类别是'category.USB闪存驱动器' (1612)

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Rohs

安装类型

Maximum Erase Time (s)

包装

系列

零件状态

引脚数量

内存大小

建筑学

行业规模

页面尺寸

引导模块

高度

长度

宽度

SM668GE8 AC P0122
SM668GE8 AC P0122
Silicon Motion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

64G

Synchronous

Serial e-MMC

-40

85

Industrial

表面贴装

BGA

BGA

Ball

Compliant

3A991.b.1.a

8542.32.00.71

Unknown

SLC NAND

LTB

W25Q32FVZEIG/TUBE
W25Q32FVZEIG/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

7

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

32M

Symmetrical

24

8

4M

Obsolete

8

Sectored

4Kbyte x 1024

256byte

W25Q128JVSIM/REEL
W25Q128JVSIM/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

24

8

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

Tube

活跃

8

Sectored

4Kbyte x 4096

256byte

W25Q256JVFIQ/REEL
W25Q256JVFIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

400/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC W

Gull-wing

Compliant

3A991.b.1.a

NOR

256M

Symmetrical

32

8

32M

Tube

活跃

16

Sectored

4Kbyte x 8192

256byte

W25Q64JVSFIM/REEL
W25Q64JVSFIM/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8M

Synchronous

6

100/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

2.7

133

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC W

Gull-wing

Compliant

3A991.b.1.a

NOR

64M

Symmetrical

24

8

Tube

活跃

16

Sectored

4Kbyte x 2048

256byte

W25Q128JVEIQ/TUBE
W25Q128JVEIQ/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

2.7

133

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

8

8

SON

WSON EP

No Lead

8.1 x 6.1 x 0.75mm

2.7 V

WSON

+85 °C

-40 °C

3.6 V

Compliant

3A991.b.1.a

Tray|Tube

W25Q

活跃

8

128Mbit

Sectored

4Kbyte x 4096

256byte

0.75mm

6.1mm

8.1mm

W25Q64JVZPIM/REEL
W25Q64JVZPIM/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

24

8

8M

Synchronous

6

100/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

64M

Symmetrical

Tube

活跃

8

Sectored

4Kbyte x 2048

256byte

W25Q128JVSIQ TRAY
W25Q128JVSIQ TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

2.7

133

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

24

8

Tube

活跃

8

Sectored

4Kbyte x 4096

256byte

W25Q128JVPIQ TUBE
W25Q128JVPIQ TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3.3|3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

8542.32.00.71

NOR

Tube|Tray|Tape and Reel

活跃

8

Sectored

4Kbyte x 4096

256byte

W25M02GVZEIG TUBE
W25M02GVZEIG TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0.01/Block

0.7/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

WSON EP

Compliant

3A991.b.1.a

SLC NAND

2G

Symmetrical

32

8

256M

Synchronous

7

Tray

Obsolete

8

Sectored

W25Q64FWZPIQ/TUBE
W25Q64FWZPIQ/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

100/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

WSON EP

Compliant

3A991.b.1.a

NOR

64M

Symmetrical

Top|Bottom

24

8

8M

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q40EWSNIG/TUBE
W25Q40EWSNIG/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

6

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

4/Chip

1.65

1.8

1.95

1.65 to 1.95

20

20

-40

85

Industrial

100000

表面贴装

1.45

3.9

4.85

8

SOP

SOIC N

Gull-wing

Compliant

EAR99

NOR

4M

Symmetrical

24

8

512K

Synchronous

Tube

活跃

8

Sectored

4Kbyte x 128

256byte

W25Q128FWPIG TUBE
W25Q128FWPIG TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

200/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

WSON EP

Compliant

3A991b.1.a.

