类别是'category.片上系统(SoC)' (7695)

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厂商

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电压 - 供电

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MPFS025TL-FCSG325I
MPFS025TL-FCSG325I
Microchip Technology 数据表

21 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA

325-BGA (11x11)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

23000 LE

108 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB

MPFS025TS-1FCVG484I
MPFS025TS-1FCVG484I
Microchip Technology 数据表

27 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

-

23000 LE

108 I/O

- 40 C

+ 100 C

1

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

Tray

活跃

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB

MPFS025T-1FCVG484E
MPFS025T-1FCVG484E
Microchip Technology 数据表

60 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

Tray

活跃

SMD/SMT

This product may require additional documentation to export from the United States.

1

+ 100 C

0 C

108 I/O

23000 LE

-

4 x 32 kB

16 kB, 4 x 32 kB

667 MHz, 667 MHz

MSL 3 - 168 hours

0°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

1843.2Kbit

FPGA - 23K Logic Modules

5 Core

128KB

MPFS025T-FCSG325I
MPFS025T-FCSG325I
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

FCSG-325

325-BGA (11x11)

RV64GC, RV64IMAC

微芯片技术

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

23000 LE

108 I/O

0 C

+ 100 C

1

MSL 3 - 168 hours

Tray

活跃

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

1843.2Kbit

FPGA - 23K Logic Modules

5 Core

128KB

XQZU43DR-1FSQG1517I
XQZU43DR-1FSQG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-1517

ARM Cortex A53, ARM Cortex R5F

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

- 40 C

+ 100 C

13 Mb

53160 LAB

1

SMD/SMT

2 x 32 kB, 2 x 32 kB

850 mV

16 Transceiver

6 Core

BLUENRG-332AC
BLUENRG-332AC
STMicroelectronics 数据表

10000 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

32-VFQFN Exposed Pad

32-QFN (5x5)

STMicroelectronics

Bulk

BLUENRG

活跃

SMD/SMT

Details

3000

-40°C ~ 85°C (TA)

MouseReel

BlueNRG-LPS

TxRx + MCU

1.7V ~ 3.6V

2.4GHz ~ 2.48GHz

192kB Flash, 1kB OTP, 24kB RAM, 7kB ROM

Bluetooth v5.3

8dBm

Bluetooth

-104dBm

32Mbps

ADC, GPIO, I²C, I²S, JTAG, PCM, PWM, SPI, USART

3.4 mA

4.3mA

GFSK

20

XCZU6CG-2FFVC900I4895
XCZU6CG-2FFVC900I4895
Xilinx 数据表

1 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-900

ARM Cortex A53, ARM Cortex R5

6.9 Mbit

25.1 Mbit

26825.5 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 1.5 GHz

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

-

469446 LE

204 I/O

- 40 C

+ 100 C

XCZU6CG

0.85 V

-

16 Transceiver

4 Core

XCZU3EG-L1SFVC784I4560
XCZU3EG-L1SFVC784I4560
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-784

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

1.8 Mbit

7.6 Mbit

8820 LAB

Zynq UltraScale+

1

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

154350 LE

252 I/O

- 40 C

+ 100 C

XCZU3EG

720 mV/850 mV

-

7 Core

XCZU42DR-1FFVE1156E
XCZU42DR-1FFVE1156E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

1156-FCBGA (35x35)

ARM Cortex A53, ARM Cortex R5F

AMD 赛灵思

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

489300 LE

396 I/O

0 C

+ 100 C

6.8 Mb

27960 LAB

1

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

850 mV

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

8 Transceiver

Zynq®UltraScale+™ FPGA, 489K+ Logic Cells

6 Core

-

UC200TEMAA-N06-MN0AA
UC200TEMAA-N06-MN0AA
Quectel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

Module

- 35 C

Quectel

3.4 V

ADC, I2C, PCM, SDIO, UART, USB 2.0

Details

100

无线通信模块

0.370377 oz

Tray

UC200

Obsolete

-

32 mm x 29 mm x 2.4 mm

+ 75 C

4.5 V

-35°C ~ 75°C

Reel

UC200T

3.4V ~ 4.5V

900MHz, 1.8GHz

-

-

21Mbps

-

EDGE, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA

-

Cellular

不包括天线

-

ADC, I²C, PCM, SDIO, UART, USB

-

-

-

MPFS095TL-FCSG536I
MPFS095TL-FCSG536I
Microchip Technology 数据表

2037 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TS-FCVG484I
MPFS250TS-FCVG484I
Microchip Technology 数据表

2400 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS160TL-FCVG784I
MPFS160TL-FCVG784I
Microchip Technology 数据表

2589 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095T-1FCSG536I
MPFS095T-1FCSG536I
Microchip Technology 数据表

2515 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095TL-FCVG784I
MPFS095TL-FCVG784I
Microchip Technology 数据表

2610 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

XCZU5EV-1FBVB900E4524
XCZU5EV-1FBVB900E4524
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-900

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

256 kB

3.5 Mb

1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

+ 100 C

0 C

SMD/SMT

220 I/O

14640 LAB

256200 LE

850 mV

16 Transceiver

7 Core

XQZU43DR-L1FFQG1517I
XQZU43DR-L1FFQG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-1517

ARM Cortex A53, ARM Cortex R5F

1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

+ 100 C

- 40 C

SMD/SMT

53160 LAB

930300 LE

256 kB

13 Mb

850 mV

16 Transceiver

6 Core

XC7Z020-DWF5062
XC7Z020-DWF5062
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

ARM Cortex A9

667 MHz

SMD/SMT

6650 LAB

85000 LE

256 kB

728

32 kB

32 kB

2 Core

XCZU11EG-1FFVC1156I4524
XCZU11EG-1FFVC1156I4524
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

256 kB

9.1 Mb

1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

+ 100 C

- 40 C

SMD/SMT

380 I/O

37320 LAB

653100 LE

850 mV

48 Transceiver

7 Core

XCVP1202-1MSEVSVC2197-ES9919
XCVP1202-1MSEVSVC2197-ES9919
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0 C

This product may require additional documentation to export from the United States.

1

+ 100 C

800 mV

XCZU49DR-2FFVF1760I5208
XCZU49DR-2FFVF1760I5208
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1760

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

674 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

850 mV

16 Transceiver

6 Core

XAZU3EG-1SFVA625Q5159
XAZU3EG-1SFVA625Q5159
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-625

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

1

8820 LAB

1.8 Mb

+ 125 C

- 40 C

180 I/O

154350 LE

256 kB

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

SMD/SMT

850 mV

7 Core

XAZU2EG-1SFVA625Q5159
XAZU2EG-1SFVA625Q5159
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-625

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

SMD/SMT

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

103320 LE

180 I/O

- 40 C

+ 125 C

1.2 Mb

5904 LAB

1

850 mV

7 Core

XCZU28DR-L2FFVE1156I4982
XCZU28DR-L2FFVE1156I4982
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

394 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

720 mV

16 Transceiver

6 Core

XC7Z045-3FFG676E5212
XC7Z045-3FFG676E5212
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-676

ARM Cortex A9

SMD/SMT

866 MHz

32 kB

32 kB

256 kB

350000 LE

130 I/O

0 C

+ 100 C

27325 LAB

1

2 Core