类别是'category.专用模块' (1062)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 内存IC类型 | 混合内存类型 | 长度 | 宽度 | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | S71PL129JC0BFW9U0 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | 70 ns | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B64 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||
![]() | S71NS256PB0ZJETV2 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 有 | Transferred | SPANSION INC | , | EAR99 | 8542.32.00.71 | 260 | unknown | 40 | ||||||||||||||||||||||||||||||||||||||||||
![]() | NAND99W3M1BZBC5E | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 137 | FBGA, BGA137,10X15,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA137,10X15,32 | RECTANGULAR | 网格排列 | 3 V | 有 | Obsolete | NUMONYX | BGA | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | 未说明 | 137 | R-PBGA-B137 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||
![]() | S71JL064HA0BAW01 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 73 | ADVANCED MICRO DEVICES INC | LFBGA, BGA73,10X12,32 | 70 ns | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | BGA73,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 有 | Obsolete | EAR99 | SRAM IS ORGANISED AS 1KX16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B73 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | 存储器电路 | FLASH+SRAM | 11.6 mm | 8 mm | ||||||||||||
![]() | MC-222253AF9-B85X-BT3 | NEC Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 77 | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 无 | Obsolete | NEC ELECTRONICS AMERICA INC | 12 X 7 MM, FBGA-77 | 2097152 words | e0 | EAR99 | 锡铅 | SRAM IS ORGANISED AS 256 X 16 OR 512K X 8 AND FLASH CAN ALSO BE ORGANISED AS 4M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B77 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 12 mm | 7 mm | ||||||||||||||
![]() | MC2210310-030-C | ATGBICS | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC-242453F9-B10-BT3 | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 77 | PLASTIC/EPOXY | FBGA | BGA77,8X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | RENESAS ELECTRONICS CORP | FBGA, BGA77,8X14,32 | 100 ns | 70 °C | -20 °C | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B77 | 不合格 | COMMERCIAL | 0.045 mA | 0.00001 A | 存储器电路 | FLASH+SRAM | |||||||||||||||||||||||||
![]() | SST34HF324G-70-4E-L3KE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 2097152 words | 2000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | EAR99 | SRAM IS ORGANISED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 8 mm | 6 mm | ||||||||||||||
![]() | SST34HF324G-70-4E-L3KE | Greenliant Systems Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Obsolete | GREENLIANT SYSTEMS LTD | EAR99 | 8542.32.00.71 | compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | AM27C2048-150PC | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | CYPRESS SEMICONDUCTOR CORP | 活跃 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMS4C1060-30SD | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | 70 °C | PLASTIC/EPOXY | ZIP | ZIP20,.1 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | ZIP, ZIP20,.1 | 25 ns | EAR99 | 8542.32.00.71 | ZIG-ZAG | THROUGH-HOLE | 未说明 | 1.27 mm | not_compliant | 未说明 | R-PZIP-T20 | 不合格 | COMMERCIAL | 0.05 mA | 0.01 A | 存储器电路 | |||||||||||||||||||||||
![]() | SN74LS189N | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | MOTOROLA INC | DIP | DIP, | 16 words | 16 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | 16 | R-PDIP-T16 | 不合格 | ASYNCHRONOUS | 16X4 | 4 | 64 bit | 存储器电路 | ||||||||||||||||||||||
![]() | RD28F3208C3T70 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 66 | Obsolete | INTEL CORP | BGA | LFBGA, BGA68,8X12,32 | 70 ns | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | BGA68,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 无 | EAR99 | SRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 240 | 1 | 0.8 mm | compliant | 30 | 66 | R-PBGA-B66 | 不合格 | 3.3 V | 商业扩展 | 2.7 V | ASYNCHRONOUS | 0.055 mA | 2MX16 | 1.4 mm | 16 | 0.000006 A | 33554432 bit | 存储器电路 | FLASH+SRAM | 10 mm | 8 mm | ||||||
![]() | S71GL128NB0BFW9Z0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | SPANSION INC | BGA | 8 X 11.60 MM, 1.20 MM HIEGHT, LEAD FREE, FBGA-64 | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 有 | Obsolete | e1 | 3A991.B.1.A | 锡银铜 | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 64 | R-PBGA-B64 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | 存储器电路 | 11.6 mm | 8 mm | ||||||||
![]() | XC17S50XLPDG8C | AMD Xilinx | 数据表 | 104 In Stock | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | DIP | DIP, | 1 | 559232 words | 559232 | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 3.3 V | 有 | Obsolete | XILINX INC | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 559232X1 | 4.5974 mm | 1 | 559232 bit | 存储器电路 | 9.3599 mm | 7.62 mm | |||||||||
