类别是'category.应用特定微控制器' (5057)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 内存(字) | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 通信协议 | 信息访问方法 | 数据编码/解码方式 | 饱和电流 | 主机数据传输速率-最大 | 主机接口标准 | 长度 | 宽度 | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | BQ3285S | Unitrode Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | PLASTIC/EPOXY | 70 °C | 0.032 MHz | SOIC-24 | UNITRODE CORP | Transferred | 5 V | 4.5 V | 5.5 V | 小概要 | RECTANGULAR | DUAL | 鸥翼 | unknown | R-PDSO-G24 | 不合格 | COMMERCIAL | TIMER, REAL TIME CLOCK | 8 | PARALLEL, MUXED BUS | ||||||||||||||||||||||||||||||||||||
![]() | PCF85063ATT/A | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | NXP SEMICONDUCTORS | TSSOP, | 0.032 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5.5 V | 0.9 V | 3.3 V | 有 | 活跃 | e4 | EAR99 | 镍钯金 | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 0.65 mm | compliant | 30 | S-PDSO-G8 | INDUSTRIAL | TIMER, REAL TIME CLOCK | 1.1 mm | SERIAL(I2C) | 1 | 3 mm | 3 mm | ||||||||||||||||||||||||
![]() | PN5472A2EV/C20804 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 49 | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 5.5 V | 2.3 V | 3.6 V | 活跃 | NXP SEMICONDUCTORS | VFBGA-49 | 85 °C | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | unknown | R-PBGA-B49 | OTHER | 微处理器电路 | 1 mm | 4.3 mm | 4 mm | |||||||||||||||||||||||||||||||||
![]() | PSB82313M | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2017-10-29 | , | Obsolete | INTEL CORP | 8542.31.00.01 | compliant | RFSoC | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | BGA-784 | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | 活跃 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | XCZU9CG-2SFVC784E | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | XILINX INC | FBGA, BGA78428X28,32 | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | Transferred | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | TMPZ84C42AP-6 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | Obsolete | TOSHIBA CORP | DIP | DIP, | 6.144 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 无 | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-PDIP-T40 | 不合格 | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 10 mA | 4.8 mm | 1 | NO | NO | 8 | 0 | 2 | Z80 | 0.09765625 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | NRZ | 50.7 mm | 15.24 mm | |||||||||||||||
![]() | TXC-06840AIOG | Tri-Star Electronics International | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S82434NXSZ928 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 无 | Obsolete | INTEL CORP | PLASTIC/EPOXY | QFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | |||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-1LFFVB1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1156 | FCBGA-1156 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||||||||||||||||||||||||||||||
![]() | MC2674B4P | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP40,.6 | 70 °C | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||||||
![]() | SST58SD016-70-C-P1H | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 32 | SILICON STORAGE TECHNOLOGY INC | DIP | DIP, DIP32,.6 | 70 °C | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 32 | R-PDIP-T32 | 不合格 | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 5.8 mm | 16 | 1.4 MBps | ATA | 42.6 mm | 15.24 mm | ||||||||||||||||||||||||
![]() | FLI8120 | Genesis Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Transferred | GENESIS MICROCHIP | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ASM3P2579A-06OR | Pulsecore Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | 70 °C | PLASTIC/EPOXY | VSSOP | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 2.625 V | 2.375 V | 2.5 V | 无 | Transferred | PULSECORE SEMICONDUCTOR | TSOT-23, 6 PIN | ALSO OPERATES AT 3.3V SUPPLY | DUAL | 鸥翼 | 未说明 | 0.95 mm | unknown | 未说明 | R-PDSO-G6 | 不合格 | COMMERCIAL | CLOCK GENERATOR, OTHER | 1 mm | 30 MHz | 30 MHz | 2.9 mm | 1.6 mm | ||||||||||||||||||||||||||||
![]() | XCZU3CG-2LSFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 625 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-625 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||
![]() | MB86950BPF-G | FUJITSU Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | QFF, QFL80,.55X.8,32 | 70 °C | PLASTIC/EPOXY | QFF | QFL80,.55X.8,32 | RECTANGULAR | FLATPACK | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | FUJITSU LTD | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | FLAT | 0.8 mm | unknown | R-PQFP-F80 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 40 mA | NO | ASYNC, BIT | |||||||||||||||||||||||||||||
