category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

类别是'category.专用模块' (1062)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	Contact plating	表面安装	Number of pins	终端数量			Connector pinout layout	Contacts pitch	Date Of Intro	Electrical mounting	Gross weight		Kind of connector															Row pitch	Spatial orientation		Type of connector	Operating temperature	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	Current rating	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	端口的数量	操作模式	电源电流-最大值	组织结构	输出特性	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	并行/串行	内存IC类型	Rated voltage	输出启用	个人资料	混合内存类型
RD38F2040W0YTQ0	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88			MICRON TECHNOLOGY INC		FBGA, BGA88,8X12,32	70 ns	PLASTIC/EPOXY	FBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V			无	Obsolete										EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown				R-PBGA-B88	不合格						0.035 mA					0.00011 A			存储器电路				FLASH+PSRAM
RD38F2040W0YTQ0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	无	Obsolete						INTEL CORP		BGA	TFBGA, BGA88,8X12,32	65 ns	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V							e0	无	EAR99	锡铅	CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			88	R-PBGA-B88	不合格	1.95 V	OTHER	1.7 V		SYNCHRONOUS	0.035 mA	4MX16		1.2 mm	16	0.0001 A	67108864 bit		存储器电路				FLASH+PSRAM	10 mm	8 mm
RD38F2040W0YTQ0	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88			NUMONYX		FBGA, BGA88,8X12,32	70 ns	PLASTIC/EPOXY	FBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V			无	Transferred										EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown				R-PBGA-B88	不合格						0.035 mA					0.00011 A			存储器电路				FLASH+PSRAM
RD38F3040L0YTQ0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	1.8 V	GRID ARRAY, THIN PROFILE, FINE PITCH						RECTANGULAR		BGA88,8X12,32	TFBGA	PLASTIC/EPOXY	-25 °C	85 °C	8000000	8388608 words	85 ns	TFBGA, BGA88,8X12,32	BGA	INTEL CORP	Obsolete	无							e0		EAR99	锡铅	CONTAINS 32M BIT PSRAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			88	R-PBGA-B88	不合格	2 V	OTHER	1.7 V		SYNCHRONOUS	0.035 mA	8MX16		1.2 mm	16	0.0001 A	134217728 bit		存储器电路				FLASH+PSRAM	10 mm	8 mm
XC17S05PDG8I	AMD Xilinx	数据表	8 In Stock	-	最小起订量: 1 最小包装量: 1	NO	8	Obsolete						XILINX INC		DIP	DIP,	1	53984 words	53984	85 °C	-40 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5 V					有			e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant		30	8	R-PDIP-T8	不合格	5.5 V	INDUSTRIAL	4.5 V		SYNCHRONOUS		53984X1		4.5974 mm	1		53984 bit		存储器电路					9.3599 mm	7.62 mm
PF38F4050M0Y1Q0	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88			BGA		TFBGA,	67108864 words	64000000	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V			Obsolete	NUMONYX										EAR99		FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16	8542.32.00.71	BOTTOM	BALL	未说明	1	0.8 mm	unknown		未说明	88	R-PBGA-B88	不合格	1.95 V		1.7 V		SYNCHRONOUS		64MX16		1.2 mm	16		1073741824 bit		存储器电路					10 mm	8 mm
PF38F4050M0Y1Q0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	Transferred						INTEL CORP		BGA	TFBGA, BGA107,9X12,32	70 ns	3	67108864 words	64000000	PLASTIC/EPOXY	TFBGA	BGA107,9X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V					有			e1		EAR99	锡银铜	FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			88	R-PBGA-B88	不合格	1.95 V		1.7 V		SYNCHRONOUS		64MX16		1.2 mm	16	0.00025 A	1073741824 bit		存储器电路				FLASH+PSRAM	10 mm	8 mm
MC2210130-002-C	ATGBICS	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S71GL512NC0BFWEZ2	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84				ADVANCED MICRO DEVICES INC		FBGA, BGA84,10X12,32	110 ns	85 °C	-25 °C	PLASTIC/EPOXY	FBGA	BGA84,10X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH			有	活跃									EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant				R-PBGA-B84	不合格		OTHER				0.09 mA					0.005 A			存储器电路				FLASH+PSRAM
XC17S05XLVOG8I	AMD Xilinx	数据表	612 In Stock	-	最小起订量: 1 最小包装量: 1	YES	8	Obsolete						XILINX INC		TSOP	TSOP2,	3	54544 words	54544	85 °C	-40 °C	PLASTIC/EPOXY	TSOP2	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3.3 V					有			e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	鸥翼	260	1	1.27 mm	compliant		30	8	R-PDSO-G8	不合格	3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS		54544X1		1.2 mm	1		54544 bit		存储器电路					4.9 mm	3.9 mm
TC518129AFWL-80	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32					TOSHIBA CORP		SOIC	80 ns	131072 words	128000	70 °C	PLASTIC/EPOXY	SOP	RECTANGULAR	小概要	5 V			无	Obsolete						e0			锡铅	CE/AUTO/SELF REFRESH		DUAL	鸥翼	240	1	1.27 mm	unknown		未说明	32	R-PDSO-G32	不合格	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS		128KX8	3-STATE	2.8 mm	8		1048576 bit	PARALLEL	PSEUDO STATIC RAM		YES			20.6 mm	10.7 mm
