类别是'category.内存模块' (5401)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | ES29LV160ET-70TG | Excel (Suzhou) Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 70 ns | 3 | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 有 | Obsolete | EXCEL SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 0.5 mm | unknown | R-PDSO-G48 | 不合格 | COMMERCIAL | 0.03 mA | 1MX16 | 16 | 0.00001 A | 16777216 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | TOP | YES | |||||||||||||||||||||||||||
![]() | ES29LV400DT-70WGI | Excel (Suzhou) Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | FBGA, BGA48,6X8,32 | 70 ns | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 有 | Obsolete | EXCEL SEMICONDUCTOR INC | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 260 | 0.8 mm | unknown | R-PBGA-B48 | 不合格 | INDUSTRIAL | 0.03 mA | 256KX16 | 16 | 0.00001 A | 4194304 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | ||||||||||||||||||||||||||
![]() | XC17256D-SO8C | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 200 ns | 12 MHz | 3 | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 无 | Obsolete | XILINX INC | e0 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | 鸥翼 | 225 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G8 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.01 mA | 256KX8 | 3-STATE | 8 | 0.00005 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | |||||||||||||||||||||||||||
![]() | PM25LQ040-EWE | Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | VSOP | TSOP8,.25 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | 活跃 | INTEGRATED SILICON SOLUTION INC | VSOP, TSOP8,.25 | 104 MHz | 524288 words | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G8 | 不合格 | 3.6 V | AUTOMOTIVE | 2.3 V | SYNCHRONOUS | 0.012 mA | 512KX8 | 0.9 mm | 8 | 0.00003 A | 4194304 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||
![]() | MX26LV800BTC-70 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | TSOP1 | TSOP1, TSSOP48,.8,20 | 70 ns | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 无 | Obsolete | MACRONIX INTERNATIONAL CO LTD | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.0001 A | 8388608 bit | PARALLEL | FLASH | 3 V | 2000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||
![]() | N82HS321CF | YAGEO Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | 5 V | Obsolete | 飞利浦组件 | , | 25 ns | 4096 words | 4000 | 75 °C | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-GDIP-T24 | 不合格 | 5.25 V | 商业扩展 | 4.75 V | ASYNCHRONOUS | 4KX8 | 3-STATE | 8 | 32768 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||||||||
![]() | MSM27C231ZB-NTS-K | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 150 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 无 | Transferred | LAPIS SEMICONDUCTOR CO LTD | TSSOP, TSSOP32,.56,20 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | 鸥翼 | 0.5 mm | unknown | R-PDSO-G32 | 不合格 | COMMERCIAL | 0.02 mA | 256KX8 | 3-STATE | 8 | 0.00001 A | 2097152 bit | COMMON | ||||||||||||||||||||||||||||||||||||
![]() | K9F1G16D0M-YCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 30 ns | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 2.7 V | 无 | Obsolete | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | compliant | R-PDSO-G48 | 不合格 | COMMERCIAL | 0.02 mA | 64MX16 | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 64K | 1K words | YES | |||||||||||||||||||||||||||||
![]() | MX29F040CQI-55G | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | MACRONIX INTERNATIONAL CO LTD | LCC | QCCJ, LDCC32,.5X.6 | 55 ns | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 5 V | 有 | Obsolete | EAR99 | NOR型号 | 8542.32.00.51 | QUAD | J BEND | 未说明 | 1 | 1.27 mm | unknown | 未说明 | 32 | R-PQCC-J32 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3.55 mm | 8 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 8 | 64K | 14.05 mm | 11.43 mm | ||||||||||||||||||
![]() | GD25Q128BZIG | ELM Technology Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ELM TECHNOLOGY CORP | 接触制造商 | EAR99 | 8542.32.00.51 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL064M90FAIR4 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | CYPRESS SEMICONDUCTOR CORP | FBGA-64 | 90 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3.3 V | 无 | Transferred | e0 | EAR99 | NOR型号 | 锡铅 | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 13 mm | 11 mm | |||||||||||||
![]() | ES29LV800DT-70TC | Excel (Suzhou) Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 70 ns | 3 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 无 | Obsolete | EXCEL SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 240 | 0.5 mm | unknown | R-PDSO-G48 | 不合格 | COMMERCIAL | 0.03 mA | 512KX16 | 16 | 0.00001 A | 8388608 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | |||||||||||||||||||||||||
![]() | 82S185A/BVA | YAGEO Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | IN-LINE | 5 V | Obsolete | 飞利浦组件 | , | 55 ns | 2048 words | 2000 | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T18 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2KX4 | 3-STATE | 4 | 8192 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||