![]() | M4-4112RS-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71VS256RD0AHKBL0 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | FBGA | BGA56,10X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 有 | Transferred | CYPRESS SEMICONDUCTOR CORP | 85 °C | -25 °C | PLASTIC/EPOXY | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.5 mm | compliant | R-PBGA-B56 | 不合格 | OTHER | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||
![]() | SST32HF3281-70-4E-LSE | Greenliant Systems Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Obsolete | GREENLIANT SYSTEMS LTD | EAR99 | 8542.32.00.71 | compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | FM3135-GTR | Ramtron International Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | , | PLASTIC/EPOXY | RECTANGULAR | 小概要 | Obsolete | RAMTRON INTERNATIONAL CORP | SOIC | EAR99 | 8542.32.00.71 | DUAL | 鸥翼 | unknown | 20 | R-PDSO-G20 | 不合格 | 存储器电路 | |||||||||||||||||||||||||||||||||
![]() | EN71SN10F-45EBWP | Eon Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 130 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | Transferred | EON SILICON SOLUTION INC | BGA | VFBGA, | 33554432 words | 32000000 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.65 mm | unknown | 130 | R-PBGA-B130 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1 mm | 16 | 536870912 bit | 存储器电路 | 9 mm | 8 mm | ||||||||||||||||
![]() | EN71SN10F-45EBWP | Elite Semiconductor Memory Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 130 | -25 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 接触制造商 | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | VFBGA, | 33554432 words | 32000000 | 85 °C | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.65 mm | unknown | R-PBGA-B130 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1 mm | 16 | 536870912 bit | 存储器电路 | 9 mm | 8 mm | ||||||||||||||||||
![]() | RD38F3040L0YTQ0 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 88 | 88 ns | FBGA, BGA88,8X12,32 | NUMONYX | Transferred | 无 | 1.8 V | GRID ARRAY, FINE PITCH | RECTANGULAR | BGA88,8X12,32 | FBGA | PLASTIC/EPOXY | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | 0.035 mA | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||
![]() | RD38F3040L0YTQ0 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 88 | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 无 | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA88,8X12,32 | 88 ns | PLASTIC/EPOXY | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | 0.035 mA | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||
![]() | NAND98R3M0AZBB5E | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 107 | FBGA, BGA107,10X14,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA107,10X14,32 | RECTANGULAR | 网格排列 | 1.8 V | 有 | Obsolete | NUMONYX | BGA | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | 未说明 | 107 | R-PBGA-B107 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||
![]() | XC17S05XLVOG8C | AMD Xilinx | 数据表 | 339 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | TSOP | TSOP2, | 3 | 54544 words | 54544 | 70 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 有 | Obsolete | XILINX INC | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 54544X1 | 1.2 mm | 1 | 54544 bit | 存储器电路 | 4.9 mm | 3.9 mm |
S71PL129JC0BFW9U0
AMD
分类:Specialized
S71NS256PB0ZJETV2
Spansion
分类:Specialized
NAND99W3M1BZBC5E
Numonyx Memory Solutions
分类:Specialized
S71JL064HA0BAW01
AMD
分类:Specialized
MC-222253AF9-B85X-BT3
NEC Electronics America Inc
分类:Specialized
MC2210310-030-C
ATGBICS
分类:Specialized
MC-242453F9-B10-BT3
Renesas Electronics Corporation
分类:Specialized
SST34HF324G-70-4E-L3KE
Silicon Storage Technology
分类:Specialized
SST34HF324G-70-4E-L3KE
Greenliant Systems Ltd
分类:Specialized
AM27C2048-150PC
Cypress Semiconductor
分类:Specialized
TMS4C1060-30SD
Texas Instruments
分类:Specialized
SN74LS189N
Motorola Mobility LLC
分类:Specialized
RD28F3208C3T70
Intel Corporation
分类:Specialized
S71GL128NB0BFW9Z0
Spansion
分类:Specialized
XC17S50XLPDG8C
AMD Xilinx
分类:Specialized
M4-4112RS-Z2
Moujen Switch
分类:Specialized
S71VS256RD0AHKBL0
Cypress Semiconductor
分类:Specialized
SST32HF3281-70-4E-LSE
Greenliant Systems Ltd
分类:Specialized
FM3135-GTR
Ramtron International Corporation
分类:Specialized
EN71SN10F-45EBWP
Eon Silicon Solution Inc
分类:Specialized
EN71SN10F-45EBWP
Elite Semiconductor Memory Technology Inc
分类:Specialized
RD38F3040L0YTQ0
Numonyx Memory Solutions
分类:Specialized
RD38F3040L0YTQ0
Micron Technology Inc
分类:Specialized
NAND98R3M0AZBB5E
Numonyx Memory Solutions
分类:Specialized
XC17S05XLVOG8C
AMD Xilinx
分类:Specialized
