类别是'category.片上系统(SoC)' (7695)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

包装/外壳

表面安装

供应商器件包装

终端数量

Core

厂商

操作温度

包装

系列

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

座位高度-最大

可编程逻辑类型

速度等级

主要属性

逻辑单元数

核数量

闪光大小

长度

宽度

无铅

M2S050TS-FCSG325
M2S050TS-FCSG325
Microchip Technology 数据表

2966 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

4695 LAB

176

200

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56340 LE

有

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S010T-1FGG484
M2S010T-1FGG484
Microchip Technology 数据表

182 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

-

64 kB

12084 LE

有

1007 LAB

60

1.2000 V

233

Tray

M2S010

活跃

Details

SMD/SMT

166 MHz

-

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 10K Logic Modules

1 Core

256KB

M2S025-FCS325
M2S025-FCS325
Microchip Technology 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

2308 LAB

176

180

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

有

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S060T-FCS325
M2S060T-FCS325
Microchip Technology 数据表

2812 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

176

微芯片技术

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S060T-FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

M2S025T-VF400
M2S025T-VF400
Microchip Technology 数据表

2771 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

27696 LE

有

2308 LAB

90

微芯片技术

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S025T-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

STD

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

M2S010-VF256I
M2S010-VF256I
Microchip Technology 数据表

163 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (14x14)

256

ARM Cortex M3

1007 LAB

微芯片技术

119

138

Tray

M2S010

活跃

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

无

M2S010-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S150-FCSG536I
M2S150-FCSG536I
Microchip Technology 数据表

2234 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

ARM Cortex M3

微芯片技术

146124 LE

有

12177 LAB

90

293

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S060-VFG400I
M2S060-VFG400I
Microchip Technology 数据表

2735 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

4710 LAB

90

微芯片技术

SmartFusion2

1.2000 V

207

Tray

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

有

M2S060-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

有

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S050T-FCS325
M2S050T-FCS325
Microchip Technology 数据表

2320 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S050T-FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S050-1FCSG325I
M2S050-1FCSG325I
Microchip Technology 数据表

2957 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

有

4695 LAB

微芯片技术

176

1.2000 V

200

Tray

M2S050

活跃

5.76

1.26 V

MICROSEMI CORP

活跃

SQUARE

TFBGA

M2S050-1FCSG325I

有

1.14 V

40

1.2 V

BGA325,21X21,20

PLASTIC/EPOXY

3

GRID ARRAY, THIN PROFILE, FINE PITCH

TFBGA, BGA325,21X21,20

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

-40 to 100 °C

Tray

SmartFusion2

e1

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

无铅

M2S050T-1FG896
M2S050T-1FG896
Microchip Technology 数据表

2426 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-896

896-FBGA (31x31)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

27

1.2000 V

1.14 V

1.26 V

377

Tray

M2S050

活跃

0 to 85 °C

Tray

SmartFusion2

896

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

M2S060TS-1VF400
M2S060TS-1VF400
Microchip Technology 数据表

2683 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

1.2 V

1.14 V

1.26 V

207

Tray

M2S060

活跃

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 60K Logic Modules

1 Core

256KB

M2S090-1FG676
M2S090-1FG676
Microchip Technology 数据表

2055 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-676

YES

676-FBGA (27x27)

676

ARM Cortex M3

86316 LE

有

7193 LAB

微芯片技术

40

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

无

M2S090-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S010-VFG256
M2S010-VFG256
Microchip Technology 数据表

2 In Stock

-

最小起订量: 1

最小包装量: 1

256-LBGA

YES

256-FPBGA (17x17)

256

ARM Cortex M3

166 MHz

-

-

64 kB

12084 LE

138 I/O

0 C

微芯片技术

+ 85 C

有

1007 LAB

119

0.406091 oz

1.2000 V

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

有

M2S010-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

This product may require additional documentation to export from the United States.

Details

SMD/SMT

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S005-VF400
M2S005-VF400
Microchip Technology 数据表

50 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

6060 LE

有

505 LAB

90

微芯片技术

1.2000 V

1.14 V

1.26 V

169

Tray

M2S005

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S005-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

STD

FPGA - 5K Logic Modules

4956

1 Core

128KB

17 mm

17 mm

M2S060-FCS325
M2S060-FCS325
Microchip Technology 数据表

2906 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

176

微芯片技术

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S060-FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

M2S025-1FCSG325I
M2S025-1FCSG325I
Microchip Technology 数据表

50 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

有

2308 LAB

微芯片技术

176

8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85

180

Tray

M2S025

活跃

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S025-1FCSG325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

PLASTIC/EPOXY

3

GRID ARRAY, THIN PROFILE, FINE PITCH

FBGA-325

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S005-1TQG144
M2S005-1TQG144
Microchip Technology 数据表

50 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-144

144-TQFP (20x20)

ARM Cortex M3

微芯片技术

SMD/SMT

166 MHz

-

-

0.046530 oz

60

505 LAB

有

6060 LE

64 kB

84

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S005-1VF400I
M2S005-1VF400I
Microchip Technology 数据表

50 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

6060 LE

有

505 LAB

微芯片技术

90

1.14 V

1.26 V

169

Tray

M2S005

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

无

M2S005-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.86

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 5K Logic Modules

4956

1 Core

128KB

17 mm

17 mm

M2S060TS-FGG676
M2S060TS-FGG676
Microchip Technology 数据表

2269 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S060T-FG484I
M2S060T-FG484I
Microchip Technology 数据表

2075 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

56520 LE

有

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S025T-1FCSG325I
M2S025T-1FCSG325I
Microchip Technology 数据表

2390 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

64 kB

27696 LE

有

2308 LAB

176

180

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S150TS-1FCVG484
M2S150TS-1FCVG484
Microchip Technology 数据表

563 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

YES

484-FBGA (19x19)

484

ARM Cortex M3

84

微芯片技术

273

Tray

M2S150

活跃

VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

M2S150TS-1FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

无

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

19 mm

19 mm

M2S150-FCVG484
M2S150-FCVG484
Microchip Technology 数据表

2148 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

84

1.2000 V

1.14 V

1.26 V

273

Tray

M2S150

活跃

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 150K Logic Modules

1 Core

512KB

M2S060T-1FGG484
M2S060T-1FGG484
Microchip Technology 数据表

2229 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

56520 LE

有

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB