类别是'category.FPGA(可编程逻辑门阵列)' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||
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![]() | 5SGXEA7K2F40C2N | Intel | 数据表 | 869 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 1517-BBGA, FCBGA | YES | 696 | 0°C~85°C TJ | Tray | Stratix® V GX | 活跃 | 3 (168 Hours) | 3A001.A.7.A | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 0.9V | 1mm | 5SGXEA7 | S-PBGA-B1517 | 696 | 不合格 | 0.851.52.52.5/31.2/3V | 696 | 23472 CLBS | 现场可编程门阵列 | 622000 | 51200000 | 234720 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3S200-5VQ100C | Xilinx Inc. | 数据表 | 33 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 63 | 0°C~85°C TJ | Tray | 2006 | Spartan®-3 | e0 | no | 活跃 | 3 (168 Hours) | 100 | EAR99 | 1.14V~1.26V | QUAD | 鸥翼 | 225 | 1.2V | not_compliant | 30 | XC3S200 | 100 | 63 | 不合格 | 1.2V | 27kB | 现场可编程门阵列 | 4320 | 221184 | 200000 | 480 | 5 | 480 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1BG329 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-329 | YES | 329-PBGA (31x31) | 329 | 2.25 V | 0 C | + 70 C | SMD/SMT | 278 MHz | 有 | 微芯片技术 | 27 | Actel | Tray | A54SX32 | 活跃 | 2.75 V | 5.24 | MICROSEMI CORP | 活跃 | SQUARE | BGA | 278 MHz | A54SX32A-1BG329 | 无 | 70 °C | 30 | 2.5 V | BGA329,23X23,50 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA329,23X23,50 | N | 249 I/O | 0°C ~ 70°C (TA) | Tray | A54SX32A | e0 | 锡铅 | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1.27 mm | unknown | S-PBGA-B329 | 249 | 不合格 | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 249 | 2880 CLBS, 48000 GATES | 2.7 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.8 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLP060V5-CSG201 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CSP-201 | YES | 201-CSP (8x8) | 201 | 1.425 V | 0 C | + 70 C | SMD/SMT | 892.86 MHz | 有 | 微芯片技术 | 348 | IGLOO PLUS | 1.575 V | Tray | AGLP060 | 活跃 | VFBGA, BGA201,15X15,20 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA201,15X15,20 | 1.5 V | 未说明 | 70 °C | 有 | AGLP060V5-CSG201 | 250 MHz | VFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | Details | 157 I/O | 0°C ~ 85°C (TJ) | Tray | AGLP060V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B201 | 157 | 不合格 | 1.5 V | 1.5 V | COMMERCIAL | 157 | 1584 CLBS, 60000 GATES | 0.99 mm | 现场可编程门阵列 | 1584 | 18432 | 60000 | STD | 1584 | 1584 | 60000 | 0.66 mm | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-2PQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 3 V | 0 C | + 70 C | SMD/SMT | 175 MHz | 有 | 微芯片技术 | 66 | Actel | 0.062040 oz | Tray | A40MX02 | 活跃 | 5.25 V | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A40MX02-2PQG100 | 101 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.3 | Details | 57 I/O | 0°C ~ 70°C (TA) | Tray | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 3.4 mm | 现场可编程门阵列 | 3000 | 2 ns | 295 | 3000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3VQG80 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 80-VQFP (14x14) | 80 | 0 C | + 70 C | SMD/SMT | 188 MHz | 有 | 微芯片技术 | 90 | Actel | 5.25 V | Tray | A40MX02 | 活跃 | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80 | FLATPACK, THIN PROFILE | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A40MX02-3VQG80 | 109 MHz | TQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 57 I/O | 3 V | 0°C ~ 70°C (TA) | Tray | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.65 mm | compliant | S-PQFP-G80 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P400-2FG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | This product may require additional documentation to export from the United States. | N | 178 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 微芯片技术 | 有 | 90 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P400 | 活跃 | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | A3P400-2FG256 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 0 to 70 °C | Tray | A3P400 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | 现场可编程门阵列 | 55296 | 400000 | 2 | 9216 | 400000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 3 V | 0 C | + 70 C | SMD/SMT | 188 MHz | 有 | 微芯片技术 | 66 | Actel | 0.062040 oz | 5.25 V | Tray | A40MX02 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A40MX02-3PQG100 | 109 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.3 | Details | 57 I/O | 0°C ~ 70°C (TA) | Tray | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 3.4 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-2PQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 3 V | 0 C | + 70 C | SMD/SMT | 269 MHz | 有 | 微芯片技术 | 66 | Actel | 0.062040 oz | Tray | A42MX09 | 活跃 | 5.25 V | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX09-2PQG100 | 146 