类别是'category.片上系统(SoC)' (7695)

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底架

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表面安装

越来越多的功能

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供应商器件包装

材料

介电材料

房屋材料

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中心触点材料

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HTS代码

电容量

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子类别

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Reach合规守则

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频率稳定性

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JESD-30代码

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电源

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通道数量

负载电容

阻抗

导线/电缆种类

连接器样式

端口的数量

速度

内存大小

电压 - 正向 (Vf) (类型)

核心处理器

电阻数

周边设备

程序内存大小

连接方式

输入类型

建筑学

配套周期

触点终端

输入数量

电路型态

座位高度-最大

可编程逻辑类型

产品类别

工作温度范围

包括

上升/下降时间(Typ)

输出/通道电流

电压 - 输出(最大值)

插入损耗

最大直流驱动电流(If)

本体饰面

输出格式

电缆组件

屏蔽终止

主要属性

电流传输比(最大)

接通 / 关断时间(典型值)

逻辑单元数

Vce 饱和度(最大值)

核数量

闪光大小

产品

特征

产品类别

应力消除

知识产权评级

高度

长度

宽度

XCZU43DR-1FFVE1156I
XCZU43DR-1FFVE1156I
AMD 数据表

597 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

4

卡洛·加瓦齐

卡洛·加瓦齐

366

Tray

活跃

-40°C ~ 100°C (TJ)

GMB63

断路器

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

断路器

XCZU5EV-1SFVC784E
XCZU5EV-1SFVC784E
AMD 数据表

531 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

0.008466 oz

250

PCB 安装

TT Electronics

Welwyn Components / TT Electronics

Details

252

Tray

XCZU5

0°C ~ 100°C (TJ)

弹药包

RC

Resistors

Metal Film

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

金属膜电阻器

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

Metal Film Resistors - Through Hole

AGFB022R31C2I3E
AGFB022R31C2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

1SX040HH3F35I3VG
1SX040HH3F35I3VG
Intel 数据表

837 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

TE Connectivity / AMP

TE Connectivity

1000

374

Tray

活跃

-40°C ~ 100°C (TJ)

Stratix® 10 SX

Wire & Cable Management

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Wire Labels & Markers

FPGA - 400K Logic Elements

-

Wire Labels & Markers

AGFA022R24C2I3E
AGFA022R24C2I3E
Intel 数据表

935 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

AGIB027R29A1E2VR0
AGIB027R29A1E2VR0
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

1

3-1192074-9

TE Connectivity

TE Connectivity / Raychem

N

720

Tray

活跃

0°C ~ 100°C (TJ)

Tray

Agilex I

Circular Connectors

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Circular MIL Spec Strain Reliefs & Adapters

FPGA - 2.7M Logic Elements

-

Circular MIL Spec Strain Reliefs & Adapters

AGFB027R24C3E3V
AGFB027R24C3E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

1

TE Connectivity

TE Connectivity / Raychem

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

数据总线组件

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

数据总线微耦合器

FPGA - 2.7M Logic Elements

-

Data Bus Components - Microcouplers

AGIB027R31B2E1V
AGIB027R31B2E1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

-

-

-

-

-

-

-

TE Connectivity Laird

Bulk

CBMUHF

Obsolete

720

-

-

Plug, Male Pin

Threaded

-

-

-

UHF, Mini

1

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

Crimp

-

-

-

RG-58

-

FPGA - 2.7M Logic Elements

-

-

AGIB019R18A2E2V
AGIB019R18A2E2V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, Gull Wing

4-SMD

Fairchild Semiconductor

50% @ 5mA

Bulk

Obsolete

480

-40°C ~ 100°C

-

3750Vrms

Transistor

1

1.4GHz

256KB

1.3V (Max)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

AC, DC

MPU, FPGA

3µs, 3µs

80mA

40V

50 mA

FPGA - 1.9M Logic Elements

300% @ 5mA

-

300mV

-

XCVM1302-2MSENBVB1024
XCVM1302-2MSENBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

5 mm x 3.2 mm

1024-BGA (31x31)

AMD 赛灵思

SMD/SMT

CTS

CTS电子元件

Details

316

Tray

活跃

+ 85 C

3.3 V

- 40 C

1000

3.3 V

0°C ~ 100°C (TJ)

Reel

636

Oscillators

75 MHz

50 PPM

SMD/SMT

800 mV

15 pF

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

标准振荡器

HCMOS, TTL

Versal™ Prime FPGA, 70k Logic Cells

-

标准时钟振荡器

1.3 mm

5 mm

3.2 mm

XCVM1402-1LSENBVB1024
XCVM1402-1LSENBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Tin

