类别是'category.存储器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 最大功率耗散 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 逻辑功能 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 时间格式 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||
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S34ML01G200BHV000 | Cypress Semiconductor Corp | 数据表 | 531 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 63-VFBGA | 63 | Non-Volatile | -40°C~105°C TA | Tray | ML-2 | Discontinued | 3 (168 Hours) | 63 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 3.6V | 2.7V | 1Gb 128M x 8 | ASYNCHRONOUS | FLASH | Parallel | 128MX8 | 8 | 25ns | 28b | 1 Gb | 3V | 2kB | 1mm | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST26WF040BAT-104I/MF | Microchip Technology | 数据表 | 45 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Automotive grade | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 260 | 1 | 1.8V | 1.27mm | 30 | SST26WF040 | R-PDSO-N8 | 1.95V | 1.65V | SPI | 4Mb 512K x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 4MX1 | 1 | 1.5ms | 4194304 bit | TS 16949 | SERIAL | 1.8V | 0.8mm | 6mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39LF402C-55-4C-MAQE | Microchip Technology | 数据表 | 45 In Stock | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 表面贴装 | 表面贴装 | 48-WFBGA | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2014 | SST39 MPF™ | e1 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | TOP BOOT BLOCK | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3V | 0.5mm | 40 | SST39LF402C | 48 | 3.3V | 3.6V | 2.7V | 4Mb 256K x 16 | 18mA | 55ns | FLASH | Parallel | 256KX16 | 16 | 10μs | 1b | 4 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 128 | 2K | YES | TOP | YES | 0.73mm | 6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA32AX-I/ST | Microchip Technology | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA32A | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT28C010-15JU-T | Microchip Technology | 数据表 | 41 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 32 | 4.5V~5.5V | QUAD | 未说明 | 1 | 5V | 1.27mm | 未说明 | R-PQCC-J32 | 5.5V | 4.5V | 1Mb 128K x 8 | ASYNCHRONOUS | 150ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1048576 bit | 5V | 10ms | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX29GL128FLXFI-90G | Macronix | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 64-LBGA, CSPBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | MX29GL | 活跃 | 3 (168 Hours) | 64 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | R-PBGA-B64 | 不合格 | 3.6V | 3/3.3V | 2.7V | 128Mb 16M x 8 | ASYNCHRONOUS | FLASH | Parallel | 8MX16 | 16 | 90ns | 128 Mb | 0.00003A | 90 ns | 3V | 8 | YES | YES | YES | 128 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 11mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY14B104M-ZSP25XI | Cypress Semiconductor Corp | 数据表 | 16 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Non-Volatile | -40°C~85°C TA | Tray | 2005 | e3 | 活跃 | 3 (168 Hours) | 54 | 3A991.B.2.A | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B104 | 54 | 不合格 | 3.3V | 3.6V | 2.7V | 4Mb 256K x 16 | 70mA | ASYNCHRONOUS | Clock | NVSRAM | Parallel | 16b | 256KX16 | 16 | 25ns | 4 Mb | 0.005A | 25 ns | 16b | HH:MM:SS | 1.2mm | 22.415mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24CM02-U1UM0B-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 8-XFBGA, WLCSP | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 8 | ALSO OPERATES 1.7V AT 100 KHZ | 1.7V~5.5V | BOTTOM | 未说明 | 1 | 1.8V | 0.5mm | 未说明 | AT24CM02 | 5.5V | 1.7V | I2C, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 0.4MHz | 450ns | EEPROM | I2C | 8 | 10ms | 2 Mb | 1MHz | I2C | 5ms | 0.335mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1380C-167AC | Cypress Semiconductor Corp | 数据表 | 2520 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | e0 | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 流水线结构 | 3.135V~3.6V | QUAD | 225 | 1 | 3.3V | 0.65mm | not_compliant | 30 | CY7C1380 | 100 | 不合格 | 3.3V | 3.6V | 3.135V | 18Mb 512K x 36 | 4 | 275mA | 167MHz | 3.4ns | SRAM | Parallel | 512KX36 | 3-STATE | 36 | 19b | 18 Mb | 0.07A | COMMON | Synchronous | 36b | 1.6mm | 20mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25U8035EM1I-10G | Macronix | 数据表 | 297 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2010 | MX25xxx35/36 - MXSMIO™ | 不用于新设计 | 3 (168 Hours) | 8 | EAR99 | ALSO CONFIGURABLE AS 8M X 1 | 8542.32.00.51 | 1.65V~2V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | 8 | R-PDSO-G8 | 不合格 | 2V | 2V | 1.8V | 1.65V | SPI, Serial | 8Mb 1M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 2MX4 | 4 | 30μs, 3ms | 8 Mb | 0.00002A | 1.8V | SPI | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | 2 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S29GL032N11FFIS20 | Cypress Semiconductor Corp | 数据表 | 13 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | GL-N | Obsolete | 3 (168 Hours) | 1.65V~3.6V | 32Mb 4M x 8 2M x 16 | FLASH | Parallel | 110ns | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 34LC02T-I/MNY | Microchip Technology | 数据表 | 31 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.2V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 34LC02 | 8 | 不合格 | 5V | 2.2V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY14MB064J2-SXI | Cypress Semiconductor Corp | 数据表 | 14 In Stock | - | 最小起订量: 1 最小包装量: 1 | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e4 | yes | Obsolete | 3 (168 Hours) | 