N/A

-

NO

14

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

70 °C

PLASTIC/EPOXY

DIP

DIP14,.3

RECTANGULAR

IN-LINE

5 V

无

Obsolete

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

unknown

R-PDIP-T14

不合格

COMMERCIAL

J-K FLIP-FLOP

0.008 A

MASTER-SLAVE

8 mA

30000000 Hz

N/A

-

YES

14

Transferred

飞利浦半导体

DFP, FL14,.3

125 °C

-55 °C

CERAMIC

DFP

FL14,.3

RECTANGULAR

FLATPACK

5 V

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

FLAT

2

1.27 mm

unknown

R-XDFP-F14

不合格

MILITARY

J-K FLIP-FLOP

0.016 A

MIL-STD-883 Class B (Modified)

MASTER-SLAVE

40 mA

15000000 Hz

N/A

-

N/A

-

NO

16

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

4.5 V

Obsolete

MAGNACHIP SEMICONDUCTOR LTD

DIP,

8542.39.00.01

DUAL

THROUGH-HOLE

1

unknown

R-PDIP-T16

6 V

INDUSTRIAL

2 V

6

HC/UH

TRUE

D FLIP-FLOP

积极优势

200 ns

30 MHz

N/A

-

N/A

-

NO

16

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP16,.3

85 °C

-30 °C

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

无

Obsolete

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

2

2.54 mm

unknown

R-XDIP-T16

不合格

OTHER

1

D 拉锁

2.8 ns

55 mA

N/A

-

YES

8

无

Obsolete

PERICOM SEMICONDUCTOR CORP

SOIC

VSSOP, TSSOP8,.12,20

85 °C

-40 °C

PLASTIC/EPOXY

VSSOP

TSSOP8,.12,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

1.8 V

e0

EAR99

锡铅

8542.39.00.01

TR

DUAL

鸥翼

1

0.5 mm

compliant

8

R-PDSO-G8

不合格

5.5 V

INDUSTRIAL

1.65 V

1

STX

0.9 mm

COMPLEMENTARY

D FLIP-FLOP

0.024 A

7 ns

积极优势

13 ns

250 MHz

175000000 Hz

2.3 mm

2 mm

N/A

-

Obsolete

TOSHIBA CORP

,

8542.39.00.01

unknown

N/A

-

NO

16

Obsolete

MITSUBISHI ELECTRIC CORP

DIP, DIP16,.3

70 °C

-20 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

4

2.54 mm

unknown

R-PDIP-T16

不合格

COMMERCIAL

3-STATE

D FLIP-FLOP

0.024 A

积极优势

30 mA

30000000 Hz

N/A

-

YES

20

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

SOP, SOP20,.4

50 pF

5 V

小概要

RECTANGULAR

SOP20,.4

SOP

PLASTIC/EPOXY

-40 °C

85 °C

1

e0

无

Tin/Lead (Sn85Pb15)