M6MGB64BM34CWG-P	Renesas Electronics Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1			Obsolete	RENESAS TECHNOLOGY CORP						,										EAR99			8542.32.00.71						unknown
RD28F1602C3T90	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66	INTEL CORP						BGA		LFBGA, BGA68,8X12,32	90 ns	1048576 words	1000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V					Obsolete					EAR99		SRAM IS ORGANIZED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			66	R-PBGA-B66	不合格	3.3 V	商业扩展	2.7 V		ASYNCHRONOUS	0.055 mA	1MX16		1.4 mm	16	0.000035 A	16777216 bit		存储器电路				FLASH+SRAM	10 mm	8 mm
NM1282KSLAXAL-3B	Nanya Technology Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	162					NANYA TECHNOLOGY CORP		VFBGA,	67108864 words	64000000	85 °C	-25 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V			有	活跃								EAR99		NAND IS ORGANISED AS 256M X 8 AND ALSO OPERATES WITH 1.2V NOMINAL SUPPLY	8542.32.00.71	BOTTOM	BALL	未说明	1	0.5 mm	compliant		未说明		R-PBGA-B162		1.95 V	OTHER	1.7 V		SYNCHRONOUS		64MX32		1 mm	32		2147483648 bit		存储器电路					10.5 mm	8 mm
KMDP6001DA-B425	Samsung Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	9	254	1x9	2.54mm	THT	0.77 g	female	SAMSUNG SEMICONDUCTOR INC		FBGA-254	68719476736 words	64000000000	PLASTIC/EPOXY	RECTANGULAR	socket		straight	Obsolete	pin strips	-40...163°C					DRAM IS ORGANISED AS 32G X 1		BOTTOM	BALL		1		compliant	1.5A			R-PBGA-B254								64GX8			8		549755813888 bit		存储器电路	60V		beryllium copper	FLASH+DRAM			0.75µm	UL94V-0
MR2A16AVYS35	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	tinned	YES	6	44	2x3	1.27mm	2018-08-17	THT	0.41 g	female	256000	105 °C	-40 °C	PLASTIC/EPOXY	TSOP2	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3.3 V	socket	Obsolete	NXP SEMICONDUCTORS	TSOP2-44	1.27mm	straight	262144 words	pin strips	-40...163°C			EAR99			8542.32.00.71	DUAL	鸥翼		1	0.8 mm	unknown	1.5A			R-PDSO-G44		3.6 V	INDUSTRIAL	3 V		ASYNCHRONOUS		256KX16		1.2 mm	16		4194304 bit		存储器电路	125V		bronze		18.41 mm	10.16 mm	4µm	UL94V-0
S71PL129JC0BFW9U0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	Obsolete						SPANSION INC		BGA	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V					有			e1		EAR99	锡银铜	PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown		40	64	R-PBGA-B64	不合格	3.1 V	OTHER	2.7 V		ASYNCHRONOUS		8MX16		1.2 mm	16		134217728 bit		存储器电路					11.6 mm	8 mm
S71NS256PB0ZJETV3	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56						SPANSION INC		BGA	TFBGA,	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V			有			Obsolete					EAR99		PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown		40	56	R-PBGA-B56	不合格	1.95 V	OTHER	1.7 V		SYNCHRONOUS		16MX16		1.2 mm	16		268435456 bit		存储器电路					9.2 mm	8 mm
MC-242453F9-B10-BT3	NEC Electronics Group	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	77				BGA		TFBGA,	2097152 words	2000000	70 °C	-20 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			Obsolete	NEC ELECTRONICS CORP									EAR99		THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			77	R-PBGA-B77	不合格	3 V	COMMERCIAL	2.6 V		ASYNCHRONOUS		2MX16		1.2 mm	16		33554432 bit		存储器电路					12 mm	7 mm
SST34HF3282-70-4E-L1P	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56						SILICON STORAGE TECHNOLOGY INC		BGA	LFBGA,	2097152 words	2000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V			无			Obsolete					EAR99		ALSO CONTAINS 512K X 16 SRAM	8542.32.00.71	BOTTOM	BALL	未说明	1	0.8 mm	unknown		未说明	56	R-PBGA-B56	不合格	3.3 V	OTHER	2.7 V		ASYNCHRONOUS		2MX16		1.4 mm	16		33554432 bit		存储器电路					10 mm	8 mm
M4-4104S-Z2	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S71GL064AB0BFW0Z0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	Obsolete						SPANSION INC		BGA	TFBGA,	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V					有			e1		EAR99	锡银铜	PSRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			56	R-PBGA-B56	不合格	3.1 V	商业扩展	2.7 V		ASYNCHRONOUS		4MX16		1.2 mm	16		67108864 bit		存储器电路					9 mm	7 mm
XC17S30XLPDG8I	AMD Xilinx	数据表	992 In Stock	-	最小起订量: 1 最小包装量: 1	NO	8	Obsolete						XILINX INC		DIP	DIP,	3.3 V	IN-LINE	RECTANGULAR	DIP	PLASTIC/EPOXY	-40 °C	85 °C	249168	249168 words	1					有			e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant		30	8	R-PDIP-T8	不合格	3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS		249168X1		4.5974 mm	1		249168 bit		存储器电路					9.3599 mm	7.62 mm
M4-4114S-Z3	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
NAND99W3M1BZBC5E	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	137				MICRON TECHNOLOGY INC		FBGA, BGA137,10X15,32	85 °C	-30 °C	PLASTIC/EPOXY	FBGA	BGA137,10X15,32	RECTANGULAR	GRID ARRAY, FINE PITCH	3 V			有	Obsolete									EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant				R-PBGA-B137	不合格		OTHER												存储器电路				FLASH+SDRAM