N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

231 MHz

STD

24576

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-2FG484

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

0 to 70 °C

Tray

M7A3P1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

147 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

有

40

微芯片技术

Actel

3.6 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

40

70 °C

有

A54SX16-TQG176

240 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

0°C ~ 70°C (TA)

Tray

A54SX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.9 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

有

40

Actel

微芯片技术

5.25 V

Tray

A42MX24

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

LFQFP

105 MHz

A42MX24-2TQG176

有

70 °C

40

3.3 V

PLASTIC/EPOXY

3

FLATPACK, LOW PROFILE, FINE PITCH

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

Details

150 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

310 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

Details

57 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

19

微芯片技术

Actel

0.171777 oz

Tray

A40MX04

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-1PLG68I

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

90

ProASIC3

178

Tray

M1A3P400

微芯片技术

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-1FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

24

IGLOO2

574

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

活跃

Details

81 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

227 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

-40°C ~ 125°C (TA)

Tray

A54SX16A

2.25V ~ 5.25V

2.5 V

24000

1452

STD

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

有

27

微芯片技术

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

30

70 °C

无

A54SX32-1BG329

280 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

0°C ~ 70°C (TA)

Tray

A54SX32

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

有

90

Fusion

0.014110 oz

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

微芯片技术

0 C

+ 70 C

SMD/SMT

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS250-1FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

1282.05 MHz

0°C ~ 85°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

2655 In Stock

• 1: ¥2,102.957984
• 10: ¥1,983.922630
• 100: ¥1,871.625119
• 500: ¥1,765.684073
查看所有的价格

-

10 Weeks

表面贴装

表面贴装

484-BBGA

484

268

-40°C~100°C TJ

Tray

2008

Spartan®-6 LXT

e0

no

活跃

3 (168 Hours)

484

1.14V~1.26V

BOTTOM

BALL

225

1.2V

1mm

not_compliant

30

XC6SLX75

484

268

不合格

1.2V

387kB

862MHz

现场可编程门阵列

74637

3170304

5831

3

93296

0.21 ns

2.6mm

Non-RoHS Compliant

860 In Stock

-

表面贴装

324-BGA

YES

249

0°C~85°C TJ

Tray

Cyclone®

e0

Obsolete

3 (168 Hours)

324

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

220

1.5V

1mm

30

EP1C12

S-PBGA-B324

249

不合格

1.51.5/3.3V

320MHz

249

现场可编程门阵列

12060

239616

1206

2.2mm

19mm

19mm

Non-RoHS Compliant

1260 In Stock

-

11 Weeks

Lead, Tin

表面贴装

表面贴装

900-BBGA, FCBGA

900

DDR3

500

0°C~85°C TJ

Tray

2010

Kintex®-7

e0

活跃

4 (72 Hours)

900

3A991.D

Tin/Lead (Sn63Pb37)

0.97V~1.03V

BOTTOM

BALL

1V

1mm

XC7K325T

500

11.83.3V

1GB

2MB

1818MHz

100 ps

100 ps

现场可编程门阵列

326080

16404480

25475

2

407600

0.61 ns

3.35mm

31mm

31mm

无

Non-RoHS Compliant

270 In Stock

-

6 Weeks

表面贴装

表面贴装

1148-BBGA, FCBGA

804

-40°C~100°C TJ

Tray

2006

Virtex®-II Pro

e0

no

Obsolete

4 (72 Hours)

3A001.A.7.A

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

225

1.5V

1mm

30

XC2VP40

S-PBGA-B1148

804

不合格

1.5V

1.51.5/3.32/2.52.5V

432kB

1200MHz

804

现场可编程门阵列

43632

3538944

4848

6

38784

0.32 ns

3.4mm

35mm

35mm

Non-RoHS Compliant

25 In Stock

-

表面贴装

表面贴装

1152-BBGA, FCBGA

1152

720

0°C~85°C TJ

Tray

2007

Virtex®-II

yes

Obsolete

4 (72 Hours)

EAR99

8542.39.00.01

1.425V~1.575V

XC2V3000

1.5V

216kB

1769472

3000000

3584

6

28672

无

符合RoHS标准

N/A

-

表面贴装

356-LBGA

YES

271

0°C~85°C TJ

Tray

APEX-20KE®

e0

Obsolete

3 (168 Hours)

