类别是'category.专用接口IC' (8244)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 通信IC类型 | 总线兼容性 | 最大数据传输率 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 89HPES12N3YCBCG | Integrated Device Technology (IDT) | 数据表 | 350 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 1.5mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
![]() | 89HPES5T5ZBBCGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 196 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 196 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 5 | BUS CONTROLLER, PCI | PCI; SMBUS | 1.4mm | 15mm | 15mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
![]() | 89H12T3BG2ZBBCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Copper, Silver, Tin | 表面贴装 | BGA | 324 | Tape & Reel (TR) | 1999 | PCI Express | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 89HPES5T5ZBBC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 196 | 125MHz | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 196 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 5 | BUS CONTROLLER, PCI | PCI | 15mm | 15mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||
![]() | 89H12NT12G2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 3300mA | 96 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
![]() | MAX24287ETK T | Microsemi | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 68 | Tape & Reel | 2012 | 活跃 | 68 | 85°C | -40°C | SONET | 8542.39.00.01 | QUAD | 1 | 1.2V | 0.4mm | 68 | INDUSTRIAL | Ethernet | ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER | 0.8mm | 8mm | 8mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
![]() | 89HPES12N3AZGBCG | Integrated Device Technology (IDT) | 数据表 | 3 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
![]() | 89HPES4T4ZBBC8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 144 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 144 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | PCI; SMBUS | 1.4mm | 13mm | 13mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
![]() | AMB0483D0RJ | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA | 655 | 2008 | Discontinued | 24.5mm | 19.5mm | 2.55mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 89HPES24T6G2ZBALG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
![]() | 89HPES24T3G2ZCALG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 1.1V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | SMBUS | 625 MBps | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
![]() | 89H32NT8AG2ZCHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 250 | 30 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
![]() | QLX4600SIQT7 | Intersil (Renesas Electronics America) | 数据表 | 817 In Stock | - | 最小起订量: 1 最小包装量: 1 | 19 Weeks | 表面贴装 | QFN EP | 46 | Cut Tape (CT) | 2009 | e4 | 活跃 | 1 (Unlimited) | 46 | Nickel/Palladium/Gold (Ni/Pd/Au) | 70°C | 0°C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 1.2V | 0.4mm | 30 | 46 | 不合格 | 1.2V | COMMERCIAL | 1.3V | 1.1V | 260mA | 260mA | 6.25 Gbps | 电信电路 | 0.75mm | 7mm | 4mm | 无SVHC | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
![]() | 89HT0808PYBABG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 100 | 1999 | yes | 活跃 | 100 | I2C | 9mm | 9mm | 1.7mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 89H32NT24BG2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
![]() | 89H32NT24BG2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
![]() | 89H32NT24AG2ZBHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | 250 | 30 | 484 | 3.3V | PCI Express | 24 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
![]() | 89H24NT6AG2ZBHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 6 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
![]() | 89HPES6T6G2ZCALGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 85°C | -40°C | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
![]() | CA91L8260B-100CEV | Integrated Device Technology (IDT) | 数据表 | 30 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | Copper, Silver, Tin | 表面贴装 | 420 | 2003 | e1 | yes | 活跃 | 3 (168 Hours) | 420 | 3A001.A.3 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 未说明 | 420 | 不合格 | 2.63V | INDUSTRIAL | 2.38V | PCI | 100MHz | MPC825X; MPC826X; MPC827X; MPC8280; MPC74X; MPC75X; POWERPC 7400; POWERPC 740; POWERPC 750 | 2.46mm | 35mm | 35mm | 2.33mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
![]() | 89HPES12N3A1ZCBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | TSI382A-66CQY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | TQFP | 176 | 70°C | 2004 | e3 | yes | 活跃 | 3 (168 Hours) | 176 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.2V | 0.4mm | 176 | 1.26V | COMMERCIAL | 1.14V | PCI | ISA; SBUS; VGA | 312.5 MBps | 1.4mm | 20mm | 20mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
![]() | 89H32NT8AG2ZBHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 225 | not_compliant | 20 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||
![]() | 89HPES6T6G2ZCALGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI | 3.27mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
![]() | 89H12NT12G2ZCHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | 260 | 30 | 324 | 3.3V | PCI Express | 12 | BUS CONTROLLER, PCI | 96 Gbps | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 |
89HPES12N3YCBCG
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES5T5ZBBCGI8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H12T3BG2ZBBCG8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES5T5ZBBC
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H12NT12G2ZBHLG
Integrated Device Technology (IDT)
分类:Interface - Specialized
MAX24287ETK T
Microsemi
分类:Interface - Specialized
89HPES12N3AZGBCG
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES4T4ZBBC8
Integrated Device Technology (IDT)
分类:Interface - Specialized
AMB0483D0RJ
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES24T6G2ZBALG8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES24T3G2ZCALG8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT8AG2ZCHLG8
Integrated Device Technology (IDT)
分类:Interface - Specialized
QLX4600SIQT7
Intersil (Renesas Electronics America)
分类:Interface - Specialized
89HT0808PYBABG8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT24BG2ZBHLG
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT24BG2ZBHLGI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT24AG2ZBHLG8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H24NT6AG2ZBHL
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES6T6G2ZCALGI8
Integrated Device Technology (IDT)
分类:Interface - Specialized
CA91L8260B-100CEV
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES12N3A1ZCBCG
Integrated Device Technology (IDT)
分类:Interface - Specialized
TSI382A-66CQY
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT8AG2ZBHLI8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES6T6G2ZCALGI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H12NT12G2ZCHLGI8
Integrated Device Technology (IDT)
分类:Interface - Specialized