![]() | BCM58201A0KFBG05 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STP2202ABGA | Sun Microsystems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 320 | 网格排列 | SQUARE | BGA320,20X20 | BGA | PLASTIC/EPOXY | 70 °C | BGA, BGA320,20X20 | BGA | SUN MICROSYSTEMS INC | Obsolete | 3.3 V | 3.135 V | 3.465 V | 8542.31.00.01 | BOTTOM | BALL | 1.5 mm | unknown | 320 | S-PBGA-B320 | 不合格 | 微处理器电路 | 758 mA | 2.68 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||
![]() | XCZU3CG-2LSFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | FCBGA-784 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||||||||||
![]() | TDA8002G/5/C2 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | LFQFP, | 85 °C | -25 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 6.5 V | 4.5 V | 5 V | Obsolete | NXP SEMICONDUCTORS | QFP | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 32 | S-PQFP-G32 | 不合格 | OTHER | 微处理器电路 | 1.6 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||||||
![]() | 5962-8501501XA | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | IN-LINE | 5.5 V | 4.5 V | 5 V | Obsolete | INTERSIL CORP | , | 16 MHz | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | unknown | 不合格 | MILITARY | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 2 | NO | YES | 8 | 1 | 80C86; 80C88 | 0.125 MBps | ASYNC, BIT | NRZ | ||||||||||||||||||||||||||||
![]() | 5962-8501501XA | Harris Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | 16 MHz | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | Obsolete | HARRIS SEMICONDUCTOR | , | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | unknown | R-GDIP-T28 | 不合格 | MILITARY | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 3 mA | 2 | NO | YES | 8 | 0 | 1 | 80C86; 80C88 | 0.125 MBps | ASYNC, BIT | NRZ | ||||||||||||||||||||||
![]() | R6545EAP | Rockwell Automation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R6545EAP | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | Obsolete | 康讯系统 | DIP | PLASTIC, DIP-40 | 2 MHz | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 无 | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | 不合格 | COMMERCIAL | DISPLAY CONTROLLER, CRT CHARACTER DISPLAY | 133 mA | 5.08 mm | 1 | 8 | 51.8 mm | 15.24 mm | |||||||||||||||||||||||
![]() | SDIO101AIHR | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 60 | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.95 V | 1.65 V | 1.8 V | Obsolete | NXP SEMICONDUCTORS | HVQCCN, | 85 °C | 8542.31.00.01 | QUAD | 无铅 | 0.5 mm | unknown | S-PQCC-N60 | INDUSTRIAL | 微处理器电路 | 0.5 mm | 5 mm | 5 mm |
BQ3285S
Unitrode Corporation
分类:Embedded - Microcontrollers - Application Specific
PCF85063ATT/A
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
PN5472A2EV/C20804
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
PSB82313M
Intel Corporation
分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-2SFVC784E
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-2SFVC784E
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
TMPZ84C42AP-6
Toshiba America Electronic Components
分类:Embedded - Microcontrollers - Application Specific
TXC-06840AIOG
Tri-Star Electronics International
分类:Embedded - Microcontrollers - Application Specific
S82434NXSZ928
Intel Corporation
分类:Embedded - Microcontrollers - Application Specific
XCZU6EG-1LFFVB1156I
AMD
分类:Embedded - Microcontrollers - Application Specific
MC2674B4P
Freescale Semiconductor
分类:Embedded - Microcontrollers - Application Specific
SST58SD016-70-C-P1H
Silicon Storage Technology
分类:Embedded - Microcontrollers - Application Specific
FLI8120
Genesis Microchip
分类:Embedded - Microcontrollers - Application Specific
ASM3P2579A-06OR
Pulsecore Semiconductor
分类:Embedded - Microcontrollers - Application Specific
XCZU3CG-2LSFVA625I
AMD
分类:Embedded - Microcontrollers - Application Specific
MB86950BPF-G
FUJITSU Limited
分类:Embedded - Microcontrollers - Application Specific
BCM58201A0KFBG05
Broadcom Limited
分类:Embedded - Microcontrollers - Application Specific
STP2202ABGA
Sun Microsystems Inc
分类:Embedded - Microcontrollers - Application Specific
XCZU3CG-2LSFVC784I
AMD
分类:Embedded - Microcontrollers - Application Specific
TDA8002G/5/C2
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
5962-8501501XA
Intersil Corporation
分类:Embedded - Microcontrollers - Application Specific
5962-8501501XA
Harris Semiconductor
分类:Embedded - Microcontrollers - Application Specific
R6545EAP
Rockwell Automation
分类:Embedded - Microcontrollers - Application Specific
R6545EAP
Conexant Systems Inc
分类:Embedded - Microcontrollers - Application Specific
SDIO101AIHR
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
