类别是'category.闩锁' (4410)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

材料

Housing material

终端数量

Body diameter

Capacitors series

Case - inch

Case - mm

Colour

Data transmission speed

Design features

Gross weight

Heatsink shape

Heatsinks features

Kind of capacitor

Material finishing

Maximum working voltage

Mounting hole size

Noal resistance

Plate thickness

Transport package size/quantity

Transport packaging size/quantity

Type of capacitor

Type of heatsink

Wall thickness before shrinking

Working temperature range

Operating temperature

容差

JESD-609代码

无铅代码

ECCN 代码

Connector type

类型

端子表面处理

颜色

附加功能

HTS代码

电容量

包装方式

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

深度

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

Number of contacts

电介质

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

比特数

家人

输出特性

座位高度-最大

Operating temperature range

输出极性

逻辑IC类型

最大 I(ol)

Prop. Delay@Nom-Sup

筛选水平

触发器类型

传播延迟(tpd)

电源电流-最大值(ICC)

Cable diameter

Shrink temperature

Tensile strength

fmax-Min

最大频率@Nom-Sup

第二个连接器加载的位置数

Connection type

饱和电流

Operating voltage

Housing diameter

高度

长度

宽度

器件厚度

TC7WG74FK(TE85L,F)
TC7WG74FK(TE85L,F)
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

Obsolete

TOSHIBA CORP

TSSOP, TSSOP8,.12,20

30 pF

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP8,.12,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8542.39.00.01

TR

DUAL

鸥翼

1

0.5 mm

unknown

R-PDSO-G8

不合格

INDUSTRIAL

D FLIP-FLOP

0.003 A

积极优势

11000000 Hz

T74LS273B1
T74LS273B1
SGS Thomson 数据表

N/A

-

最小起订量: 1

最小包装量: 1

HD74ACT112FP
HD74ACT112FP
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

RENESAS ELECTRONICS CORP

SOIC

SOP, SOP16,.3

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.3

RECTANGULAR

小概要

5 V

Obsolete

8542.39.00.01

DUAL

鸥翼

2

1.27 mm

compliant

16

R-PDSO-G16

不合格

5.5 V

INDUSTRIAL

4.5 V

2

ACT

2.2 mm

COMPLEMENTARY

J-K FLIP-FLOP

NEGATIVE EDGE

14 ns

80 MHz

80000000 Hz

10.06 mm

5.5 mm

SN74LS174MEL
SN74LS174MEL
onsemi 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

Obsolete

ON SEMICONDUCTOR

SOIC

SOP,

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

1

1.27 mm

unknown

16

R-PDSO-G16

不合格

5.25 V

COMMERCIAL

4.75 V

6

LS

2.05 mm

TRUE

D FLIP-FLOP

积极优势

30 ns

30 MHz

10.2 mm

5.275 mm

HD74S74
HD74S74
Hitachi Ltd 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

14

Obsolete

HITACHI LTD

DIP, DIP14,.3

70 °C

-20 °C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

unknown

R-XDIP-T14

不合格

COMMERCIAL

D FLIP-FLOP

积极优势

CD74FCT564E
CD74FCT564E
Thomson Consumer Electronics 数据表

N/A

-

最小起订量: 1

最小包装量: 1

,

Obsolete

THOMSON CONSUMER ELECTRONICS

8542.39.00.01

unknown

TC74VHC9273FK
TC74VHC9273FK
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

活跃

TOSHIBA CORP

SSOP

TSSOP,

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

8542.39.00.01

DUAL

鸥翼

未说明

1

0.65 mm

unknown

未说明

20

R-PDSO-G20

不合格

5.5 V

INDUSTRIAL

2 V

8

AHC/VHC/H/U/V

1.2 mm

TRUE

D FLIP-FLOP

积极优势

25.5 ns

50 MHz

6.9 mm

4.4 mm

IDT74LVC377ASO
IDT74LVC377ASO
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

SOIC

SOP, SOP20,.4

50 pF

1

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

小概要

3.3 V

e0

锡铅

带保持模式

8542.39.00.01

DUAL

鸥翼

225

1

1.27 mm

not_compliant

20

20

R-PDSO-G20

不合格

3.6 V

INDUSTRIAL

2.7 V

8

LVC/LCX/Z

3-STATE

2.65 mm

TRUE

D FLIP-FLOP

0.024 A

积极优势

9.5 ns

151000000 Hz

12.8 mm

7.5 mm

54LS11
54LS11
Motorola Semiconductor Products 数据表

N/A

-

最小起订量: 1

最小包装量: 1

54LS11
54LS11
Texas Instruments 数据表

N/A

-

最小起订量: 1

最小包装量: 1

54LS279
54LS279
Texas Instruments 数据表

N/A

-

最小起订量: 1

最小包装量: 1

54LS279
54LS279
National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TC74LVX174FT
TC74LVX174FT
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

生命周期结束

TOSHIBA CORP

TSSOP

TSSOP, TSSOP16,.25

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

unknown

30

16

R-PDSO-G16

不合格

3.6 V

INDUSTRIAL

2 V

6

LV/LV-A/LVX/H

1.2 mm

TRUE

D FLIP-FLOP

0.004 A

14.5 ns

积极优势

21 ns

95 MHz

55000000 Hz

5 mm

4.4 mm

SN74LS174
SN74LS174
Motorola Semiconductor Products 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SN74LS259ND
SN74LS259ND
Motorola Semiconductor Products 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