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

Tape and Reel|Tray|Tube

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q16JVSSIM/TUBE
W25Q16JVSSIM/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

25/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

EAR99

NOR

16M

Symmetrical

24

8

2M

Tube

活跃

8

Sectored

4Kbyte x 512

256byte

W29N02GVBIAA/REEL
W29N02GVBIAA/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Asynchronous

25

0.01/Block

0.7/Page

Parallel

2.7

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

0.6(Max)

9

11

63

BGA

VFBGA

Ball

Compliant

3A991.b.1.a

Unknown

SLC NAND

2G

Symmetrical

29

8

256M

活跃

63

Sectored

128Kbyte x 2048

2Kbyte

W25Q32JVSSIQ TRAY
W25Q32JVSSIQ TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Symmetrical

Bottom|Top

24

8

4M

Synchronous

6

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

133

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

3A991b.1.a.

8542.32.00.02

NOR

32M

Tube

活跃

8

Sectored

4Kbyte x 1024

256byte

W25X20CLSNIG/TRAY
W25X20CLSNIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

8

2/Chip

0.8/Page

Serial (SPI, Dual SPI)

2.3

2.5|3|3.3

3.6

2.3 to 3.6

14

12

-40

85

Industrial

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOP

SOIC

Gull-wing

Compliant

EAR99

NOR

2M

Symmetrical

Bottom|Top

24

8

256K

活跃

8

Sectored

4Kbyte x 64

256byte

W25Q128JVFIQ/TUBE
W25Q128JVFIQ/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

133

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC W

Gull-wing

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Tube

活跃

16

Sectored

4Kbyte x 4096

256byte

W25Q32JVZPIM/REEL
W25Q32JVZPIM/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

WSON EP

Compliant

3A991.b.1.a

NOR

32M

Symmetrical

Top|Bottom

24

8

4M

活跃

8

Sectored

4Kbyte x 1024

256byte

W25Q40CLSNIG TRAY
W25Q40CLSNIG TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8

512K

Synchronous

8

4/Chip

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

2.3

104

2.5|3|3.3

3.6

2.3 to 3.6

16

Gull-wing

SOIC N

SOP

8

5(Max)

4(Max)

1.5(Max)

表面贴装

100000

Industrial

85

-40

15

Compliant

EAR99

NOR

4M

Symmetrical

Bottom|Top

24

Tube

活跃

8

Sectored

4Kbyte x 128

256byte

W25Q64JVZEIM/TRAY
W25Q64JVZEIM/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

100/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

2.7

133

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

WSON EP

Compliant

3A991.b.1.a

NOR

64M

Symmetrical

24

8

8M

Tape and Reel|Tray|Tube

活跃

8

Sectored

4Kbyte x 2048

256byte

AT25BCM512B-MAH-T
AT25BCM512B-MAH-T
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Serial-SPI

2.7

3.3

3.6

2.7 to 3.6

15

15

-40

85

Industrial

100000

表面贴装

0.55(Max)

3

2

8

UDFN EP

Compliant

EAR99

Unknown

Unknown

NOR

512K

Symmetrical

24

8

64K

Synchronous

6

2/Chip

5/Page

卷带

Obsolete

8

Sectored

256byte

W25Q257JVFIQ/REEL
W25Q257JVFIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

400/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC W

Gull-wing

Compliant

3A991.b.1.a

NOR

256M

Symmetrical

32

8

32M

Tube

活跃

16

Sectored

4Kbyte x 8192

256byte

W25Q80BVSNBG TR
W25Q80BVSNBG TR
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

8.5

6/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3

3.6

2.7 to 3.6

18

-40

85

汽车

100000

表面贴装

1.45

3.9

4.85

8

SOP

SOIC

Gull-wing

Compliant

EAR99

8542.32.00.71

Unknown

NOR

8M

Symmetrical

1

8

1M

Obsolete

8

Sectored

4Kbyte x 256

256byte

KLM8G1WEPD-B03100
KLM8G1WEPD-B03100
Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

供应商未确认

8542.32.00.71

Unknown

Unknown

Obsolete