N/A

-

Broadcom

ARM Cortex A72

8 GB

2 GB

CSI, DSI, Ethernet, PCIe, USB

- 20 C

+ 85 C

16 GB

eMMC

BCM2711

270

1.5 GHz

5 V

16 GB

55 mm x 40 mm

4 Core

N/A

-

树莓派

-

活跃

55 mm x 40 mm

Broadcom

ARM Cortex A72

8 GB

1 GB

CSI, DSI, Ethernet, PCIe, USB

- 20 C

+ 85 C

eMMC

BCM2711

250

Bulk

-20°C ~ 75°C

Raspberry Pi Compute Module 4 - Colophon - CM4101000

2.170 x 1.570 (55.00mm x 40.00mm)

-

1.5 GHz

5 V

1.5GHz

ARM® Cortex®-A72

GbE

USB 2.0 (1)

55 mm x 40 mm

4 Core

1GB

SDIO

CSI, DPI, DSI, HDMI

I²C, SPI, UART

28

-

-

N/A

-

Broadcom

ARM Cortex A72

8 GB

1 GB

CSI, DSI, Ethernet, PCIe, USB

- 20 C

+ 85 C

16 GB

eMMC

BCM2711

270

1.5 GHz

5 V

16 GB

55 mm x 40 mm

4 Core

N/A

-

2 MB

DDR3L

32 GB

eMMC

X5-E3940

1

84 mm x 55 mm

Details

Intel

Atom

8 GB

4 GB

Audio, Ethernet, GPIO, PCIe, SDIO, SPI, USB

0 C

+ 60 C

SOM-7569

1.6 GHz

4.75 V to 20 V

4 GB

COM Express 2.1

N/A

-

eMMC

X7-E3950

1

84 mm x 55 mm

Details

Intel

8 GB

4 GB

Audio, Ethernet, GPIO, PCIe, SDIO, SPI, USB

0 C

+ 60 C

2 MB

DDR3L

32 GB

SOM-7569

1.6 GHz

4.75 V to 20 V

4 GB

COM Express 2.1

N/A

-

Xilinx

XCZU4EG-1FBVB900E

4 GB

4 GB

Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

7.6 cm x 5.2 cm

4 GB

5.2 cm x 7.6 cm

N/A

-

Xilinx

XCZU4EG-1FBVB900E

4 GB

4 GB

Serial

- 40 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

76 mm x 52 mm

4 GB

5.2 cm x 7.6 cm

N/A

-

64 GB

Flash

1

Open-Q

Details

Qualcomm

SXR2130P

6 GB

USB

- 25 C

+ 85 C

无备用电池

64 GB

LPDDR5

Bulk

2.84 GHz

3.7 V

50 mm x 29 mm

N/A

-

99A8FP

Details

Intel

Core i7-1165G7

16 GB

16 GB

Audio, DP, Ethernet, I2C, PCle, Serial, USB

0 C

+ 100 C

LPDDR4x

Intel Core i7-1165G7

5

NUC

Bulk

NUC 11

4.7 GHz

5.7 VDC to 20 VDC

16 GB

U-Series

N/A

-

Core i7-1185G7

Intel

Details

95 mm x 65 mm x 6 mm

Audio, DP, Ethernet, I2C, PCle, Serial, USB

0 C

+ 100 C

LPDDR4x

Intel Core i7-1185G7

5

NUC

99A8FM

16 GB

16 GB

Bulk

NUC 11

4.8 GHz

5.7 VDC to 20 VDC

16 GB

U-Series

N/A

-

Digi

LPDDR4

8 GB

eMMC

50

Box

活跃

Details

NXP

i.MX 8M Mini Quad

2 GB

2 GB

Ethernet, I2C, PCIe, SPI, UART, USB

- 40 C

+ 85 C

16 kB, 32 kB

-40°C ~ 85°C

ConnectCore® 8M Mini

1.770 L x 1.570 W (45.00mm x 40.00mm)

USB

1.6 GHz

2 GB

1.6GHz

2GB

ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8

Digi SMTplus

MPU核心

-

-

N/A

-

Trenz Electronic GmbH

Xilinx

XC7A100T-2CSG324I

512 MB

512 MB

Ethernet, JTAG, SPI

- 40 C

+ 85 C

1

Bulk

TE0710

活跃

-40°C ~ 85°C

TE0710

1.970 L x 1.570 W (50.00mm x 40.00mm)

萨姆泰克 LSHM

-

3.3 V

100MHz

512MB

Artix-7 A100T

4 cm x 5 cm

FPGA核心

32MB

-

N/A

-

ARM Cortex A53, ARM Cortex R5

4 GB

PCIe, USB

0 C

+ 85 C

128 MB

DDR4

1

ARM

4 GB

N/A

-

表面贴装

Module

Digi

This product may require additional documentation to export from the United States.

