类别是'category.专用模块' (1062)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 底架 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 输出类型 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 模拟 IC - 其他类型 | 操作模式 | 时钟频率 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 决议案 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间(最大) | 并行/串行 | I/O类型 | 内存IC类型 | 串行总线类型 | 耐力 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 混合内存类型 | 高度 | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | SN74LS189N | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | MOTOROLA INC | DIP | DIP, | 16 words | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | 16 | R-PDIP-T16 | 不合格 | ASYNCHRONOUS | 16X4 | 4 | 64 bit | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HYG0UGG0MF1P-5SH0E | SK Hynix Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 149 | 32000000 | 85 °C | -30 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | 活跃 | SK HYNIX INC | FBGA-149 | 33554432 words | EAR99 | IT ALSO CONTAINS 1GBIT(128M X 8BIT) NAND FLASH MEMORY OPERATES AT 2.7V NOM SUPPLY | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B149 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1.4 mm | 16 | 536870912 bit | 存储器电路 | 14 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ICS2121M001 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | INTEGRATED CIRCUIT SYSTEMS INC | , | 无 | EAR99 | 8542.32.00.71 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL127JB0BAW9Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | RECTANGULAR | TFBGA | PLASTIC/EPOXY | -25 °C | 85 °C | 8000000 | 8388608 words | 3 | TFBGA, | BGA | SPANSION INC | Obsolete | 无 | 3 V | GRID ARRAY, THIN PROFILE, FINE PITCH | e0 | EAR99 | 锡铅 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 64 | R-PBGA-B64 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | 存储器电路 | 11.6 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TH50VSF1421ACXB | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 100 ns | 85 °C | -20 °C | PLASTIC/EPOXY | BGA | BGA48,6X8,40 | RECTANGULAR | 网格排列 | 无 | Transferred | TOSHIBA CORP | BGA, BGA48,6X8,40 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | BOTTOM | BALL | 1 mm | unknown | R-PBGA-B48 | 不合格 | OTHER | 0.04 mA | 0.00003 A | 存储器电路 | FLASH+SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST34HF1642C-70-4E-L1PE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | LFBGA, | 1048576 words | 1000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | EAR99 | SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 56 | R-PBGA-B56 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 1MX16 | 1.4 mm | 16 | 16777216 bit | 存储器电路 | 10 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71WS256NC0BFWAP2 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | FBGA, BGA84,10X12,32 | 80 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B84 | 不合格 | OTHER | 0.066 mA | 0.00004 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RD28F3204W30B70 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | LFBGA, | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | Obsolete | INTEL CORP | BGA | EAR99 | SRAM IS CONFIGURED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 80 | R-PBGA-B80 | 不合格 | 1.9 V | OTHER | 1.7 V | SYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 14 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL129JB0BAW9Z0 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B64 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RP-SMLF32RP0 | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4106-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71GL128NB0BFW9Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SD8SBAT-256G | Western Digital Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | UNSPECIFIED | RECTANGULAR | 微电子组件 | 接触制造商 | WESTERN DIGITAL CORP | , | 274877906944 words | 256000000000 | 70 °C | EAR99 | 8542.32.00.71 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N | COMMERCIAL | ASYNCHRONOUS | 256GX8 | 8 | 2199023255552 bit | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC57256D-20 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Transferred | TOSHIBA CORP | , | 无 | e0 | EAR99 | 锡铅 | 8542.32.00.71 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S40SOG20I | AMD Xilinx | 数据表 | 779 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | Obsolete | XILINX INC | SOIC | SOP, | 3 | 329312 words | 329312 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 329312X1 | 2.65 mm | 1 | 329312 bit | 存储器电路 | 12.8 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MM5260N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP, DIP16,.3 | 1024 words | 1000 | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | OTHER | 1KX1 | 3-STATE | 1 | 1024 bit | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL032J80BAW070 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | Obsolete | SPANSION INC | BGA | TFBGA, | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 56 | R-PBGA-B56 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 9 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL032J80BAW070 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | FBGA, BGA56,8X8,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | 3 V | 有 | Obsolete | ADVANCED MICRO DEVICES INC | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B56 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FM24VN02-GTR | Ramtron International Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | RAMTRON INTERNATIONAL CORP | SOIC | SOP, SOP8,.25 | 3.4 MHz | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3.3 V | Obsolete | EAR99 | 8542.32.00.71 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | 3.6 V | 2 V | SYNCHRONOUS | 0.0001 mA | 32KX8 | 1.75 mm | 8 | 0.00015 A | 262144 bit | SERIAL | FRAM | I2C | 100000000000000 Write/Erase Cycles | 10 | HARDWARE | 2 V | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1922L-F5# | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 2 | NVSRAM (Non-Volatile SRAM) | -40°C~85°C | Bulk | 2005 | iButton® | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | 哑光锡 | 温度记录 | END | 无铅 | 未说明 | 1 | not_compliant | 未说明 | DS1922L | 2 | 不合格 | Digital | 5.25V | Serial | 5.25V | 3V | 512B 8KB | 模拟电路 | 1.375 B | 6.45mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1961S-F5 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | EEPROM | -40°C~85°C | 2002 | iButton® | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | Matte Tin (Sn) | User/Product Authentication | 8473.30.11.40 | END | 无铅 | 未说明 | 1 | 128MHz | 未说明 | DS1961S | 2 | O-MEDB-N2 | 不合格 | 5.25V | 2.8V | 128B | SYNCHRONOUS | 1KX1 | 1 | 1024 bit | SERIAL | 1-WIRE | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1963S-F5 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | NVSRAM (Non-Volatile SRAM) | -40°C~85°C | 1999 | iButton® | yes | 活跃 | 1 (Unlimited) | User/Product Authentication | 未说明 | 未说明 | DS1963S | 512B | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1920-F5 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 2 | EEPROM | -55°C~100°C | 2003 | iButton® | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | Matte Tin (Sn) | Thermometer | END | 1 | 5V | DS1920 | 2 | Digital | 6V | 6V | 2B | 模拟电路 | 5.89mm | 17.35mm | 17.35mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1973-F3 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 2 | EEPROM | -40°C~85°C | Bulk | 2003 | iButton® | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | 哑光锡 | User/Product Authentication | 8473.30.11.40 | END | 1 | DS1973 | 2 | 5V | 6V | Serial | 512B | 0.0163MHz | 8 | 4 kb | 1-WIRE | 无 | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1982-F3 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | EPROM | -40°C~85°C | 2003 | iButton® | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | 哑光锡 | User/Product Authentication | 与Microlan兼容 | 8473.30.11.40 | END | 无铅 | 未说明 | 1 | 5V | 未说明 | DS1982 | 2 | O-MEDB-N2 | 不合格 | 6V | 3/5V | 2.8V | 128B | ASYNCHRONOUS | 1KX1 | 1 | 1024 bit | 15000 ns | SERIAL | COMMON | ROHS3 Compliant |
SN74LS189N
Motorola Mobility LLC
分类:Specialized
HYG0UGG0MF1P-5SH0E
SK Hynix Inc
分类:Specialized
ICS2121M001
Integrated Device Technology Inc
分类:Specialized
S71PL127JB0BAW9Z
Spansion
分类:Specialized
TH50VSF1421ACXB
Toshiba America Electronic Components
分类:Specialized
SST34HF1642C-70-4E-L1PE
Silicon Storage Technology
分类:Specialized
S71WS256NC0BFWAP2
AMD
分类:Specialized
RD28F3204W30B70
Intel Corporation
分类:Specialized
S71PL129JB0BAW9Z0
AMD
分类:Specialized
RP-SMLF32RP0
Panasonic Electronic Components
分类:Specialized
M4-4106-Z3
Moujen Switch
分类:Specialized
S71GL128NB0BFW9Z
Spansion
分类:Specialized
SD8SBAT-256G
Western Digital Corp
分类:Specialized
TC57256D-20
Toshiba America Electronic Components
分类:Specialized
XC17S40SOG20I
AMD Xilinx
分类:Specialized
MM5260N
Texas Instruments
分类:Specialized
S71PL032J80BAW070
Spansion
分类:Specialized
S71PL032J80BAW070
AMD
分类:Specialized
FM24VN02-GTR
Ramtron International Corporation
分类:Specialized
DS1922L-F5#
Maxim Integrated
分类:Specialized
DS1961S-F5
Maxim Integrated
分类:Specialized
DS1963S-F5
Maxim Integrated
分类:Specialized
DS1920-F5
Maxim Integrated
分类:Specialized
DS1973-F3
Maxim Integrated
分类:Specialized
DS1982-F3
Maxim Integrated
分类:Specialized
