类别是'category.专用模块' (1062)

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Rohs

表面安装

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Date Of Intro

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

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JESD-30代码

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电源电压-最大值(Vsup)

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端口的数量

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内存IC类型

输出启用

混合内存类型

长度

宽度

PF38F4050M0Y1Q0
PF38F4050M0Y1Q0
Numonyx Memory Solutions 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

64000000

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

Obsolete

NUMONYX

BGA

TFBGA,

67108864 words

EAR99

FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16

8542.32.00.71

BOTTOM

BALL

未说明

1

0.8 mm

unknown

未说明

88

R-PBGA-B88

不合格

1.95 V

1.7 V

SYNCHRONOUS

64MX16

1.2 mm

16

1073741824 bit

存储器电路

10 mm

8 mm

PF38F4050M0Y1Q0
PF38F4050M0Y1Q0
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

Transferred

INTEL CORP

BGA

TFBGA, BGA107,9X12,32

70 ns

3

67108864 words

64000000

PLASTIC/EPOXY

TFBGA

BGA107,9X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

e1

EAR99

锡银铜

FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

1.95 V

1.7 V

SYNCHRONOUS

64MX16

1.2 mm

16

0.00025 A

1073741824 bit

存储器电路

FLASH+PSRAM

10 mm

8 mm

MC2210130-002-C
MC2210130-002-C
ATGBICS 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TC518129AFWL-80
TC518129AFWL-80
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

SOIC

80 ns

131072 words

128000

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

Obsolete

TOSHIBA CORP

e0

锡铅

CE/AUTO/SELF REFRESH

DUAL

鸥翼

240

1

1.27 mm

unknown

未说明

32

R-PDSO-G32

不合格

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

128KX8

3-STATE

2.8 mm

8

1048576 bit

PARALLEL

PSEUDO STATIC RAM

YES

20.6 mm

10.7 mm

M6MGB64BM34CWG-P
M6MGB64BM34CWG-P
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete

RENESAS TECHNOLOGY CORP

,

EAR99

8542.32.00.71

unknown

RD28F1602C3T90
RD28F1602C3T90
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

66

INTEL CORP

BGA

LFBGA, BGA68,8X12,32

90 ns

1048576 words

1000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA68,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

Obsolete

EAR99

SRAM IS ORGANIZED AS 256K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

66

R-PBGA-B66

不合格

3.3 V

商业扩展

2.7 V

ASYNCHRONOUS

0.055 mA

1MX16

1.4 mm

16

0.000035 A

16777216 bit

存储器电路

FLASH+SRAM

10 mm

8 mm

RD38F3040L0YTQ0
RD38F3040L0YTQ0
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

GRID ARRAY, THIN PROFILE, FINE PITCH

RECTANGULAR

BGA88,8X12,32

TFBGA

PLASTIC/EPOXY

-25 °C

85 °C

8000000

8388608 words

85 ns

TFBGA, BGA88,8X12,32

BGA

INTEL CORP

Obsolete

1.8 V

e0

EAR99

锡铅

CONTAINS 32M BIT PSRAM

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

2 V

OTHER

1.7 V

SYNCHRONOUS

0.035 mA

8MX16

1.2 mm

16

0.0001 A

134217728 bit

存储器电路

FLASH+PSRAM

10 mm

8 mm

RD38F2030W0ZTQ0
RD38F2030W0ZTQ0
Numonyx Memory Solutions 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

-25 °C

PLASTIC/EPOXY

FBGA

BGA88,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

Transferred

NUMONYX

FBGA, BGA88,8X12,32

85 °C

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

unknown

R-PBGA-B88

不合格

OTHER

0.055 mA

0.000005 A

存储器电路

FLASH+PSRAM

RD38F2030W0ZTQ0
RD38F2030W0ZTQ0
Micron Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

-25 °C

PLASTIC/EPOXY

FBGA

BGA88,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

Obsolete

MICRON TECHNOLOGY INC

FBGA, BGA88,8X12,32

85 °C

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

unknown

R-PBGA-B88

不合格

OTHER

0.055 mA

0.000005 A

存储器电路

FLASH+PSRAM

MCM66734P
MCM66734P
Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP24,.6

70 °C

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T24

不合格

COMMERCIAL

S71GL032NA0BFW0U0
S71GL032NA0BFW0U0
Spansion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

Obsolete

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

3

2097152 words

2000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

e1

EAR99

锡银铜

PSRAM IS ORGANIZED AS 1M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

56

R-PBGA-B56

不合格

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

2MX16

1.2 mm

16

33554432 bit

存储器电路

9 mm

7 mm

RD38F3352LLZDQ0
RD38F3352LLZDQ0
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

Obsolete

INTEL CORP

BGA

LFBGA, BGA88,8X12,32

85 ns

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA88,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 V

e0

EAR99

锡铅

ALSO CONTAINS 128M BIT FLASH; CONTAINS 64M BIT PSRAM; CONTAINS 8 M BIT SRAM

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

2 V

OTHER

1.7 V

SYNCHRONOUS

0.045 mA

8MX16

1.4 mm

16

0.00015 A

134217728 bit

存储器电路

FLASH+PSRAM

13 mm

11 mm

M5M27C128K-2
M5M27C128K-2
Mitsubishi Electric 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

