表 | 191 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 180 | Tray | M2S025 | 微芯片技术 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S025-FCSG325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 1.2000 V | 1.26 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-1FGG484 | Microchip Technology | 数据表 | 108 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 6060 LE | 有 | 505 LAB | 60 | MSL 3 - 168 hours | 209 | Tray | M2S005 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1FG484 | Microchip Technology | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | 1.2000 V | 1.14 V | 1.26 V | 233 | 微芯片技术 | Tray | M2S010 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010-1FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FG676 | Microchip Technology | 数据表 | 2208 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | 活跃 | 微芯片技术 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S060T-1FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 40 | SmartFusion2 | 387 | Tray | M2S060 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FG484I | Microchip Technology | 数据表 | 2553 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 267 | Tray | M2S060 | 活跃 | SmartFusion2 | 60 | 4710 LAB | 有 | 56520 LE | 64 kB | - | - | 166 MHz | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-VFG256 | Microchip Technology | 数据表 | 2474 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | ARM Cortex M3 | 活跃 | 微芯片技术 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S025-VFG256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 1.2000 V | 138 | Tray | M2S025 | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-FG896 | Microchip Technology | 数据表 | 2657 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-896 | 896-FBGA (31x31) | ARM Cortex M3 | 微芯片技术 | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 377 I/O | 0 C | + 85 C | 1.314 Mbit | 64 kB | 有 | 4695 LAB | 27 | Tray | M2S050 | Obsolete | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010S-TQG144 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-144 | 144-TQFP (20x20) | ARM Cortex M3 | 微芯片技术 | 166 MHz | - | - | 64 kB | 12084 LE | 84 I/O | 0 C | + 85 C | 400 kbit | 1007 LAB | 60 | 1.2000 V | Tray | M2S010 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FGG484M | Microchip Technology | 数据表 | 2091 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | + 125 C | 1314 kbit | 4710 LAB | 60 | SmartFusion2 | 微芯片技术 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | M2S060T-1FGG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56520 LE | 267 I/O | - 55 C | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 有 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FGG484M | Microchip Technology | 数据表 | 600 In Stock | - | 最小起订量: 1 最小包装量: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | + 125 C | 1314 kbit | 4710 LAB | 60 | SmartFusion2 | 微芯片技术 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | M2S060TS-1FGG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56520 LE | 267 I/O | - 55 C | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 有 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | ESP32-C3FH4 | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-32 | RISC-V | Espressif Systems | 325 mA | - 40 C | + 105 C | 400 kB | SRAM | GPIO, I2C, I2S, SPI, UART | 160 MHz | 有 | SMD/SMT | 5000 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | Details | 150 Mbps | 3 V | 3.6 V | 87 mA | -40°C ~ 105°C (TA) | 切割胶带 | ESP32 | Bluetooth, Wi-Fi | 3V ~ 3.6V | 2.402GHz ~ 2.48GHz | 2.4 GHz | 4MB Flash, 400kB SRAM, 384kB ROM | Flash | 4 MB | 18 dBm | 54Mbps | 32 bit | - | 802.11b/g/n, Bluetooth v5.0 | 21dBm | Bluetooth, WiFi | 不包括天线 | - 105 dBm | 6 Channel | GPIO, I²C, I²S, SPI, JTAG, UART, USB | 84mA ~ 87mA | 276mA ~ 335mA | - | 12 bit | 0.85 mm | 5 mm | 5 mm |
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