356

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

220

1.8V

1.27mm

compliant

30

EP20K160

S-PBGA-B356

263

不合格

1.81.8/3.3V

160MHz

1.93 ns

263

可加载 PLD

6400

81920

404000

640

MACROCELL

4

1.63mm

35mm

35mm

Non-RoHS Compliant

2414 In Stock

• 1: ¥821.439531
• 10: ¥774.942954
• 100: ¥731.078255
• 500: ¥689.696467
查看所有的价格

-

12 Weeks

表面贴装

表面贴装

324-LFBGA, CSPBGA

324

210

0°C~100°C TJ

Tray

2010

Artix-7

e1

yes

活跃

3 (168 Hours)

324

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

ALSO OPERATES AT 1V SUPPLY

8542.39.00.01

0.95V~1.05V

BOTTOM

BALL

未说明

0.9V

0.8mm

未说明

324

210

不合格

900mV

0.9V

472.5kB

1098MHz

850 ps

现场可编程门阵列

75520

3870720

5900

94400

1.51 ns

1.5mm

15mm

15mm

ROHS3 Compliant

2000 In Stock

-

表面贴装

表面贴装

144-TFBGA, CSPBGA

144

92

-40°C~100°C TJ

Tray

2001

Virtex®-II

e1

yes

Obsolete

3 (168 Hours)

144

EAR99

1.425V~1.575V

BOTTOM

BALL

260

1.5V

0.8mm

30

XC2V250

144

92

1.5V

54kB

现场可编程门阵列

442368

250000

384

5

3072

0.39 ns

384

1.2mm

12mm

12mm

无

符合RoHS标准

N/A

-

表面贴装

表面贴装

100-LQFP

100

SRAM

78

0°C~85°C TJ

Tray

2000

MachXO

e0

no

Obsolete

3 (168 Hours)

100

EAR99

Tin/Lead (Sn/Pb)

IT CAN ALSO OPERATE AT 2.5V AND 3.3V

8542.39.00.01

1.71V~3.465V

QUAD

鸥翼

240

1.8V

0.5mm

30

LCMXO256

100

78

3.3V

256B

13mA

13mA

0B

4.9 ns

4.9 ns

闪存 PLD

256

500MHz

32

MACROCELL

128

256

7

1.6mm

14mm

14mm

无

Non-RoHS Compliant

无铅

2543 In Stock

-

10 Weeks

表面贴装

表面贴装

484-BBGA

484

268

-40°C~100°C TJ

Tray

2008

Spartan®-6 LXT

e0

no

活跃

3 (168 Hours)

484

3A991.D

Tin/Lead (Sn63Pb37)

1.14V~1.26V

BOTTOM

BALL

225

1.2V

1mm

30

XC6SLX75

484

268

不合格

1.2V

387kB

667MHz

现场可编程门阵列

74637

3170304

5831

2

93296

Non-RoHS Compliant

10000 In Stock

-

表面贴装

256-BBGA

218

-40°C~100°C TJ

Tray

FLEX 6000

Obsolete

3 (168 Hours)

3V~3.6V

EPF6024

1960

24000

196

Non-RoHS Compliant

156 In Stock

-

表面贴装

896-BBGA, FCBGA

YES

416

0°C~85°C TJ

Tray

Arria V GX

e1

Obsolete

3 (168 Hours)

896

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5AGXBA1

S-PBGA-B896

416

不合格

1.11.2/3.32.5V

622MHz

416

现场可编程门阵列

75000

8666112

3537

2.7mm

31mm

31mm

符合RoHS标准

148 In Stock

-

8 Weeks

表面贴装

672-BGA

YES

336

0°C~85°C TJ

Tray

Cyclone® V GX

e1

活跃

3 (168 Hours)

672

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5CGXFC7

S-PBGA-B672

336

不合格

1.11.2/3.32.5V

336

现场可编程门阵列

149500

7880704

56480

2mm

27mm

27mm

符合RoHS标准

1000 In Stock

-

表面贴装

1152-BBGA, FCBGA Exposed Pad

YES

544

-40°C~100°C TJ

Tray

Arria V GX

e0

不用于新设计

3 (168 Hours)

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5AGXFB3

S-PBGA-B1152

544

不合格

1.11.2/3.32.5V

622MHz

544

现场可编程门阵列

362000

19822592

17110

362730

2.7mm

35mm

35mm

符合RoHS标准