N/A

-

204

2-2013310-2

EMBOSS TAPE DDR3 204P 9.2H STD

Double Data Rate (DDR) 3

9.2u2009mmu2009[u2009.362u2009inu2009]

直角

Cable-to-Board

200 ppm/K

4.75 Ohm

0.75 W

通用型

1

5

2.5

84 In Stock

-

LGA 3647

-25 – 100u2009°Cu2009[u2009-13 – 212u2009°Fu2009]

Backplate

2299805-1

NRW BACK PLATE ASSY,SOCKET P0,STUD6.8MM

N/A

-

3.45u2009mmu2009[u2009.136u2009inu2009]

9-1437514-1

8134-HC-6P3LF=PB FREE HOLTITE

Cable-to-Board

.51 – .76u2009mmu2009[u2009.02 – .03u2009inu2009]

开底

1.47u2009mmu2009[u2009.058u2009inu2009]

N/A

-

2-2199154-6

Vertical

Through Hole - Solder

288

Board-to-Board

Double Data Rate (DDR) 4

DDR4 DIMM 288 Pin TH type

N/A

-

6-2308107-5

Vertical

Through Hole - Solder

288

Board-to-Bus Bar

Double Data Rate (DDR) 4

DDR4 DIMM 288 PIN TH TYPE

N/A

-

5-2308107-8

Vertical

Through Hole - Solder

288

Board-to-Bus Bar

Double Data Rate (DDR) 4

DDR4 DIMM 288 PIN TH TYPE

N/A

-

Heyco

Details

PG7

0.105822 oz

50

Heyco

EMC Brass Liquid Tight Cordgrips

液体密封

Wire & Cable Management

线夹

线夹

Cable Glands, Strain Reliefs & Cord Grips

N/A

-

EAR99

Unavailable

M12

50

Heyco

Heyco

Details

EMC Brass Liquid Tight Cordgrips

液体密封

Wire & Cable Management

线夹

线夹

Cable Glands, Strain Reliefs & Cord Grips

N/A

-

表面贴装

Commercial grade

2

27 MHz

VFQFN EP

14, 175 MHz

0 to 70 °C

PLL 时钟发生器

32

2.5 V

Commercial

N/A

-

3M Electronic Specialty

300

3M

IC & Component Sockets

IC & Component Sockets

IC & Component Sockets

N/A

-

3

3M

3M Electronic Specialty

MIL-PRF-20

33 pF

IC & Component Sockets

IC & Component Sockets

IC & Component Sockets

4.83 mm

4.83 x 2.29 x 4.83

N/A

-

200

3M

3M Electronic Specialty

MIL-PRF-55681

0.0012 uF

IC & Component Sockets

IC & Component Sockets

IC & Component Sockets

2.03 mm

2.03 x 1.27 x 1.4

N/A

-

3M Electronic Specialty

5

3M

10 pF

IC & Component Sockets

IC & Component Sockets

IC & Component Sockets

0.6 mm

0.6 x 0.3 x 0.3

N/A

-

N/A

-

.081 – .162

4-1437514-4

322-HCS6P3-100=HOLT CNT SKT RE

3.45u2009mmu2009[u2009.136u2009inu2009]

1.61u2009mmu2009[u2009.064u2009inu2009]

开底

28 – 25

N/A

-

DDR4 DIMM 288 Pin TH type

Double Data Rate (DDR) 4

Board-to-Board

288

Vertical

Through Hole - Solder

2-2199154-1

N/A

-

204

2-2013289-3

EMBOSS TAPE DDR3 204P 5.2H STD Au 0.76

Double Data Rate (DDR) 3

5.2u2009mmu2009[u2009.205u2009inu2009]

直角

Cable-to-Board

20 In Stock

-

50865

.518 – .823

20 – 18

闭底

1.83u2009mmu2009[u2009.072u2009inu2009]

6.6u2009mmu2009[u2009.26u2009inu2009]

SOCKET,MIN-SPR AU SER-4

N/A

-

50871-4

.823 – 1.04

18 – 17

闭底

2.56u2009mmu2009[u2009.101u2009inu2009]

7.32u2009mmu2009[u2009.288u2009inu2009]

SOCKET,MIN-SPR AU SER-5

N/A

-

Vertical

1-2199154-1

DDR4 DIMM 288 Pin TH type

Double Data Rate (DDR) 4

Board-to-Board

288

Through Hole - Solder

N/A

-

Vertical

1-2199154-4

DDR4 DIMM 288 Pin TH type

Double Data Rate (DDR) 4

Board-to-Board

288

Through Hole - Solder

N/A

-

SFP HEATSINK 13.5MM TALL

1542993-2

5, 10, 15

50

针翅

SFP

N/A

-

Tin

Straight

Screw

28 to 16, 28 AWG

Thermoplastic

磷青铜

电缆安装

1-2324271-1

RIGHT SEGMENT LGA4189-4 SOCKETP4 FOR ODM

LGA 4189

Board-to-Board

2092

30

Surface Mount Solder Ball

-40 to 115 °C

接线端子

1

Receptacle

3.5000 mm

Green

7 mm

N/A

-

1.31 – 2.08

2-5050871-4

SOCKET,MIN-SPR W/H SN SER-5

7.32u2009mmu2009[u2009.288u2009inu2009]

2.56u2009mmu2009[u2009.101u2009inu2009]

开底

16 – 14

N/A

-

LGA3647-1 SOCKET-P1 KIT FOR ODM (30U AU)

LGA 3647

Board-to-Board

3647

30

.86, .99

.034, .039

2-2822979-4