1024-BFBGA

1024-BGA (31x31)

AMD 赛灵思

Non-Compliant

+ 100 C

0 C

1

Xilinx

Xilinx

424

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

700 mV

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 1.2M Logic Cells

-

SoC FPGA

XCVM1302-2LLENBVB1024
XCVM1302-2LLENBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Cable

1024-BFBGA

1024-BGA (31x31)

AMD 赛灵思

Compliant

Xilinx

Xilinx

1

0 C

+ 110 C

316

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

Shielded

700 mV

Data

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 70k Logic Cells

-

SoC FPGA

MPFS160T-1FCVG484T2
MPFS160T-1FCVG484T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

微芯片技术

MCU - 136, FPGA - 108

Tray

活跃

-40°C ~ 125°C (TJ)

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

128KB

AGID023R18A2E3E
AGID023R18A2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

1206

3216

0.000705 oz

3000

PCB 安装

TT Electronics

Welwyn Components / TT Electronics

480

Tray

0°C ~ 100°C (TJ)

Reel

PWC

Resistors

厚膜

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

厚膜电阻器

FPGA - 2.3M Logic Elements

-

-

Thick Film Resistors - SMD

AGFB022R31C2E2VAA
AGFB022R31C2E2VAA
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU6CG-1FFVB1156E
XCZU6CG-1FFVB1156E
AMD 数据表

625 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Steel

AMD

IP54

Other

Other

328

Bulk

XCZU6

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

800

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

1800

1200

AGFA022R31C2E4X
AGFA022R31C2E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XC7Z014S-1CLG484I
XC7Z014S-1CLG484I
AMD 数据表

2979 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Metal

AMD

200

Support rail

活跃

XC7Z014

Tray

-40°C ~ 100°C (TJ)

Zynq®-7000

15

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 65K Logic Cells

-

35

745

AGFA006R16A2I3V
AGFA006R16A2I3V
Intel 数据表

522 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

384

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

AGFA027R25A3I3E
AGFA027R25A3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Silver

电缆安装

-

-

Metal, Polymer

Intel

M16

Straight

300 V

+85°C

-40°C

Solder

624

Tray

活跃

-40°C ~ 100°C (TJ)

Signalmate C091

5.0A

6

Male

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

IP40

XCZU7EG-1FFVF1517E
XCZU7EG-1FFVF1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

464

Tray

XCZU7

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

10AS027H3F34E2LG
10AS027H3F34E2LG
ALTERA 数据表

945 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-1152

YES

不锈钢

1152

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

10AS027H3F34E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

384

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

965284

Intel

Intel / Altera

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

35 mm

35 mm

XQZU59DR-L2FSQF1760I
XQZU59DR-L2FSQF1760I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SOM-16

16

AEC-Q200

3.9 kOhms

+ 125 C

0.035274 oz

- 55 C

2000

Bourns

Bourns

Details

Reel

4800P

2 %

100 PPM / C

Resistors

SMD/SMT

1.27 mm

8

Isolated

Resistor Networks & Arrays

- 55 C to + 125 C

Networks

Resistor Networks & Arrays

2.03 mm

9.53 mm

7.62 mm

1SX040HH3F35I2VG
1SX040HH3F35I2VG
Intel 数据表

870 In Stock

-

最小起订量: 1

最小包装量: 1

1206 (3216 metric)

1152-FBGA (35x35)

Intel

1206

3216

1.5 nF

+ 125 C

0.000952 oz

- 55 C

15000

0.0015 uF

Vishay

100 VDC

Vishay / Vitramon

Details

Class 1

374

Tray

活跃

-40°C ~ 100°C (TJ)

Reel

VJ W1BC Basic Comm

1 %

Flexible (Soft)

1500 pF

Capacitors

SMD/SMT

C0G (NP0)

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

陶瓷电容器

FPGA - 400K Logic Elements

-

通用型MLCC

Multilayer Ceramic Capacitors MLCC - SMD/SMT

0.8 mm

3.2 mm

1.6 mm

BCM53570B0IFSBG
BCM53570B0IFSBG
Broadcom 数据表

148 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Broadcom Limited

1

Positronic

Amphenol Positronic

Details

-

Tray

活跃

-

-

D-Sub Connectors

Si

1.25GHz

-

ARM® Cortex®-A9, ARM® Cortex®-R5

SERDES

ACL, MAC, QSGMII

MPU

Mixed Contact D-Sub Connectors

-

-

D-Sub Mixed Contact Connectors