类别是'category.微处理器' (10000)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 外部中断数量 | 保安功能 | 显示和界面控制器 | DMA通道数 | 职系 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | P1750A-15CMB | Pyramid Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 64 | 无 | 活跃 | PYRAMID SEMICONDUCTOR CORP | DIP | BRAZE, DIP-64 | 15 MHz | 125 °C | -55 °C | UNSPECIFIED | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 无 | 3A001.A.2.C | TWO PROGRAMMABLE TIMERS | 8542.31.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1.27 mm | compliant | 未说明 | 64 | R-XDIP-T64 | 不合格 | MILITARY | 15 MHz | MICROPROCESSOR | 16 | 4.191 mm | 16 | NO | YES | MIL-STD-883 Class B | 16 | 浮点 | NO | 42.2402 mm | 15.24 mm | ||||||||||||||||||||||||||||||
![]() | MC68030RC25B | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMP68HC000F-12 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | Obsolete | TOSHIBA CORP | QFP | QFP, | 12.5 MHz | 70 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 5.25 V | 4.75 V | 5 V | 无 | e0 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 1 mm | unknown | 64 | R-PQFP-G64 | 不合格 | COMMERCIAL | 12.5 MHz | MICROPROCESSOR | 35 mA | 16 | 3.05 mm | 23 | NO | YES | 16 | 固定点 | NO | 0 | 7 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | PPC440SP-RNC533C | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 783 | Obsolete | APPLIED MICRO CIRCUITS CORP | BGA | BGA, BGA783,28X28,40 | 666.66 MHz | PLASTIC/EPOXY | BGA | BGA783,28X28,40 | SQUARE | 网格排列 | 1.6 V | 1.4 V | 1.5 V | 有 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | 783 | S-PBGA-B783 | 不合格 | 533 MHz | MICROPROCESSOR, RISC | 3000 mA | 32 | 3.27 mm | 32 | YES | YES | 64 | 固定点 | YES | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||
![]() | MC6800CL | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | CERAMIC | -40 °C | 85 °C | DIP, DIP40,.6 | MOTOROLA SEMICONDUCTOR PRODUCTS | Obsolete | 无 | IN-LINE | RECTANGULAR | DIP40,.6 | DIP | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | 不合格 | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PC7410VG500LE | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 360 | BGA | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | 133 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | BGA360,19X19,50 | SQUARE | 网格排列 | 1.9 V | 1.7 V | 1.8 V | Obsolete | TELEDYNE E2V (UK) LTD | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 360 | S-CBGA-B360 | 不合格 | 500 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | 浮点 | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||
![]() | PC7410VG500LE | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 360 | BGA | BGA, BGA360,19X19,50 | 133 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | BGA360,19X19,50 | SQUARE | 网格排列 | 1.9 V | 1.7 V | 1.8 V | Transferred | ATMEL CORP | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | 不合格 | 500 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | 浮点 | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||
![]() | MPC8548VTATGA | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 783 | 有 | Obsolete | FREESCALE SEMICONDUCTOR INC | BGA | 29 X 29 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-783 | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA783,28X28,40 | SQUARE | 网格排列 | 1.155 V | 1.045 V | 1.1 V | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | not_compliant | 40 | 783 | S-PBGA-B783 | 不合格 | SoC | 3.38 mm | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | TMPZ84C00AP-10 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | TOSHIBA CORP | DIP | DIP, | 10 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | Obsolete | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-PDIP-T40 | 不合格 | INDUSTRIAL | 10 MHz | MICROPROCESSOR | 50 mA | 8 | 4.8 mm | 16 | NO | YES | 8 | 固定点 | NO | 0 | 2 | 50.7 mm | 15.24 mm | |||||||||||||||||||||||||||||||||
![]() | XPC860ENZP66C1 | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 357 | Obsolete | MOTOROLA INC | BGA | BGA, BGA357,19X19,50 | 66 MHz | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | 网格排列 | 3.465 V | 3.135 V | 3.3 V | 无 | e0 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | 不合格 | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | 32 | 25 mm | 25 mm | |||||||||||||||||||||||||||||||||||||||
![]() | MC68LC060FE50 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | QFP, | 50 MHz | CERAMIC, METAL-SEALED COFIRED | QFP | SQUARE | FLATPACK | 3.465 V | 3.135 V | 3.3 V | Obsolete | FREESCALE SEMICONDUCTOR INC | QFP | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 2.54 mm | unknown | 208 | S-CQFP-G208 | 不合格 | 50 MHz | MICROPROCESSOR | 32 | 4.15 mm | 32 | YES | NO | 32 | 浮点 | YES | 27.305 mm | 27.305 mm | |||||||||||||||||||||||||||||||||||||||
![]() | IBM27-82353B | IBM | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM6232ATGGHIALWR | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 425-VFBGA, FCCSPBGA | 425-FCCSP (13x13) | -40°C ~ 125°C (TJ) | Tape & Reel (TR) | Sitara™ | 活跃 | 1.4GHz | ARM® Cortex®-A53 | 1.1V, 1.2V, 1.8V, 3.3V | 10/100/1000Mbps (2) | 2 Core, 64-Bit | 无 | DDR4, LPDDR4 | USB 2.0 (2) | DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART | ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™ | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | LVDS, MIPI/CSI, MIPI-DPI, OLDI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PR3000A-33MQ160C | Pyramid Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | 无 | Obsolete | PERFORMANCE SEMICONDUCTOR CORP | QFP | QFP, QFP160,1.2SQ | 66 MHz | 70 °C | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | 5.25 V | 4.75 V | 5 V | e0 | 3A991.A.2 | 锡铅 | 28 VAX MIPS; 5 PIPELINE STAGES | 8542.31.00.01 | QUAD | 鸥翼 | 0.64 mm | unknown | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 33 MHz | MICROPROCESSOR, RISC | 700 mA | 32 | 3.85 mm | 32 | NO | NO | 32 | 固定点 | NO | 0 | 6 | 27.65 mm | 27.65 mm | |||||||||||||||||||||||||||||
![]() | XPC860DPZP66D3 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 357 | BGA | BGA, BGA357,19X19,50 | 66 MHz | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | 网格排列 | 3.465 V | 3.135 V | 3.3 V | Obsolete | FREESCALE SEMICONDUCTOR INC | 5A991 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | 不合格 | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | 固定点 | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||
![]() | MIMX8UD7CVP08SC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 485-LFBGA | 485-LFBGA (15x15) | Tray | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IBMPPC750FX-GB25-3T | IBM | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Bulk | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S32G234MABK1VUCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | AEC-Q100 | -40°C ~ 105°C (TA) | Tape & Reel (TR) | 活跃 | 400MHz | ARM? Cortex?-M7 | 1.2V, 1.8V, 2.5V, 3.3V | 1/2.5Gbps (4) | 3 Core, 32/64-Bit | 无 | DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | Multimedia; NEON | Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | 汽车 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S32G274AABK1VUCT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | AEC-Q100 | -40°C ~ 105°C (TA) | Tray | 活跃 | 400MHz, 1GHz | ARM? Cortex?-A53, ARM? Cortex?