8542.39.00.01

TR

DUAL

鸥翼

225

1

1.27 mm

not_compliant

20

R-PDSO-G20

不合格

INDUSTRIAL

8

3-STATE

D 拉锁

0.048 A

5.2 ns

N/A

-

YES

16

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DFP

RECTANGULAR

FLATPACK

5 V

Obsolete

NATIONAL SEMICONDUCTOR CORP

DFP,

8542.39.00.01

DUAL

FLAT

6

1.27 mm

unknown

R-GDFP-F16

不合格

5.5 V

MILITARY

4.5 V

1

ACT

2.032 mm

TRUE

D FLIP-FLOP

积极优势

13 ns

90 MHz

9.6645 mm

6.604 mm

N/A

-

YES

96

有

Obsolete

PERICOM SEMICONDUCTOR CORP

BGA

LFBGA, BGA96,6X16,32

3

70 °C

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 V

e1

有

EAR99

锡银铜

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

8542.39.00.01

BOTTOM

BALL

260

1

0.8 mm

compliant

30

96

R-PBGA-B96

不合格

1.9 V

COMMERCIAL

1.7 V

25

SSTU

1.4 mm

TRUE

D FLIP-FLOP

2.35 ns

270 MHz

13.5 mm

5.5 mm

N/A

-

NO

20

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

5 V

接触制造商

ROCHESTER ELECTRONICS LLC

50 pF

8542.39.00.01

DUAL

THROUGH-HOLE

1

unknown

R-CDIP-T20

5.5 V

4.5 V

8

LS

TRUE

D FLIP-FLOP

0.008 A

37 ns

积极优势

37 ns

27 mA

20 MHz

20000000 Hz

N/A

-

YES

20

无

Obsolete

MOTOROLA INC

SOP, SOP20,.4

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

小概要

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

鸥翼

8

1.27 mm

unknown

R-PDSO-G20

不合格

INDUSTRIAL

3-STATE

D FLIP-FLOP

0.024 A

积极优势

70000000 Hz

N/A

-

YES

20

活跃

TOSHIBA CORP

SSOP

VSSOP,

85 °C

-40 °C

PLASTIC/EPOXY

VSSOP

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

2.3 V

有

8542.39.00.01

DUAL

鸥翼

未说明

1

0.5 mm

unknown

未说明

20

R-PDSO-G20

不合格

5.5 V

INDUSTRIAL

1.8 V

8

AHC/VHC/H/U/V

3-STATE

1 mm

TRUE

D FLIP-FLOP

积极优势

23 ns

110 MHz

3 mm

N/A

-

YES

14

有

Obsolete

RENESAS ELECTRONICS CORP

SOIC

SOP,

1

85 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

4.5 V

有

8542.39.00.01

DUAL

鸥翼

2

1.27 mm

unknown

14

R-PDSO-G14

不合格

6 V

INDUSTRIAL

2 V

2

HC/UH

2.2 mm

TRUE

D 拉锁

高级

130 ns

10.06 mm

5.5 mm

N/A

-

YES

96

有

Obsolete

NXP SEMICONDUCTORS

BGA

LFBGA, BGA96,6X16,32

SOT536-1

85 °C

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 V

8542.39.00.01

BOTTOM

BALL

1

0.8 mm

unknown

96

R-PBGA-B96

不合格

2 V

OTHER

1.7 V

25

32866

OPEN-DRAIN

1.5 mm

COMPLEMENTARY

D FLIP-FLOP

积极优势

1.5 ns

450 MHz

13.5 mm

5.5 mm

N/A

-

NO

16

SGS-ATES COMPONENTI ELECTRONICI S P A

DIP-16

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

无

Obsolete

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

6

2.54 mm

unknown

R-PDIP-T16

不合格

COMMERCIAL

5.1 mm

D FLIP-FLOP

积极优势

20 mm

7.62 mm

N/A

-

YES

8

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP8,.16

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.3 V

SOT-505, 8 PIN

TOSHIBA CORP

活跃

50 pF

8542.39.00.01

DUAL

鸥翼

未说明

1

0.65 mm

unknown

未说明

R-PDSO-G8

5.5 V

1.65 V

1

LVC/LCX/Z

1.2 mm

COMPLEMENTARY

D FLIP-FLOP

0.032 A

7 ns

积极优势

23 ns

50 mA

180 MHz

150000000 Hz

2.9 mm

2.8 mm

N/A

-

表面贴装

20-TFSOP (0.118", 3.00mm Width)

20-VSSOP

德州仪器

-40°C ~ 125°C (TA)

Tape & Reel (TR)

74HC

活跃

2V ~ 6V

Tri-State, Non-Inverted

8:8

7.8mA, 7.8mA

D-Type Transparent Latch

1

9.6ns

N/A

-

YES

5

SON

HVSON,

125 °C

-40 °C

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.1 V

Transferred

NXP SEMICONDUCTORS

8542.39.00.01

DUAL

无铅

1

0.48 mm

unknown

5

S-PDSO-N5

3.6 V

AUTOMOTIVE

0.8 V

1

AUP/ULP/V

0.35 mm

INVERTED

D FLIP-FLOP

积极优势

27.2 ns

510 MHz

0.8 mm

0.8 mm

N/A

-

NO

16

活跃

TOSHIBA CORP

DIP, DIP16,.3

15 pF

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T16

不合格

INDUSTRIAL

4

HC/UH

COMPLEMENTARY

D 拉锁

0.0014 A

65 ns

N/A

-

YES

20

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

QCCN, LCC20,.35SQ

125 °C

-55 °C

CERAMIC

QCCN

LCC20,.35SQ

SQUARE

CHIP CARRIER

5 V

无

e0

Tin/Lead (Sn/Pb)

QUAD

无铅

2

1.27 mm

unknown

S-XQCC-N20

不合格

5 V

MILITARY

J-K FLIP-FLOP

38535Q/M;38534H;883B

积极优势

N/A

-

YES

20

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

QCCN, LCC20,.35SQ

125 °C

-55 °C

CERAMIC

QCCN

LCC20,.35SQ

SQUARE

CHIP CARRIER

5 V

无

e0

Tin/Lead (Sn/Pb)

QUAD

无铅

8

1.27 mm

unknown

S-XQCC-N20

不合格

5 V

MILITARY

3-STATE

D FLIP-FLOP

0.02 A

38535Q/M;38534H;883B

积极优势

86 mA

60000000 Hz

N/A

-

NO

16

Obsolete

MOTOROLA INC

DIP

DIP, DIP16,.3

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP16,.3

RECTANGULAR

IN-LINE

无

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

16

R-GDIP-T16

不合格

MILITARY

6

10H

OPEN-EMITTER

5.08 mm

TRUE

D FLIP-FLOP

38535Q/M;38534H;883B

积极优势

3 ns

123 mA

250 MHz

250000000 Hz

19.495 mm

7.62 mm