8 | 3A991.B.2.A | 1W | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 20 | CY14MB064 | 8 | 3.6V | 3V | 2.7V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 1mA | 3.4MHz | 900 ns | NVSRAM | I2C | 8b | 8 | 64 kb | 0.00015A | 8b | 1.727mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT28HC256E-12JC | Atmel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | QCCJ, LDCC32,.5X.6 | CHIP CARRIER | 2 | 32000 | PLASTIC/EPOXY | LDCC32,.5X.6 | 30 | 120 ns | 70 °C | 无 | AT28HC256E-12JC | 32768 words | 5 V | QCCJ | RECTANGULAR | Atmel Corporation | Obsolete | ATMEL CORP | 5.48 | QFJ | Military grade | e0 | EAR99 | Tin/Lead (Sn/Pb) | 自动写入 | 8542.32.00.51 | EEPROMs | CMOS | QUAD | J BEND | 225 | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.08 mA | 32KX8 | 3-STATE | 3.556 mm | 8 | 0.0003 A | 262144 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | 100000 Write/Erase Cycles | 10 ms | YES | YES | NO | 64 words | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA66BT-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BR24G01NUX-3TTR | ROHM Semiconductor | 数据表 | 3364 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | Non-Volatile | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | BR24G01 | R-PDSO-N8 | 不合格 | 5.5V | 1.8/5V | 1.6V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 128X8 | 8 | 5ms | 1 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 0.6mm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24FC256T-I/MNY | Microchip Technology | 数据表 | 8855868 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 8-WFDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e4 | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 260 | 1 | 0.5mm | 40 | 24FC256 | 5.5V | 1.7V | I2C, Serial | 256Kb 32K x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 256 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST26WF040B-104I/SN | Microchip Technology | 数据表 | 703 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | Automotive grade | -40°C~85°C TA | Tube | 2014 | SST26 SQI® | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | SST26WF040 | 1.8V | 1.95V | 1.65V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 4MX1 | 1 | 1.5ms | 4 Mb | TS 16949 | 256B | 1.75mm | 4.9mm | 3.9mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT46V32M16CV-5B:J | Micron Technology Inc. | 数据表 | 97 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 60-TFBGA | 60 | Volatile | 0°C~70°C TA | Tray | 2011 | e0 | no | Obsolete | 3 (168 Hours) | 60 | EAR99 | 锡铅银 | AUTO/SELF REFRESH | 8542.32.00.28 | 2.5V~2.7V | BOTTOM | 235 | 1 | 2.6V | 1mm | 30 | 60 | 2.6V | 2.7V | 2.5V | 512Mb 32M x 16 | 1 | 480mA | 200MHz | 700ps | DRAM | Parallel | 16b | 32MX16 | 3-STATE | 16 | 15ns | 15b | 512 Mb | 0.005A | 400MHz | COMMON | 8192 | 248 | 248 | 1.2mm | 12.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS43TR16128C-125KBL | ISSI, Integrated Silicon Solution Inc | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 96-TFBGA | YES | Volatile | 0°C~95°C TC | Tray | e1 | 活跃 | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.425V~1.575V | BOTTOM | 260 | 1 | 1.5V | 0.8mm | 10 | R-PBGA-B96 | 1.575V | 1.425V | 2Gb 128M x 16 | 1 | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 128MX16 | 16 | 15ns | 2147483648 bit | 1.2mm | 13mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W632GG6KB-15 | Winbond Electronics | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 96-TFBGA | 96 | Volatile | 0°C~95°C TC | Tray | 2016 | Discontinued | 3 (168 Hours) | 96 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.36 | 1.425V~1.575V | BOTTOM | 未说明 | 1 | 1.5V | 0.8mm | 未说明 | 96 | 不合格 | 1.5V | 1.575V | 1.425V | 2Gb 128M x 16 | 1 | 235mA | SYNCHRONOUS | 667MHz | 20ns | DRAM | Parallel | 128MX16 | 3-STATE | 16 | 17b | 2 Gb | 0.065A | COMMON | 8192 | 8 | 8 | 1.2mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S25FL064LABNFI011 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 8-WFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tube | FL-L | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) | IT ALSO HAVE X1 MEMORY WIDTH | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.8mm | 未说明 | S-PDSO-N8 | 3.6V | 2.7V | 64Mb 8M x 8 | SYNCHRONOUS | 108MHz | FLASH | SPI - Quad I/O, QPI | 16MX4 | 4 | 67108864 bit | SERIAL | 3V | 2 | 0.6mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1518KV18-333BZXC | Cypress Semiconductor Corp | 数据表 | 2186 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 30 | CY7C1518 | 165 | 1.8V | 72Mb 4M x 18 | 1 | 520mA | 333MHz | 450 ps | SRAM | Parallel | 3-STATE | 18 | 22b | 72 Mb | COMMON | Synchronous | 18b | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 23LCV512-I/P | Microchip Technology | 数据表 | 33000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | Automotive grade | -40°C~85°C TA | Tube | 2006 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | 1 | 2.54mm | 23LCV512 | 5.5V | 2.5V | SPI, Serial | 512Kb 64K x 8 | 1 | 10mA | 20MHz | 25 ns | NVSRAM | SPI - Dual I/O | 16b | 512 kb | Synchronous | 8b | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
71V3577S80BQI | Renesas Electronics America Inc. | 数据表 | 34 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 165-TBGA | 165-CABGA (13x15) | Industrial grade | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 3.135V~3.465V | IDT71V3577 | 4.5Mb 128K x 36 | 100MHz | 8ns | SRAM | Parallel | Non-RoHS Compliant |
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54.572509