-M7 | 1.2V, 1.8V, 2.5V, 3.3V | 1/2.5Gbps (4) | 3 Core, 64-Bit/4 Core, 32-Bit | 无 | DDR3L, LPDDR4 | USB 2.0 OTG (1) | DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | Multimedia; NEON | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | 汽车 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RDPXA261B1C400 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 294 | BGA, | 3.6864 MHz | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.43 V | 1.235 V | 1.3 V | Obsolete | INTEL CORP | BGA | 8542.31.00.01 | BOTTOM | BALL | unknown | 294 | S-PBGA-B294 | 不合格 | 400 MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | 固定点 | YES | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC855TZP80D4 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C80186-3 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C80186-3 | AMD | 数据表 | 19 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 无 | Obsolete | ADVANCED MICRO DEVICES INC | LCC | CERAMIC, LCC-68 | 16 MHz | 70 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC68A,.95SQ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | e0 | 锡铅 | 8542.31.00.01 | QUAD | 无铅 | 1.27 mm | unknown | 68 | S-CQCC-N68 | 不合格 | COMMERCIAL | 8 MHz | MICROPROCESSOR | 550 mA | 16 | 3.048 mm | 20 | NO | NO | 16 | 固定点 | NO | 0 | 5 | 2 | 24.13 mm | 24.13 mm | ||||||||||||||||||||||||||||||
![]() | SAB80186-1-N | Siemens | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 70 °C | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | Transferred | 西门子 A G | , | 20 MHz | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | J BEND | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 10 MHz | MICROPROCESSOR | 550 mA | 16 | 20 | NO | NO | 16 | 固定点 | NO | 0 | 5 | 2 | ||||||||||||||||||||||||||||||||||||||||
![]() | SAB80186-1-N | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 无 | Obsolete | INFINEON TECHNOLOGIES AG | LCC | PLASTIC, LCC-68 | 20 MHz | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | e0 | 锡铅 | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 68 | S-PQCC-J68 | 不合格 | COMMERCIAL | 10 MHz | MICROPROCESSOR | 550 mA | 16 | 5.1 mm | 20 | NO | NO | 16 | 固定点 | NO | 24.3 mm | 24.3 mm |
P1750A-15CMB
Pyramid Semiconductor Corporation
分类:Embedded - Microprocessors
MC68030RC25B
Motorola Semiconductor Products
分类:Embedded - Microprocessors
TMP68HC000F-12
Toshiba America Electronic Components
分类:Embedded - Microprocessors
PPC440SP-RNC533C
Applied Micro Circuits Corporation
分类:Embedded - Microprocessors
MC6800CL
Freescale Semiconductor
分类:Embedded - Microprocessors
PC7410VG500LE
Teledyne e2v
分类:Embedded - Microprocessors
PC7410VG500LE
Atmel Corporation
分类:Embedded - Microprocessors
MPC8548VTATGA
Freescale Semiconductor
分类:Embedded - Microprocessors
TMPZ84C00AP-10
Toshiba America Electronic Components
分类:Embedded - Microprocessors
XPC860ENZP66C1
Motorola Mobility LLC
分类:Embedded - Microprocessors
MC68LC060FE50
Freescale Semiconductor
分类:Embedded - Microprocessors
IBM27-82353B
IBM
分类:Embedded - Microprocessors
AM6232ATGGHIALWR
Texas Instruments
分类:Embedded - Microprocessors
PR3000A-33MQ160C
Pyramid Semiconductor Corporation
分类:Embedded - Microprocessors
XPC860DPZP66D3
Freescale Semiconductor
分类:Embedded - Microprocessors
MIMX8UD7CVP08SC
NXP USA Inc.
分类:Embedded - Microprocessors
IBMPPC750FX-GB25-3T
IBM
分类:Embedded - Microprocessors
S32G234MABK1VUCR
NXP USA Inc.
分类:Embedded - Microprocessors
S32G274AABK1VUCT
NXP USA Inc.
分类:Embedded - Microprocessors
RDPXA261B1C400
Intel Corporation
分类:Embedded - Microprocessors
MPC855TZP80D4
Freescale Semiconductor
分类:Embedded - Microprocessors
C80186-3
Intel Corporation
分类:Embedded - Microprocessors
C80186-3
AMD
分类:Embedded - Microprocessors
SAB80186-1-N
Siemens
分类:Embedded - Microprocessors
SAB80186-1-N
Infineon Technologies AG
分类:Embedded - Microprocessors
