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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | Current - Supply (Nom) | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 最大电流源 | 资历状况 | 电源 | 电压 | 界面 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 数据轮询 | 拨动位 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 24AA08/P | Microchip Technology | 数据表 | 10800 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 3mA | Non-Volatile | 0°C~70°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 3V | DUAL | 1 | 2.54mm | 24AA08 | 2/5V | I2C, Serial | 8Kb 256 x 8 x 4 | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 8 kb | 0.00003A | I2C | 1000000 Write/Erase Cycles | 10ms | 200 | HARDWARE | 5.5V | 1010XMMR | 4.064mm | 9.9695mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | BR24L02FVT-WE2 | ROHM Semiconductor | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 2mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e2 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 锡铜 | 2.5V | DUAL | 260 | 1 | 0.65mm | 10 | BR24L02 | 2/5V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 5.5V | 1.7V | 1010DDDR | 1.25mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | 24LC08BT-E/MC | Microchip Technology | 数据表 | 640 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | 3mA | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 5V | DUAL | 260 | 1 | 0.5mm | 40 | 24LC08B | 3/5V | I2C, Serial | 8Kb 256 x 8 x 4 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 5.5V | 2.5V | 1010XMMR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | CAV24C128WE-GT3 | ON Semiconductor | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 7 Weeks | ACTIVE (Last Updated: 21 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | 5mA | 不合格 | 3/5V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 无卤素 | 8 | 5ms | 1 Mb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 5.5V | 2.5V | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | S25FL032P0XMFA013 | Cypress Semiconductor Corp | 数据表 | 26700 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | Automotive, AEC-Q100, FL-P | 活跃 | 3 (168 Hours) | 8 | 3V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | SPI, Serial | 32Mb 4M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 32MX1 | 1 | 5μs, 3ms | 33554432 bit | 3V | 3.6V | 2.7V | 2.16mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62177EV18LL-70BAXI | Cypress Semiconductor Corp | 数据表 | 12 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | 2001 | MoBL® | e1 | 活跃 | 3 (168 Hours) | 48 | 锡银铜 | 1.8V | BOTTOM | 260 | 1 | 0.75mm | 40 | 32Mb 4M x 8 2M x 16 | 1 | SRAM | Parallel | 16 | 70ns | 21b | 32 Mb | 70 ns | 2.25V | 9.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M93S56-WMN6T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 2mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | 锡铅 | 5V | DUAL | 1 | 1.27mm | M93S56 | 3/5V | Serial | 2Kb 128 x 16 | 2MHz | EEPROM | SPI | 3-STATE | 16 | 5ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 5.5V | 2.5V | 1.75mm | 4.9mm | 3.9mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | 11AA040T-I/TT | Microchip Technology | 数据表 | 24000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | Tin | 表面贴装 | 表面贴装 | TO-236-3, SC-59, SOT-23-3 | 3 | 5mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 3 | SMD/SMT | EAR99 | 5V | DUAL | 260 | 1 | 0.95mm | 40 | 11AA040 | 2/5V | Serial | 4Kb 512 x 8 | 100kHz | EEPROM | 单线 | 5ms | 4 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 5.5V | 1.8V | 1.02mm | 3.05mm | 1.4mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| AT24MAC602-XHM-T | Microchip Technology | 数据表 | 6 In Stock | - | 最小起订量: 1 最小包装量: 1 | 25 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 3mA | Non-Volatile | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V | DUAL | 260 | 1 | 0.65mm | 40 | AT24MAC602 | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 5.5V | 1.7V | 1010DDDR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | CY62168EV30LL-45BVXI | Cypress Semiconductor Corp | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | 30mA | Volatile | -40°C~85°C TA | Tray | 2003 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 3V | BOTTOM | 260 | 1 | 0.75mm | 30 | CY62168 | 16Mb 2M x 8 1M x 16 | 1 | SRAM | Parallel | 2MX8 | 3-STATE | 8 | 45ns | 21b | 16 Mb | 45 ns | COMMON | Asynchronous | 8b | 3.6V | 2.2V | 8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T64F-WE2 | ROHM Semiconductor | 数据表 | 9000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 2.5V | DUAL | 225 | 1 | 1.27mm | 未说明 | BR24T64 | 不合格 | 2-Wire, I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 5.5V | 1.6V | 1010DDDR | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| 24LC1026-I/P | Microchip Technology | 数据表 | 706 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | 5mA | Non-Volatile | -40°C~85°C TA | Tube | 2001 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 200 YEARS DATA RETENTION | 5V | DUAL | 1 | 2.54mm | 24LC1026 | 3/5V | I2C, Serial | 1Mb 128K x 8 | 400kHz | 900ns | EEPROM | I2C | 5ms | 1 Mb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 5.5V | 2.5V | 1010DDMR | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25F512AN-10SU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | 35mA | Non-Volatile | -40°C~85°C TC | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 3.3V | 20MHz | AT25F512 | SPI, Serial | 512Kb 64K x 8 | 20MHz | 9 ns | FLASH | SPI | 8b | 100μs | 1b | 512 kb | 20MHz | Synchronous | 8b | 3.6V | 2.7V | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS61C25616AL-10TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | 50mA | Volatile | Industrial grade | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 2 (1 Year) | 44 | Matte Tin (Sn) - annealed | 5V | DUAL | 260 | 1 | 0.8mm | 40 | 4Mb 256K x 16 | 1 | SRAM | Parallel | 10ns | 18b | 4 Mb | Asynchronous | 16b | 1.05mm | 18.52mm | 10.29mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA010AT-I/MC | Microchip Technology | 数据表 | 10306 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | 5mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 5V | DUAL | 260 | 1 | 0.5mm | 40 | 25AA010A | SPI, Serial | 1Kb 128 x 8 | 10MHz | 100 ns | EEPROM | SPI | 5ms | 1 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 950μm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1312KV18-250BZXC | Cypress Semiconductor Corp | 数据表 | 200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | 560mA | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.8V | BOTTOM | 260 | 1 | 1mm | 30 | CY7C1312 | 18Mb 1M x 18 | 2 | 250MHz | 450 ps | SRAM | Parallel | 1MX18 | 3-STATE | 18 | 19b | 18 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.9V | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1168KV18-400BZXC | Cypress Semiconductor Corp | 数据表 | 87 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | 510mA | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.8V | BOTTOM | 260 | 1 | 30 | CY7C1168 | 18Mb 1M x 18 | 1 | 400MHz | 450 ps | SRAM | Parallel | 3-STATE | 18 | 19b | 18 Mb | 0.29A | COMMON | Synchronous | 18b | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C04-DRMN8TP/K | STMicroelectronics | 数据表 | N/A |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | Automotive grade | -40°C~105°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | M24C04 | 不合格 | 2/5V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 8 | 4ms | 0.000001A | 4096 bit | I2C | 900000 Write/Erase Cycles | 4ms | 50 | HARDWARE | 5.5V | 1010DDMR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | K4B4G1646E-BCMA | Samsung | 数据表 | 3 In Stock |
- | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C46BT/ST | Microchip Technology | 数据表 | 22424 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 2mA | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2001 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1000000 ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 5V | DUAL | 260 | 1 | 0.635mm | 40 | 93C46B | 5V | 2-Wire, Serial | 1Kb 64 x 16 | 2MHz | 6 ms | EEPROM | SPI | 64X16 | 3-STATE | 16 | 2ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MX30LF2G18AC-XKI | Macronix | 数据表 | 96800 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 63-VFBGA | YES | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2014 | MX30LF | 活跃 | 3 (168 Hours) | 63 | 3V | BOTTOM | 未说明 | 1 | 0.8mm | 未说明 | 2Gb 256M x 8 | ASYNCHRONOUS | FLASH | Parallel | 256MX8 | 8 | 20ns | 2147483648 bit | 3V | 3.6V | 2.7V | 1mm | 11mm | 9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62146ELL-45ZSXI | Cypress Semiconductor Corp | 数据表 | 4 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | 20mA | Volatile | -40°C~85°C TA | Tray | 2001 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 5V | DUAL | 260 | 1 | 0.8mm | 1MHz | 30 | CY62146 | 5V | 4Mb 256K x 16 | 1 | SRAM | Parallel | 3-STATE | 45ns | 18b | 4 Mb | 0.000007A | 45 ns | COMMON | Asynchronous | 16b | 2V | 1.044mm | 18.52mm | 10.262mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | PC28F640P33BF60A | Micron Technology Inc. | 数据表 | 300 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 8 Weeks | Copper, Silver, Tin | 表面贴装 | 64-TBGA | YES | 64 | 28mA | Non-Volatile | -40°C~85°C TC | Tray | 2011 | e1 | yes | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 锡银铜 | 8542.32.00.51 | 3V | BOTTOM | 260 | 1 | 30 | PC28F640 | 2.5/3.3V | 2.3V | Parallel, Serial | 64Mb 4M x 16 | 52MHz | FLASH | Parallel | 4MX16 | 60ns | 22b | 64 Mb | 0.002A | 60 ns | Asynchronous | 16b | NO | NO | 463 | 8words | BOTTOM | 1.2mm | 10.1mm | 8.1mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | S29GL256S90TFI023 | Cypress Semiconductor Corp | 数据表 | 18 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | 60mA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | GL-S | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 3V | DUAL | 1 | 0.5mm | 3/3.3V | 256Mb 16M x 16 | 90ns | FLASH | Parallel | 16b | 32MX8 | 8 | 60ns | 24b | 256 Mb | 0.0001A | Asynchronous | 16b | 3V | YES | YES | 3.6V | 2.7V | YES | 256 | 64K | 32B | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | 24LC01BHT-E/LT | Microchip Technology | 数据表 | 5800 In Stock | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 5-TSSOP, SC-70-5, SOT-353 | 70 | 3mA | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 5 | EAR99 | 8542.32.00.51 | 5V | DUAL | 260 | 1 | 0.65mm | 40 | 24LC01BH | R-PDSO-G5 | 2-Wire, Serial | 1Kb 128 x 8 | 400kHz | 900ns | EEPROM | I2C | 128X8 | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.1mm | 2mm | 1.25mm | 无 | ROHS3 Compliant |
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24AA08/P
Microchip Technology
分类:Memory
-
BR24L02FVT-WE2
ROHM Semiconductor
分类:Memory
-
24LC08BT-E/MC
Microchip Technology
分类:Memory
-
CAV24C128WE-GT3
ON Semiconductor
分类:Memory
14.092213
-
S25FL032P0XMFA013
Cypress Semiconductor Corp
分类:Memory
-
CY62177EV18LL-70BAXI
Cypress Semiconductor Corp
分类:Memory
-
M93S56-WMN6T
STMicroelectronics
分类:Memory
-
11AA040T-I/TT
Microchip Technology
分类:Memory
-
AT24MAC602-XHM-T
Microchip Technology
分类:Memory
-
CY62168EV30LL-45BVXI
Cypress Semiconductor Corp
分类:Memory
-
BR24T64F-WE2
ROHM Semiconductor
分类:Memory
-
24LC1026-I/P
Microchip Technology
分类:Memory
-
AT25F512AN-10SU-2.7
Microchip Technology
分类:Memory
-
IS61C25616AL-10TLI
ISSI, Integrated Silicon Solution Inc
分类:Memory
-
25AA010AT-I/MC
Microchip Technology
分类:Memory
-
CY7C1312KV18-250BZXC
Cypress Semiconductor Corp
分类:Memory
-
CY7C1168KV18-400BZXC
Cypress Semiconductor Corp
分类:Memory
-
M24C04-DRMN8TP/K
STMicroelectronics
分类:Memory
2.533495
-
K4B4G1646E-BCMA
Samsung
分类:Memory
30.533188
-
93C46BT/ST
Microchip Technology
分类:Memory
-
MX30LF2G18AC-XKI
Macronix
分类:Memory
-
CY62146ELL-45ZSXI
Cypress Semiconductor Corp
分类:Memory
-
PC28F640P33BF60A
Micron Technology Inc.
分类:Memory
185.933733
-
S29GL256S90TFI023
Cypress Semiconductor Corp
分类:Memory
-
24LC01BHT-E/LT
Microchip Technology
分类:Memory