类别是'category.存储器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||
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![]() | M29W640FB70ZA6E | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | TFBGA, BGA48,6X8,32 | GRID ARRAY, THIN PROFILE, FINE PITCH | 4000000 | PLASTIC/EPOXY | BGA48,6X8,32 | -40 °C | 30 | 70 ns | 85 °C | 有 | M29W640FB70ZA6E | 4194304 words | 3 V | TFBGA | RECTANGULAR | Micron Technology Inc | Obsolete | MICRON TECHNOLOGY INC | 5.47 | BGA | e1 | 有 | 3A991.B.1.A | NOR型号 | Tin/Silver/Copper (Sn/Ag/Cu) | 底部启动区块 | 8542.32.00.51 | 闪存 | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 4MX16 | 1.2 mm | 16 | 0.0001 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W25Q16DWSSIG | Winbond Electronics | 数据表 | 2130 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | 8 | EAR99 | 8542.32.00.51 | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | 8 | S-PDSO-G8 | 不合格 | 1.95V | 1.8V | 1.65V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O, QPI | 16MX1 | 1 | 40μs, 3ms | 0.000005A | 16777216 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2.16mm | 5.23mm | 5.23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S25FL512SAGMFBG10 | Cypress Semiconductor Corp | 数据表 | 361 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | Automotive grade | -40°C~105°C TA | Tray | Automotive, AEC-Q100, FL-S | e3 | 活跃 | 3 (168 Hours) | 16 | Matte Tin (Sn) | ITS ALSO CONFIGURABLE AS 512MX1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.7V | 512Mb 64M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 64MX8 | 8 | 512753664 bit | AEC-Q100; TS 16949 | SERIAL | 3V | 1 | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS25WP080D-JNLE-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | 8215 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | R-PDSO-G8 | 1.95V | 1.65V | 8Mb 1M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 1MX8 | 8 | 800μs | 8388608 bit | SERIAL | 1.8V | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT28C256-25DM/883-815 | Microchip Technology | 数据表 | 2219 In Stock | - | 最小起订量: 1 最小包装量: 1 | 23 Weeks | 通孔 | 28-CDIP (0.600, 15.24mm) | NO | Non-Volatile | Military grade | -55°C~125°C TC | Tube | 1997 | 活跃 | 1 (Unlimited) | 28 | 自动写入 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | R-GDIP-T28 | 5.5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 250ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 262144 bit | MIL-STD-883 Class C | 5V | 10ms | 5.72mm | 37.215mm | 15.24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC64T-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA160B-I/ST | Microchip Technology | 数据表 | 55 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA160B | 8 | 5.5V | 2/5V | SPI, Serial | 16Kb 2K x 8 | 6mA | 10MHz | 160 ns | EEPROM | SPI | 5ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.05mm | 4.5mm | 3.1mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST26VF016BT-104V/MF | Microchip Technology | 数据表 | 2000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 2016 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | SST26VF016B | R-PDSO-N8 | 3.6V | 2.7V | SPI | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | 0.025mA | FLASH | SPI - Quad I/O | 16MX1 | 1 | 1.5ms | 0.000025A | 16777216 bit | SERIAL | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | BOTTOM/TOP | NO | 0.8mm | 6mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C66BT-I/MC | Microchip Technology | 数据表 | 3300 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2008 | e3 | yes | Discontinued | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C66B | 8 | 5V | 5V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 2ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1mm | 3mm | 2.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M95080-DRDW8TP/K | STMicroelectronics | 数据表 | 4479 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.65mm | 未说明 | M95080 | 不合格 | 5.5V | 2/5V | SPI, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 8 | 4ms | 0.000001A | SPI | 900000 Write/Erase Cycles | 4ms | 50 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1061GN30-10BVXI | Cypress Semiconductor Corp | 数据表 | 17 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-VFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | 1996 | e1 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 30 | CY7C1061 | 3.6V | 2.2V | 16Mb 1M x 16 | SRAM | Parallel | 1MX16 | 16 | 10ns | 16777216 bit | 10 ns | 1mm | 8mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS61NLP51236-200TQLI | ISSI, Integrated Silicon Solution Inc | 数据表 | 771 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100 | Volatile | Industrial grade | -40°C~85°C TA | Tray | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991 | Matte Tin (Sn) - annealed | 流水线结构 | 3.135V~3.465V | QUAD | 1 | 3.3V | 0.65mm | 100 | 3.3V | 3.135V | 18Mb 512K x 36 | 4 | 475mA | 200MHz | 3.1ns | SRAM | Parallel | 512KX36 | 3-STATE | 36 | 19b | 18 Mb | 0.075A | COMMON | Synchronous | 36b | 1.6mm | 20mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25U12835FZNI-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | FLASH, NOR | e3 | 3 (168 Hours) | 8 | Matte Tin (Sn) | 85°C | -40°C | CAN BE ORGANISED AS 128 MBIT X 1 | DUAL | 无铅 | 260 | 1 | 1.8V | 1.27mm | unknown | 104MHz | 40 | 8 | R-PDSO-N8 | 不合格 | 2V | 1.8V | INDUSTRIAL | 1.65V | SPI, Serial | 16MB | SYNCHRONOUS | 32MX4 | 4 | 0.00002A | 134217728 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | 2 | 0.8mm | 6mm | 5mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LE25U20AFDW00-AH | ON Semiconductor | 数据表 | 510 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 18 Weeks | SMD/SMT | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LH5164AN-10L | Sharp Microelectronics | 数据表 | 51 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 28-SOP | 28 | Volatile | -10°C~70°C TA | Tube | 1997 | Obsolete | 4 (72 Hours) | 28 | 4.5V~5.5V | DUAL | 未说明 | 1 | 5V | unknown | 100GHz | 未说明 | 不合格 | 5V | 64Kb 8K x 8 | 1 | 45mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 70ns | 13b | 64 kb | Asynchronous | 8b | 2V | YES | 2.6mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS25LP256D-JMLE-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 16 | 2.3V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.3V | 256Mb 32M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 32MX8 | 8 | 800μs | 268435456 bit | SERIAL | 3V | 2.65mm | 10.31mm | 7.49mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 11LC010T-E/MNY | Microchip Technology | 数据表 | 28600 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 11LC010 | 8 | 5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | EEPROM | 单线 | 8 | 5ms | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX30LF4G18AC-XKI | Macronix | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 63-VFBGA | YES | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | MX30LF | 活跃 | 3 (168 Hours) | 63 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | 3.6V | 2.7V | 4Gb 512M x 8 | ASYNCHRONOUS | FLASH | Parallel | 512KX8 | 8 | 20ns | 4194304 bit | 3V | 1mm | 11mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C2165KV18-550BZXC | Cypress Semiconductor Corp | 数据表 | 17 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 165-LBGA | YES | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | 活跃 | 3 (168 Hours) | 165 | 3A991 | 流水线结构 | 8542.32.00.41 | 1.7V~1.9V | BOTTOM | 未说明 | 1 | 1.8V | 1mm | 未说明 | 1.9V | 1.7V | 18Mb 512K x 36 | 550MHz | SRAM | Parallel | 512KX36 | 36 | 18874368 bit | 0.45 ns | 1.4mm | 15mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT28LV010-20TU-630 | Microchip Technology | 数据表 | 32 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.5mm | 未说明 | R-PDSO-G32 | 3.465V | 3.135V | 1Mb 128K x 8 | ASYNCHRONOUS | 200ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1048576 bit | 3V | 10ms | 1.2mm | 18.4mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX29GL640EBTI-70G | Macronix | 数据表 | 13 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2017 | MX29GL | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | 未说明 | 48 | R-PDSO-G48 | 不合格 | 3.6V | 3/3.3V | 2.7V | 64Mb 8M x 8 | ASYNCHRONOUS | FLASH | Parallel | 4MX16 | 16 | 70ns | 64 Mb | 0.0001A | 70 ns | 3V | 8 | YES | YES | YES | 8127 | 8K64K | 8/16words | YES | BOTTOM | YES | 1.2mm | 18.4mm | 12mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAT25040YI-G | ON Semiconductor | 数据表 | 33 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | CAT25040 | 8 | 5V | SPI, Serial | 4Kb 512 x 8 | 2mA | 20MHz | 75 ns | EEPROM | SPI | 无卤素 | 8 | 5ms | 4 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 11LC010T-E/SN | Microchip Technology | 数据表 | 36542 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11LC010 | 8 | 5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | EEPROM | 单线 | 8 | 5ms | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB85R4001ANC-GE1 | Fujitsu Electronics America, Inc. | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 48-TFSOP (0.488, 12.40mm Width) | 48 | 48-TSOP | Non-Volatile | -40°C~85°C TA | Tray | 2015 | 不用于新设计 | 1 (Unlimited) | 85°C | -40°C | 3V~3.6V | Parallel | 3.6V | 3V | 4Mb 512K x 8 | 150ns | FRAM | Parallel | 150ns | Unknown | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25V512EZUI-13G | Macronix | 数据表 | 14653 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e3 | 不用于新设计 | 3 (168 Hours) | 8 | MATTE TIN (800) | 2.35V~3.6V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 8 | R-PDSO-N8 | 不合格 | 3.6V | 2.5/3.3V | 2.35V | SPI, Serial | 512Kb 64K x 8 | SYNCHRONOUS | 75MHz | FLASH | SPI | 256KX2 | 2 | 50μs, 1ms | 512 kb | 0.00001A | 3.3V | SPI | 100000000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 0.6mm | 3mm | 2mm | ROHS3 Compliant | 无铅 |
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