DIP,

200 ns

16384 words

16000

70 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5 V

Obsolete

MITSUBISHI ELECTRIC CORP

e0

EAR99

锡铅

8542.32.00.71

DUAL

THROUGH-HOLE

1

unknown

R-PDIP-T28

5.25 V

COMMERCIAL

4.75 V

ASYNCHRONOUS

16KX8

8

131072 bit

PARALLEL

S71PL256ND0HFW5B0
S71PL256ND0HFW5B0
Spansion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

Obsolete

SPANSION INC

BGA

8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84

70 ns

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

e1

EAR99

锡银铜

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

84

R-PBGA-B84

不合格

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

16MX16

1.2 mm

16

268435456 bit

存储器电路

FLASH+PSRAM

11.6 mm

8 mm

M4-4103S-Z2
M4-4103S-Z2
Moujen Switch 数据表

N/A

-

最小起订量: 1

最小包装量: 1

MSM514212-34
MSM514212-34
OK International 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SST34WA1601-70-5E-MVJE
SST34WA1601-70-5E-MVJE
Microchip Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

MICROCHIP TECHNOLOGY INC

BGA

6 X 8 MM, 0.92 MM HEIGHT, 0.30 MM BALL, ROHS COMPLIANT, MO-225, VFBGA-44

1048576 words

1000000

85 °C

-20 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.8 V

活跃

EAR99

ZERO DENSITY PSRAM

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

compliant

40

44

R-PBGA-B44

不合格

1.95 V

OTHER

1.7 V

SYNCHRONOUS

1MX16

1 mm

16

16777216 bit

存储器电路

8 mm

6 mm

MC-242453F9-B10-BT3
MC-242453F9-B10-BT3
NEC Electronics Group 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

77

2097152 words

2000000

70 °C

-20 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

NEC ELECTRONICS CORP

BGA

TFBGA,

EAR99

THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

77

R-PBGA-B77

不合格

3 V

COMMERCIAL

2.6 V

ASYNCHRONOUS

2MX16

1.2 mm

16

33554432 bit

存储器电路

12 mm

7 mm

M4-4104S-Z2
M4-4104S-Z2
Moujen Switch 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SST34HF3282-70-4E-L1P
SST34HF3282-70-4E-L1P
Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

SILICON STORAGE TECHNOLOGY INC

BGA

LFBGA,

2097152 words

2000000

85 °C

-20 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

Obsolete

EAR99

ALSO CONTAINS 512K X 16 SRAM

8542.32.00.71

BOTTOM

BALL

未说明

1

0.8 mm

unknown

未说明

56

R-PBGA-B56

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

2MX16

1.4 mm

16

33554432 bit

存储器电路

10 mm

8 mm

M4-4114S-Z3
M4-4114S-Z3
Moujen Switch 数据表

N/A

-

最小起订量: 1

最小包装量: 1

S71GL064AB0BFW0Z0
S71GL064AB0BFW0Z0
Spansion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

Obsolete

SPANSION INC

BGA

TFBGA,

3

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

e1

EAR99

锡银铜

PSRAM IS ORGANIZED AS 512K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

56

R-PBGA-B56

不合格

3.1 V

商业扩展

2.7 V

ASYNCHRONOUS

4MX16

1.2 mm

16

67108864 bit

存储器电路

9 mm

7 mm

XC17S30XLPDG8I
XC17S30XLPDG8I
AMD Xilinx 数据表

992 In Stock

-

最小起订量: 1

最小包装量: 1

NO

8

Obsolete

XILINX INC

DIP

DIP,

3.3 V

IN-LINE

RECTANGULAR

DIP

PLASTIC/EPOXY

-40 °C

85 °C

249168

249168 words

1

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

3.6 V

INDUSTRIAL

3 V

SYNCHRONOUS

249168X1

4.5974 mm

1

249168 bit

存储器电路

9.3599 mm

7.62 mm

SSDSC2KB480G701
SSDSC2KB480G701
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2018-07-27

,

Obsolete

INTEL CORP

EAR99

8542.32.00.71

compliant

存储器电路

SAA4955TJ
SAA4955TJ
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

40

SOJ

SOJ, SOJ40,.44

21 ns

245772 words

245772

70 °C

PLASTIC/EPOXY

SOJ

SOJ40,.44

RECTANGULAR

小概要

3.3 V

Obsolete

NXP SEMICONDUCTORS

e3

EAR99

TIN

IT ALSO REQUIRES 3 TO 5.5V SUPPLY

8542.32.00.71

DUAL

J BEND

1

1.27 mm

compliant

40

R-PDSO-J40

不合格

3.6 V

COMMERCIAL

3 V

SYNCHRONOUS

0.07 mA

245772X12

12

0.01 A

2949264 bit

存储器电路