类别是'category.存储器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
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IS62WV51216BLL-55BLI-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 48-TFBGA | 48 | Volatile | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 2 (1 Year) | 2.5V~3.6V | 3.3V | 8Mb 512K x 16 | 1 | 5mA | SRAM | Parallel | 55ns | 19b | 8 Mb | Asynchronous | 16b | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS61NLP51236B-200TQLI | ISSI, Integrated Silicon Solution Inc | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 100 | 3.135V~3.465V | QUAD | 未说明 | 1 | 3.3V | 0.65mm | 未说明 | R-PQFP-G100 | 3.465V | 3.135V | 18Mb 512K x 36 | 200MHz | 3ns | SRAM | Parallel | 512KX36 | 36 | 18874368 bit | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S29AS016J70TFI030 | Cypress Semiconductor Corp | 数据表 | 9871 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | AS-J | Obsolete | 3 (168 Hours) | 48 | EAR99 | TOP BOOT BLOCK | 8542.32.00.51 | 1.65V~1.95V | DUAL | 1 | 1.8V | 0.5mm | 1.8V | 1.95V | 1.65V | 16Mb 2M x 8 1M x 16 | FLASH | Parallel | 8b | 1MX16 | 16 | 70ns | 20b | 16 Mb | 70 ns | 8 | TOP | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BR25H040F-2LBH2 | ROHM Semiconductor | 数据表 | 250 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | R-PDSO-G8 | 5.5V | 2.5V | 4Kb 512 x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 512X8 | 8 | 4ms | 4096 bit | SERIAL | SPI | 4ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BR24A01AF-WME2 | ROHM Semiconductor | 数据表 | 2267 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | Automotive grade | -40°C~105°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | ALSO AVAILABLE 2.5-5.5V OPERATES WITH 0.1MHZ, SEATED HT-CALCULATED | 2.5V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | 不合格 | 5.5V | 3/5V | 2.5V | 1Kb 128 x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000002A | 1024 bit | SERIAL | I2C | 100000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.71mm | 5mm | 4.4mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39LF801C-55-4C-MAQE | Microchip Technology | 数据表 | 55 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 48-WFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2011 | SST39 MPF™ | e1 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 底部启动区块 | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.5mm | 40 | SST39LF801 | 48 | 3.3V | 3.6V | 3V | 8Mb 512K x 16 | 18mA | 55ns | FLASH | Parallel | 16b | 512KX16 | 16 | 10μs | 19b | 8 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 256 | 2K | YES | BOTTOM | YES | 0.73mm | 6mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1441AV33-133AXI | Cypress Semiconductor Corp | 数据表 | 568 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 2004 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 40 | CY7C1441 | 100 | 3.3V | 3.6V | 3.135V | 36Mb 1M x 36 | 4 | 310mA | 133MHz | 6.5ns | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 20b | 36 Mb | COMMON | Synchronous | 36b | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 23LC1024T-E/ST | Microchip Technology | 数据表 | 33000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2012 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 23LC1024 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.5V | 1Mb 128K x 8 | SYNCHRONOUS | 16MHz | SRAM | SPI - Quad I/O | 128KX8 | 3-STATE | 8 | 0.000012A | 1048576 bit | 32 ns | SERIAL | COMMON/SEPARATE | 2.5V | NO | NO | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CYD36S18V18-167BGXI | Cypress Semiconductor Corp | 数据表 | 31 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 484-FBGA | 484 | Volatile | -40°C~85°C TA | Tray | 2011 | e1 | yes | Obsolete | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1.42V~1.58V 1.7V~1.9V | BOTTOM | 260 | 1 | 1.5V | 1mm | 30 | CYD36S18 | 484 | 1.8V | 1.58V | 36Mb 2M x 18 | 2 | 1.41A | 167MHz | 4ns | SRAM | Parallel | 3-STATE | 18 | 21b | 36 Mb | 0.7A | COMMON | Synchronous | 18b | 1.4V | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AS7C256A-15JCNTR | Alliance Memory, Inc. | 数据表 | 45 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 28-BSOJ (0.300, 7.62mm Width) | YES | 28 | Volatile | Commercial grade | 0°C~70°C TA | Tape & Reel (TR) | 1997 | yes | 活跃 | 3 (168 Hours) | 28 | 4.5V~5.5V | DUAL | 1 | 5V | 28 | 5V | 256Kb 32K x 8 | 1 | SRAM | Parallel | 32KX8 | 8 | 15ns | 15b | 256 kb | 3.759mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY62126EV30LL-45ZSXA | Cypress Semiconductor Corp | 数据表 | 168 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~125°C TA | Tray | 1998 | MoBL® | e4 | 活跃 | 3 (168 Hours) | 44 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY62126 | 44 | 3V | 3.6V | 2.2V | 1Mb 64K x 16 | 1 | 16mA | 16mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 16b | 1 Mb | 0.00003A | 45 ns | COMMON | Asynchronous | 16b | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39VF402C-70-4C-EKE | Microchip Technology | 数据表 | 227 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2011 | SST39 MPF™ | e3 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) - annealed | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | SST39VF402C | 48 | 3.3V | 3.6V | 2.7V | 4Mb 256K x 16 | 18mA | 70ns | FLASH | Parallel | 256KX16 | 16 | 10μs | 1b | 4 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 128 | 2K | YES | TOP | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA66XT/SN | Microchip Technology | 数据表 | 17 In Stock | - | 最小起订量: 1 最小包装量: 1 | 28 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | Automotive grade | 0°C~70°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 1.8V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93AA66 | 8 | 5.5V | 2/5V | Serial | 4Kb 512 x 8 256 x 16 | 3mA | 2MHz | EEPROM | SPI | 256X16 | 3-STATE | 16 | 10ms | 4 kb | 0.00003A | TS 16949 | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA76T/SN | Microchip Technology | 数据表 | 2878 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | Automotive grade | 0°C~70°C TA | Tape & Reel (TR) | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93AA76 | 8 | 6V | 2/5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | EEPROM | SPI | 512X16 | 3-STATE | 16 | 5ms | 8 kb | 0.00003A | TS 16949 | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 8 | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C56T-E/SN | Microchip Technology | 数据表 | 31 In Stock | - | 最小起订量: 1 最小包装量: 1 | 28 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2000 | e0 | no | 活跃 | 1 (Unlimited) | 8 | 10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 4.5V~5.5V | DUAL | 1 | 5V | 1.27mm | 93C56 | 8 | 5V | 5V | Serial | 2Kb 256 x 8 128 x 16 | 4mA | 2MHz | 2 μs | EEPROM | SPI | 3-STATE | 8 | 2ms | 2 kb | 0.0001A | MICROWIRE | 1000000 Write/Erase Cycles | 1ms | 40 | SOFTWARE | 16 | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS43TR81280B-125JBLI | ISSI, Integrated Silicon Solution Inc | 数据表 | 14 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 78-TFBGA | YES | Volatile | -40°C~95°C TC | Tray | e1 | 活跃 | 3 (168 Hours) | 78 | EAR99 | 锡银铜 | AUTO/SELF REFRESH | 8542.32.00.32 | 1.425V~1.575V | BOTTOM | 未说明 | 1 | 1.5V | 0.8mm | 未说明 | R-PBGA-B78 | 1.575V | 1.425V | 1Gb 128M x 8 | 1 | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 128MX8 | 8 | 15ns | 1073741824 bit | 1.2mm | 10.5mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1515KV18-300BZC | Cypress Semiconductor Corp | 数据表 | 2398 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1515 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 790mA | 300MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25WF080BT-40I/SN | Microchip Technology | 数据表 | 6200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SST25 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | SST25WF080B | 1.8V | 1.95V | 1.65V | SPI, Serial | 8Mb 1M x 8 | 10mA | 40MHz | 11 ns | FLASH | SPI | 1 | 1ms | 24b | 8 Mb | Synchronous | 8b | 256B | 1.75mm | 4.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W632GG6MB-12 | Winbond Electronics | 数据表 | 1584 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 96-VFBGA | YES | Volatile | 0°C~95°C TC | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | AUTO/SELF REFRESH | 1.425V~1.575V | BOTTOM | 未说明 | 1 | 1.5V | 0.8mm | 未说明 | R-PBGA-B96 | 1.575V | 1.425V | 2Gb 128M x 16 | 1 | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 128MX16 | 16 | 2147483648 bit | 1mm | 13mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R1EX24004ATAS0I#S0 | Renesas Electronics America | 数据表 | 2660 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 1 | 3.3V | 0.65mm | R1EX24004 | 8 | 5.5V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4096 bit | I2C | 5ms | 1.1mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S25FL256SDPBHVC00 | Cypress Semiconductor Corp | 数据表 | 79 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 24-TBGA | 24 | Non-Volatile | -40°C~105°C TA | Tray | 2007 | FL-S | 活跃 | 3 (168 Hours) | 24 | ALSO CONFIGURABLE AS 256M X 1 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 不合格 | 3V | 3.6V | 2.7V | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 66MHz | 0.1mA | 8 ns | FLASH | SPI - Quad I/O | 32MX8 | 8 | 32b | 256 Mb | 0.0003A | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | 1.2mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS46TR16128CL-125KBLA1 | ISSI, Integrated Silicon Solution Inc | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 96-TFBGA | YES | Volatile | -40°C~95°C TC | Tray | e1 | 活跃 | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.283V~1.45V | BOTTOM | 260 | 1 | 1.35V | 0.8mm | 10 | R-PBGA-B96 | 1.45V | 1.283V | 2Gb 128M x 16 | 1 | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 128MX16 | 16 | 15ns | 2147483648 bit | 1.2mm | 13mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MD2764A-35/B | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Rochester Electronics, LLC | Obsolete | Bulk | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | N25Q512A13GSF40F | Micron | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 years ago) | Tin | YES | 16 | 16 | Compliant | NOR | SOP, SOP16,.4 | 小概要 | 64000000 | PLASTIC/EPOXY | SOP16,.4 | -40 °C | 85 °C | 有 | N25Q512A13GSF40F | 108 MHz | 67108864 words | 3 V | SOP | RECTANGULAR | Micron Technology Inc | Obsolete | MICRON TECHNOLOGY INC | 5.8 | Tape & Reel | 有 | NOR型号 | 85 °C | -40 °C | CMOS | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 108 MHz | R-PDSO-G16 | 3 V | 3.6 V | INDUSTRIAL | 2.7 V | 2.7 V | SPI, Serial | 3.6 V | 2.7 V | 20 mA | SYNCHRONOUS | 0.015 mA | 64MX8 | 2.5 mm | 8 | 1 b | 512 Mb | 0.0005 A | 536870912 bit | SERIAL | Synchronous | FLASH | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256 B | 10.3 mm | 7.5 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24CS08-MAHM-E | Microchip Technology | 数据表 | 9941 In Stock | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | 1.7V~5.5V | DUAL | 1 | 5V | 0.5mm | AT24CS08 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | I2C | 5ms | 0.6mm | 3mm | 2mm | ROHS3 Compliant |
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