Details

NXP

i.MX 8X QuadPlus

2 GB

2 GB

CAN, Ethernet, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, SPI, UART, USB 2.0 OTG, USB 3.0 OTG

- 40 C

+ 85 C

LPDDR4

有

8 GB

eMMC

NXP i.MX8 QuadXPlus

50

10

4

Watchdog

1x PCIe

Tray

CC-MX-JM8

活跃

40 mm x 45 mm x 3.5 mm

-40 to 85 °C

Tray

ConnectCore® 8X

-

1.2 GHz

5 V

2 GB

-

ARM

-

-

-

-

不包括天线

-

Two 10/100/1000

ADC, GPIO, I²C, I²S, PCIe, SDIO, SPI, JTAG, UART, USB

-

1 USB3.0 OTG/1 USB2.0 OTG

-

Digi SMTplus

-

114

N/A

-

表面贴装

Module

Digi

Details

NXP

i.MX 8X QuadPlus

2 GB

1 GB

Bluetooth, CAN, Ethernet, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, SPI, UART, USB 2.0 OTG, USB 3.0 OTG, WiFi

- 40 C

+ 85 C

LPDDR4

有

8 GB

eMMC

NXP i.MX8 QuadXPlus

50

1

4

Tray

CC-WMX

活跃

45 mm x 40 mm x 3.5 mm

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

ConnectCore® 8X

-

1.2 GHz

5 V

1 GB

200Mbps

ARM

-

802.11a/b/g/n, Bluetooth v5.0

17dBm

Bluetooth, WiFi

不包括天线

-

Two 10/100/1000

ADC, GPIO, I²C, I²S, PCIe, SDIO, SPI, JTAG, UART, USB

-

2 USB2.0 Host/1 USB3.0

-

Digi SMTplus

-

2 LVDS

N/A

-

表面贴装

Module

Digi

1 GB

Bluetooth, Ethernet, FlexCAN, GPIO, I2C, I2S/SSI, MIPI-CSI, MIPI-DSI, PCIe, S/PDIF, SPI, UART, USB 3.0 OTG, WiFi

- 40 C

+ 85 C

LPDDR4

有

8 GB

eMMC

NXP i.MX8 DualXZ

50

Tray

CC-WMX

活跃

40 mm x 45 mm x 3.5 mm

This product may require additional documentation to export from the United States.

Details

NXP

i.MX 8X Dual

2 GB

-40°C ~ 85°C

Tray

ConnectCore® 8X

-

1.2 GHz

5 V

1 GB

200Mbps

-

802.11a/b/g/n, Bluetooth v5.0

17dBm

Bluetooth, WiFi

不包括天线

-

ADC, GPIO, I²C, I²S, PCIe, SDIO, SPI, JTAG, UART, USB

-

-

Digi SMTplus

-

N/A

-

表面贴装

201-VFBGA, CSBGA

YES

201-CSP (8x8)

201

微芯片技术

MICROSEMI CORP

VFBGA, BGA201,15X15,20

1.43

250 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA201,15X15,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

120

Tray

AGLP030

活跃

1.425 V

AGLP030V5-CSG201I

有

活跃

-40°C ~ 100°C (TJ)

IGLOO PLUS

e3

Matte Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B201

120

不合格

1.5 V

INDUSTRIAL

120

792 CLBS, 30000 GATES

0.99 mm

现场可编程门阵列

792

30000

STD

792

792

30000

8 mm

8 mm

N/A

-

YES

896

250 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.575 V

1.5 V

40

1.425 V

AGLE3000V5-FGG896

有

Obsolete

MICROSEMI CORP

BGA, BGA896,30X30,40

5.8

e1

锡银铜

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

75264

3000000

31 mm

31 mm

N/A

-

表面贴装

1152-BGA

YES

1152-FPBGA (35x35)

1152

微芯片技术

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.26

180 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

2.7 V

2.5 V

40

712

Tray

APA1000

活跃

2.3 V

APA1000-FGG1152I

有

活跃

-40°C ~ 85°C (TA)

ProASICPLUS

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

2.3V ~ 2.7V

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B1152

712

不合格

2.5,2.5/3.3 V

INDUSTRIAL

712

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

56320

1000000

35 mm

35 mm

N/A

-

表面贴装

144

97

Compliant

AGL400V2-FGG144T

有

活跃

MICROSEMI CORP

5.77

3

30

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

260

compliant

6.8 kB

现场可编程门阵列

9216

400000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

YES

1152

400.011771 mg

1152

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.5 V

40

684

Compliant

1.425 V

AX2000-1FGG1152I

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.29

763 MHz

3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

245

1 mm

compliant

763 MHz

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

2e+06

763 MHz

21504

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

YES

484

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484

5.77

108 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.575 V

1.2 V

40

1.14 V

AGL600V2-FGG484I

有

Transferred

ACTEL CORP

e1

锡银铜

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

235

不合格

1.2/1.5 V

INDUSTRIAL

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

13824

13824

600000

23 mm

23 mm

N/A

-

YES

484

250 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.575 V

1.14 V

1.2 V

40

AGLE600V2-FGG484

有

Obsolete

MICROSEMI CORP

BGA, BGA484,22X22,40

8.58

e1

锡银铜

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

270

不合格

1.2/1.5 V

COMMERCIAL

270

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

13824

13824

600000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

1.575 V

280

Compliant

有

16000 LE

+ 100 C

0.014110 oz

- 40 C

60

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Tray

A3PE1500

活跃

1.425 V

A3PE1500-FGG484I

有

活跃

MICROSEMI CORP

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

5.29

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.575 V

1.5 V

40

1.5000 V

1.425 V

-40 to 85 °C

Tray

A3PE1500

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

231 MHz

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

-

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

276480

1.5e+06

231 MHz

STD

-

38400

38400

38400

1500000

FPGA - Field Programmable Gate Array

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

60

Tray

AGLN060

活跃

1.425 V

AGLN060V5-CSG81I

有

活跃

MICROSEMI CORP

VFBGA,

2.07

3

-40°C ~ 100°C (TJ)

IGLOO nano

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

0.8 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

5 mm

5 mm