![]() | 82S185A/BVA | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | 55 ns | 5 V | IN-LINE | RECTANGULAR | DIP | CERAMIC, GLASS-SEALED | -55 °C | 125 °C | 2000 | 2048 words | Obsolete | NXP SEMICONDUCTORS | DIP | DIP, | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-GDIP-T18 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2KX4 | 3-STATE | 5.08 mm | 4 | 8192 bit | PARALLEL | OTP ROM | 7.62 mm | ||||||||||||||||||||||||||||||||
![]() | MX27L256QC-20 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | LCC | QCCJ, LDCC32,.5X.6 | 200 ns | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 3 V | 无 | Obsolete | MACRONIX INTERNATIONAL CO LTD | e0 | EAR99 | 锡铅 | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.01 mA | 32KX8 | 3-STATE | 3.55 mm | 8 | 0.00001 A | 262144 bit | PARALLEL | COMMON | OTP ROM | 12.75 V | 14.05 mm | 11.43 mm | ||||||||||||||||||||||||
![]() | MZ-V9P2T0GW | Samsung Electronics Co. Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL064M11FAIS10 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST45VF010-10-4C-SA | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOIC | 4.90 X 6 MM, SOIC-8 | 10 MHz | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3 V | 无 | Obsolete | SILICON STORAGE TECHNOLOGY INC | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.03 mA | 1MX1 | 1.75 mm | 1 | 0.000015 A | 1048576 bit | SERIAL | FLASH | 2.7 V | SPI | 10000 Write/Erase Cycles | 100 | HARDWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||
![]() | S29GL512N11FAI020 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | Obsolete | SPANSION INC | BGA | 13 X 11 MM, FBGA-64 | 110 ns | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3 V | 无 | e0 | 无 | 3A991.B.1.A | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.4 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | ||||||||||||
![]() | S29GL512N11FAI020 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 110 ns | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | 网格排列 | 无 | Transferred | ADVANCED MICRO DEVICES INC | BGA, BGA64,8X8,40 | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | 不合格 | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||
![]() | AM29SL800DT90WAF | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | Obsolete | SPANSION INC | BGA | 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | 90 ns | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | e1 | EAR99 | NOR型号 | 锡银铜 | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | 不合格 | 2.2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 1.8 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 8.15 mm | 6.15 mm | |||||||||||
![]() | AM29F200BB-55SC | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | SOIC | SOP, SOP44,.63 | 55 ns | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | 小概要 | 5 V | 无 | Transferred | ADVANCED MICRO DEVICES INC | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | MINIMUM 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | ||||||||||||||
![]() | AM29F200BB-55SC | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | SPANSION INC | SOIC | SOP, SOP44,.63 | 55 ns | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | 小概要 | 5 V | 无 | Obsolete | e0 | 无 | EAR99 | NOR型号 | 锡铅 | MIN 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | |||||||||||
![]() | X-7656-21407 | TE Connectivity | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | K9F3208U0B-TCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | 4194304 words | 4000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | Obsolete | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, | 35 ns | EAR99 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G40 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 4MX8 | 1.2 mm | 8 | 33554432 bit | PARALLEL | FLASH | 2.7 V | 18.41 mm | 10.16 mm |
ES29LV160ET-70TG
Excel (Suzhou) Semiconductor Co Ltd
分类:Memory - Modules
ES29LV400DT-70WGI
Excel (Suzhou) Semiconductor Co Ltd
分类:Memory - Modules
XC17256D-SO8C
AMD Xilinx
分类:Memory - Modules
PM25LQ040-EWE
Integrated Silicon Solution Inc
分类:Memory - Modules
MX26LV800BTC-70
Macronix International Co Ltd
分类:Memory - Modules
N82HS321CF
YAGEO Corporation
分类:Memory - Modules
MSM27C231ZB-NTS-K
LAPIS Semiconductor Co Ltd
分类:Memory - Modules
K9F1G16D0M-YCB0
Samsung Semiconductor
分类:Memory - Modules
MX29F040CQI-55G
Macronix International Co Ltd
分类:Memory - Modules
GD25Q128BZIG
ELM Technology Corp
分类:Memory - Modules
S29GL064M90FAIR4
Cypress Semiconductor
分类:Memory - Modules
ES29LV800DT-70TC
Excel (Suzhou) Semiconductor Co Ltd
分类:Memory - Modules
82S185A/BVA
YAGEO Corporation
分类:Memory - Modules
82S185A/BVA
NXP Semiconductors
分类:Memory - Modules
MX27L256QC-20
Macronix International Co Ltd
分类:Memory - Modules
MZ-V9P2T0GW
Samsung Electronics Co. Ltd
分类:Memory - Modules
S29GL064M11FAIS10
Spansion
分类:Memory - Modules
SST45VF010-10-4C-SA
Silicon Storage Technology
分类:Memory - Modules
S29GL512N11FAI020
Spansion
分类:Memory - Modules
S29GL512N11FAI020
AMD
分类:Memory - Modules
AM29SL800DT90WAF
Spansion
分类:Memory - Modules
AM29F200BB-55SC
AMD
分类:Memory - Modules
AM29F200BB-55SC
Spansion
分类:Memory - Modules
X-7656-21407
TE Connectivity
分类:Memory - Modules
K9F3208U0B-TCB0
Samsung Semiconductor
分类:Memory - Modules