Obsolete

MOTOROLA INC

DIP, DIP16,.3

15 pF

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

e0

锡铅

1:8 DMUX FOLLOWED BY LATCH

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T16

不合格

5.25 V

COMMERCIAL

4.75 V

1

LS

4.44 mm

TRUE

D 拉锁

0.008 A

38 ns

低电平

24 ns

36 mA

19.175 mm

7.62 mm

SN74LS259ND
SN74LS259ND
Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP16,.3

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T16

5 V

COMMERCIAL

8

D 拉锁

0.008 A

38 ns

36 mA

CD4013B
CD4013B
Harris Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

CD4013B
CD4013B
Fairchild Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SN74HC109J
SN74HC109J
Texas Instruments 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP16,.3

50 pF

85 °C

-40 °C

CERAMIC, GLASS-SEALED

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

8542.39.00.01

DUAL

THROUGH-HOLE

未说明

2

2.54 mm

not_compliant

未说明

R-GDIP-T16

不合格

6 V

INDUSTRIAL

2 V

2

HC/UH

5.08 mm

COMPLEMENTARY

J-KBAR FLIP-FLOP

0.004 A

44 ns

积极优势

220 ns

0.04 mA

29 MHz

25000000 Hz

19.56 mm

7.62 mm

SN74HC109J
SN74HC109J
Rochester Electronics LLC 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

ROCHESTER ELECTRONICS LLC

,

50 pF

85 °C

-40 °C

CERAMIC, GLASS-SEALED

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

活跃

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

unknown

R-GDIP-T16

6 V

2 V

2

HC/UH

5.08 mm

COMPLEMENTARY

J-KBAR FLIP-FLOP

0.004 A

44 ns

积极优势

220 ns

0.04 mA

29 MHz

25000000 Hz

19.56 mm

7.62 mm

54F373M/B2CJC
54F373M/B2CJC
Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

QCCN, LCC20,.35SQ

125 °C

-55 °C

CERAMIC

QCCN

LCC20,.35SQ

SQUARE

CHIP CARRIER

5 V

e0

Tin/Lead (Sn/Pb)

QUAD

无铅

1

1.27 mm

unknown

S-XQCC-N20

不合格

5 V

MILITARY

8

3-STATE

D 拉锁

38535Q/M;38534H;883B

74LVC1G175GN
74LVC1G175GN
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

6

Transferred

NXP SEMICONDUCTORS

SON

0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6

1

125 °C

-40 °C

PLASTIC/EPOXY

SON

RECTANGULAR

小概要

1.8 V

e3

Tin (Sn)

8542.39.00.01

DUAL

无铅

未说明

1

0.3 mm

unknown

未说明

6

R-PDSO-N6

不合格

5.5 V

AUTOMOTIVE

1.65 V

1

LVC/LCX/Z

0.35 mm

TRUE

D FLIP-FLOP

积极优势

17 ns

200 MHz

1 mm

0.9 mm

74HC74D
74HC74D
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

aluminium

Nylon PA66

14

IP68

aluminium

10BASE-T,100 BASE-T, 1000 BASE-T

with 2 sealing caps

700 g

grilled

hollow fin geometry

6

M25x1.5

raw

Transferred

NXP SEMICONDUCTORS

25 mm

SOIC

3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14

50 pF

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

小概要

20mm

5 V

for back plate

48*32*27/300

extruded

e4

EAR99

RJ45 8P8C FTP waterproof

Nickel/Palladium/Gold (Ni/Pd/Au)

black

8542.39.00.01

TUBE

DUAL

鸥翼

260

2

1.27 mm

unknown

30

14

R-PDSO-G14

不合格

8

6 V

AUTOMOTIVE

2 V

1

HC/UH

1.75 mm

-40...+120 °C

COMPLEMENTARY

D FLIP-FLOP

0.004 A

积极优势

265 ns

3 - 8 mm

24 MHz

20000000 Hz

for fan motors

socket - socket (cable - block)

1

30 mm

23mm

0.3m

70mm

MM74HC175N
MM74HC175N
Texas Instruments 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

Polyolefin

16

KGM

1210

3225

162.00

Transferred

MLCC

NATIONAL SEMICONDUCTOR CORP

DIP, DIP16,.3

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

4.5 V

SMD

43*18*30/100

ceramic

1 mm

-55...+105 °C

-55...125°C

±10%

e0

Heat shrink tape with adhesive layer

Tin/Lead (Sn/Pb)

Black

8542.39.00.01

1nF

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T16

不合格

X7R

6 V

INDUSTRIAL

2 V

4

HC/UH

5.08 mm

COMPLEMENTARY

D FLIP-FLOP

0.004 A

积极优势

190 ns

100 °C

10 MPa

28 MHz

24000000 Hz

≤10000 V

5000 mm

25 mm

HD74LS112P
HD74LS112P
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

18 mm

1.34

Obsolete

RENESAS ELECTRONICS CORP

DIP

AC50 / DC12 V

DIP, DIP16,.3

75 °C

10min

-20 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

1 A

B103

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

2 mm

compliant

16

R-PDIP-T16

不合格

5

5.25 V

商业扩展

4.75 V

2

LS

5.06 mm

COMPLEMENTARY

J-K FLIP-FLOP

0.008 A

NEGATIVE EDGE

30 ns

8 mA

30 MHz

30000000 Hz

1

19.2 mm

7.62 mm

2 mm