N/A

-

YES

16

225 Ω

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

无

活跃

TOSHIBA CORP

TSSOP, TSSOP16,.25

8542.39.00.01

DUAL

鸥翼

3

0.635 mm

unknown

R-PDSO-G16

不合格

INDUSTRIAL

2

SINGLE-ENDED MULTIPLEXER

0.025 A

N/A

-

NO

14

-55 °C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

无

Transferred

GENERAL ELECTRIC SOLID STATE

DIP, DIP14,.3

125 °C

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

unknown

独立输出

R-XDIP-T14

不合格

MILITARY

SPST

38535Q/M;38534H;883B

MAKE-BEFORE-BREAK

300 ns

NO

N/A

-

1 MHz

70 °C

METAL

BCY

CAN(UNSPEC)

ROUND

CYLINDRICAL

15 V

无

Obsolete

ANALOG DEVICES INC

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

WIRE

1

unknown

不合格

18 V

COMMERCIAL

10 V

相机开发工具

6 mA

-15 V

-18 V

-10 V

10 V

-10 V

N/A

-

YES

24

ANALOG DEVICES INC

QFN

HVQCCN, LCC24,.16SQ,20

6 Ω

85 °C

-40 °C

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

有

Obsolete

e3

有

哑光锡

ALSO OPERATES WITH 5V NOMINAL SUPPLY

8542.39.00.01

QUAD

无铅

4

0.5 mm

compliant

24

S-XQCC-N24

不合格

3.3 V

INDUSTRIAL

2.7 V

2

SINGLE-ENDED MULTIPLEXER

1 mm

0.001 mA

60 dB

0.15 Ω

BREAK-BEFORE-MAKE

270 ns

260 ns

4 mm

4 mm

N/A

-

YES

16

SOIC

SSOP,

28 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3.3 V

有

Obsolete

PERICOM SEMICONDUCTOR CORP

EAR99

IT CAN ALSO OPERATE WITH 5 10% SUPPLY

8542.39.00.01

DUAL

鸥翼

未说明

1

0.635 mm

compliant

未说明

16

R-PDSO-G16

不合格

6 V

INDUSTRIAL

2 V

4

SPST

1.75 mm

55 dB

0.4 Ω

40 ns

20 ns

4.9 mm

3.9 mm

N/A

-

NO

14

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

32 V

无

Obsolete

MOTOROLA INC

3 MHz

70 °C

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-XDIP-T14

COMMERCIAL

相机开发工具

7 mA

-15 V

10 V

-10 V

N/A

-

YES

6

Obsolete

PERICOM SEMICONDUCTOR CORP

SOIC

TSSOP, TSOP6,.11,37

1

22 Ω

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.5 V

无

e0

EAR99

锡铅

8542.39.00.01

DUAL

鸥翼

1

0.65 mm

compliant

6

R-PDSO-G6

不合格

6 V

INDUSTRIAL

2 V

1

单刀双掷

1.1 mm

76 dB

0.3 Ω

BREAK-BEFORE-MAKE

30 ns

20 ns

2 mm

1.25 mm

N/A

-

N/A

-

YES

8

NEXPERIA

VSON,

1

195 Ω

125 °C

-40 °C

PLASTIC/EPOXY

VSON

LCC8,.06SQ,20

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

3.3 V

有

Obsolete

e4

镍钯金

8542.39.00.01

DUAL

无铅

260

1

0.5 mm

compliant

30

S-PDSO-N8

不合格

5.5 V

AUTOMOTIVE

1.65 V

2

SINGLE-ENDED MULTIPLEXER

0.5 mm

40 dB

12.9 ns

12.5 ns

1.6 mm

1.6 mm

N/A

-

YES

8

Transferred

NXP SEMICONDUCTORS

QFN

VSON, LCC8,.06SQ,20

1

195 Ω

125 °C

-40 °C

PLASTIC/EPOXY

VSON

LCC8,.06SQ,20

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

3.3 V

有

8542.39.00.01

DUAL

无铅

260

1

0.5 mm

compliant

30

8

S-PDSO-N8

不合格

5.5 V

AUTOMOTIVE

1.65 V

2

SINGLE-ENDED MULTIPLEXER

0.5 mm

0.04 mA

40 dB

12.9 ns

12.5 ns

1.6 mm

1.6 mm

N/A

-

YES

16

PERICOM SEMICONDUCTOR CORP

SOIC

SOP, SOP16,.4

10 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

小概要

5 V

无

Obsolete

e0

EAR99

锡铅

8542.39.00.01

DUAL

鸥翼

4

1.27 mm

compliant

16

R-PDSO-G16

不合格

5.25 V

INDUSTRIAL

4.75 V

2

VIDEO MULTIPLEXER

2.65 mm

2.5 mA

38 dB

5 ns

5 ns

0.026 A

10.3 mm

7.5 mm

N/A

-

NO

14

DIP, DIP14,.3

50 Ω

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP14,.3

RECTANGULAR

IN-LINE

15 V

无

Obsolete

HARRIS SEMICONDUCTOR

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-GDIP-T14

不合格

MILITARY

1

单刀双掷

1 mA

-15 V

40 dB

BREAK-BEFORE-MAKE

300 ns

250 ns

N/A

-

NO

14

125 °C

-55 °C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

15 V

Transferred

INTERSIL CORP

DIP, DIP14,.3

75 Ω

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

R-XDIP-T14

不合格

MILITARY

单刀双掷

-15 V

38535Q/M;38534H;883B

BREAK-BEFORE-MAKE

500 ns

N/A

-

NO

14

125 °C

-55 °C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