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.3 | Details | 83 I/O | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 3.4 mm | 现场可编程门阵列 | 14000 | 1.8 ns | 684 | 14000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-FFGG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 203 I/O | 2.25 V | 0 C | + 70 C | SMD/SMT | 172 MHz | 有 | 微芯片技术 | 90 | Actel | 0.014110 oz | 2.75 V | Tray | A54SX32 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 2.5 V | 40 | 70 °C | 有 | A54SX32A-FFGG256 | 172 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 0°C ~ 70°C (TA) | Tray | A54SX32A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | 不合格 | 2.5 V | 2.5,2.5/5 V | COMMERCIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | 现场可编程门阵列 | 48000 | 2880 | 1.7 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-PQG100A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | - 40 C | + 125 C | SMD/SMT | 153 MHz | 有 | 66 | 微芯片技术 | Actel | 0.062040 oz | 5.25 V | 83 | Tray | A42MX16 | 活跃 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 125 °C | 有 | A42MX16-PQG100A | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.53 | Details | 4.75 V | -40°C ~ 125°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 5 V | AUTOMOTIVE | 24000 GATES | 3.4 mm | 现场可编程门阵列 | 24000 | STD | 2.4 ns | 24000 | 2.7 mm | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3PQG160 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | PQFP-160 | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | 237 MHz | 有 | 微芯片技术 | 24 | Actel | 0.196363 oz | 5.25 V | Tray | A42MX16 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-3PQG160 | 129 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 125 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 608 | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||
![]() | A42MX09-3PQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 3 V | 0 C | + 70 C | SMD/SMT | 296 MHz | 有 | 微芯片技术 | 66 | Actel | 0.062040 oz | 5.25 V | Tray | A42MX09 | 活跃 | 3.3 V | 40 | 70 °C | 有 | A42MX09-3PQG100 | 161 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.3 | PLASTIC/EPOXY | 3 | FLATPACK | QFP, | Details | 83 I/O | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 3.4 mm | 现场可编程门阵列 | 14000 | 1.6 ns | 684 | 14000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-FCSG325I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | 325-FCBGA (11x11) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 86184 LE | 180 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | IGLOO2 | 176 | 有 | 1.2 V | Tray | M2GL090 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL090T | 1.14V ~ 2.625V | 1.2 V | 86184 | 2648064 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3TQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | TQFP-176 | YES | 176 | 176-TQFP (24x24) | 176 | 237 MHz | 有 | 微芯片技术 | 40 | Actel | 5.25 V | Tray | A42MX16 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-3TQG176 | 129 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 140 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 608 | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | 无 | |||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-FVQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 100-VQFP (14x14) | 100 | 0 C | + 70 C | SMD/SMT | 103 MHz | 有 | 微芯片技术 | 90 | Actel | 5.25 V | Tray | A42MX16 | 活跃 | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-FVQG100 | 56 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | Details | 83 I/O | 3 V | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 4 ns | 1232 | 24000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE1500-1FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 280 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 272 MHz | 有 | 60 | ProASIC3 | 0.014110 oz | 1.575 V | Tray | A3PE1500 | 活跃 | 0°C ~ 85°C (TJ) | Tray | A3PE1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 272 MHz | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 272 MHz | 1 | 38400 | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP20K100QC240-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 240-BQFP | YES | 189 | 0°C~85°C TJ | Tray | APEX-20K® | e0 | Obsolete | 3 (168 Hours) | 240 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EP20K100 | S-PQFP-G240 | 183 | 不合格 | 2.52.5/3.3V | 3.6 ns | 183 | 可加载 PLD | 4160 | 53248 | 263000 | 416 | MACROCELL | 4 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1K100QC208-2N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 147 | 0°C~70°C TA | Tray | ACEX-1K® | e3 | Obsolete | 3 (168 Hours) | 208 | 3A991 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 245 | 2.5V | 0.5mm | compliant | 40 | EP1K100 | S-PQFP-G208 | 147 | 不合格 | 2.52.5/3.3V | 37.5MHz | 0.5 ns | 147 | 可加载 PLD | 4992 | 49152 | 257000 | 624 | MIXED | 4.1mm | 28mm | 28mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV800-4HQ240C | Xilinx Inc. | 数据表 | 80 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 240-BFQFP Exposed Pad | 240 | 166 | 0°C~85°C TJ | Tray | 2000 | Virtex® | e0 | no | Obsolete | 3 (168 Hours) | 240 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | unknown | 30 | XCV800 | 240 | 166 | 不合格 | 1.2/3.62.5V | 14kB | 250MHz | 现场可编程门阵列 | 21168 | 114688 | 888439 | 4704 | 0.8 ns | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5AGXBA1D4F27C4N | Intel | 数据表 | 191 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 672-BBGA, FCBGA | YES | 336 | 0°C~85°C TJ | Tray | Arria V GX | e1 | Obsolete | 3 (168 Hours) | 672 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5AGXBA1 | S-PBGA-B672 | 336 | 不合格 | 1.11.2/3.32.5V | 670MHz | 336 | 现场可编程门阵列 | 75000 | 8666112 | 3537 | 2.7mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5AGXFA5H6F35C6N | Intel | 数据表 | 90 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA Exposed Pad | YES | 544 | 0°C~85°C TJ | Tray | Arria V GX | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5AGXFA5 | S-PBGA-B1152 | 544 | 不合格 | 1.11.2/3.32.5V | 500MHz | 544 | 现场可编程门阵列 | 190000 | 13284352 | 8962 | 2.7mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6VLX365T-2FF1156I | Xilinx Inc. | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 1156-BBGA, FCBGA | 1156 | 600 | -40°C~100°C TJ | Tray | 2008 | Virtex®-6 LXT | e0 | no | 活跃 | 4 (72 Hours) | 3A991.D | Tin/Lead (Sn63Pb37) | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC6VLX365T | 600 | 不合格 | 1V | 1.8MB | 现场可编程门阵列 | 364032 | 15335424 | 28440 | 2 | 3.5mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P030-2QNG48 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-48 | YES | 48-QFN (6x6) | 48 | Details | 34 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 微芯片技术 | 429 | ProASIC3 | 1.5000 V | 1.425 V | 1.575 V | Tray | A3P030 | 活跃 | 1.575 V | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFN-48 | CHIP CARRIER, HEAT SINK/SLUG | 3 | UNSPECIFIED | 1.5 V | 30 | 85 °C | 有 | A3P030-2QNG48 | 350 MHz | HQCCN | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 0 to 70 °C | Tray | A3P030 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 无铅 | 260 | 0.4 mm | compliant | S-XQCC-N48 | 不合格 | 1.5 V | COMMERCIAL | 2 mA | 768 CLBS, 30000 GATES | 现场可编程门阵列 | 30000 | 2 | 768 | 30000 | 0.88 mm | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-2VQG80I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 80-VQFP (14x14) | 80 | 3 V | - 40 C | + 85 C | SMD/SMT | 175 MHz | 有 | 微芯片技术 | 90 | Actel | 5.5 V | Tray | A40MX04 | 活跃 | 有 | A40MX04-2VQG80I | 101 MHz | TQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 85 °C | 40 | 3.3 V | -40 °C | PLASTIC/EPOXY | 3 | FLATPACK, THIN PROFILE | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80 | Details | 69 I/O | -40°C ~ 85°C (TA) | Tray | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.65 mm | compliant | S-PQFP-G80 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 1.2 mm | 现场可编程门阵列 | 6000 | 2 ns | 547 | 6000 | 1 mm | 14 mm | 14 mm |
5SGXEA7K2F40C2N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC3S200-5VQ100C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
265.080824
A54SX32A-1BG329
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP060V5-CSG201
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-2PQG100
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-3VQG80
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P400-2FG256
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-3PQG100
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-2PQG100
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-FFGG256
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-PQG100A
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-3PQG160
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-3PQG100
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL090T-FCSG325I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-3TQG176
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-FVQG100
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE1500-1FG484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K100QC240-3
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1K100QC208-2N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
XCV800-4HQ240C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBA1D4F27C4N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXFA5H6F35C6N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6VLX365T-2FF1156I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P030-2QNG48
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX04-2VQG80I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