15 V

活跃

RENESAS ELECTRONICS CORP

DIP, DIP14,.3

75 Ω

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

R-XDIP-T14

不合格

MILITARY

单刀双掷

-15 V

38535Q/M;38534H;883B

BREAK-BEFORE-MAKE

500 ns

N/A

-

NO

24

70 °C

-20 °C

PLASTIC/EPOXY

SDIP

SDIP24,.3

RECTANGULAR

IN-LINE, SHRINK PITCH

9 V

Obsolete

TOSHIBA CORP

DIP

SDIP,

8542.39.00.01

DUAL

THROUGH-HOLE

1

1.778 mm

unknown

24

R-PDIP-T24

不合格

COMMERCIAL

2

AUDIO/VIDEO SWITCH

4.5 mm

42 mA

22 mm

7.62 mm

N/A

-

NO

16

Obsolete

MAXIM INTEGRATED PRODUCTS INC

DIP

DIP, DIP16,.3

1

35 Ω

85 °C

-40 °C

CERAMIC, GLASS-SEALED

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

无

e0

无

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

not_compliant

独立输出

16

R-GDIP-T16

不合格

18 V

INDUSTRIAL

3 V

1

单刀双掷

5.08 mm

-5 V

72 dB

-18 V

0.5 Ω

BREAK-BEFORE-MAKE

175 ns

100 ns

-3 V

7.62 mm

N/A

-

NO

16

DIP, DIP16,.3

350 Ω

85 °C

-25 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

15 V

无

Obsolete

NATIONAL SEMICONDUCTOR CORP

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

4

2.54 mm

unknown

独立输出

R-PDIP-T16

不合格

OTHER

SPST

-15 V

BREAK-BEFORE-MAKE

NC

N/A

-

YES

16

15 Ω

70 °C

PLASTIC/EPOXY

SSOP

SSOP16,.25

RECTANGULAR

小概要

5 V

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QSOP-16

e0

锡铅

8542.39.00.01

DUAL

鸥翼

1

0.635 mm

not_compliant

R-PDSO-G16

不合格

COMMERCIAL

4

SPST

45 dB

2 Ω

BREAK-BEFORE-MAKE

6.5 ns

6 ns

NC

N/A

-

YES

16

PERICOM SEMICONDUCTOR CORP

SOIC

SOP, SOP16,.25

10 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

小概要

5 V

无

Obsolete

e0

EAR99

锡铅

8542.39.00.01

DUAL

鸥翼

4

1.27 mm

compliant

16

R-PDSO-G16

不合格

5.25 V

INDUSTRIAL

4.75 V

1

AUDIO/VIDEO SWITCH

1.75 mm

38 dB

BREAK-BEFORE-MAKE

5 ns

5 ns

NC

9.9 mm

3.9 mm

N/A

-

YES

16

Transferred

NXP SEMICONDUCTORS

QFN

HVQCCN, LCC16,.1X.14,20

1

180 Ω

125 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

LCC16,.1X.14,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

有

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

QUAD

无铅

260

3

0.5 mm

compliant

30

16

R-PQCC-N16

不合格

5.5 V

AUTOMOTIVE

4.5 V

1

单刀双掷

1 mm

0.16 mA

-5 V

50 dB

9 Ω

BREAK-BEFORE-MAKE

48 ns

44 ns

0.025 A

3.5 mm

2.5 mm

N/A

-

YES

16

108 Ω

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

无

Obsolete

TOSHIBA CORP

TSSOP, TSSOP16,.25

8542.39.00.01

DUAL

鸥翼

3

0.635 mm

unknown

R-PDSO-G16

不合格

INDUSTRIAL

2

SINGLE-ENDED MULTIPLEXER

0.08 mA

N/A

-

YES

5

Obsolete

PERICOM SEMICONDUCTOR CORP

SOIC

LSSOP, TSOP5/6,.11,37

1

18 Ω

85 °C

-40 °C

PLASTIC/EPOXY

LSSOP

TSOP5/6,.11,37

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

3.3 V

有

e3

EAR99

哑光锡

CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY

8542.39.00.01

DUAL

鸥翼

1

0.95 mm

compliant

5

R-PDSO-G5

不合格

6 V

INDUSTRIAL

2 V

1

SPST

1.45 mm

1 Ω

BREAK-BEFORE-MAKE

40 ns

20 ns

NC

2.9 mm

1.6 mm

N/A

-

YES

1156

5

85 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

1.2 V

有

活跃

M/A-COM TECHNOLOGY SOLUTIONS INC

BGA-1156

e1

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

245

1

1 mm

compliant

40

S-PBGA-B1156

不合格

1.26 V

OTHER

1.14 V

72

交叉点开关

3.16 mm

35 mm

35 mm

N/A

-

NO

16

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

15 V

无

Obsolete

ANALOG DEVICES INC

85 °C

-25 °C

e0

无

EAR99

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

4

2.54 mm

unknown

独立输出

R-XDIP-T16

不合格

OTHER

-15 V

BREAK-BEFORE-MAKE

NC

N/A

-

NO

16

-55 °C

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

无

Obsolete

INTERSIL CORP

500 Ω

125 °C

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-XDIP-T16

不合格

MILITARY

8

SINGLE-ENDED MULTIPLEXER

1 mA

MIL-STD-883 Class B (Modified)

BREAK-BEFORE-MAKE

1000 ns