category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

类别是'category.专用模块' (1062)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	操作模式	电源电流-最大值	组织结构	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	并行/串行	内存IC类型	串行总线类型	耐力	数据保持时间	写入保护	待机电压-最小值
LRS1806K	Sharp Microelectronics of the Americas	数据表	N/A	-	最小起订量: 1 最小包装量: 1
R8A66120FFA	Renesas Electronics Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	6 ns	2097152 words	2000000	70 °C	PLASTIC/EPOXY	LFQFP	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	3.3 V	Obsolete	RENESAS ELECTRONICS CORP	QFP	LFQFP, QFP48,.35SQ,20			EAR99			8542.32.00.71	QUAD	鸥翼		1	0.5 mm	unknown		48	S-PQFP-G48	不合格	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS	0.15 mA	2MX4	1.7 mm	4		8388608 bit		存储器电路							7 mm	7 mm
HYG0UGG0MF1P-5SH0E	SK Hynix Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	149	-30 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	1.8 V	活跃	SK HYNIX INC	FBGA-149	33554432 words	32000000	85 °C			EAR99		IT ALSO CONTAINS 1GBIT(128M X 8BIT) NAND FLASH MEMORY OPERATES AT 2.7V NOM SUPPLY	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			R-PBGA-B149		1.95 V	OTHER	1.7 V	SYNCHRONOUS		32MX16	1.4 mm	16		536870912 bit		存储器电路							14 mm	10 mm
ICS2121M001	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	无	Obsolete	INTEGRATED CIRCUIT SYSTEMS INC	,					EAR99			8542.32.00.71						unknown
S71PL127JB0BAW9Z	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	PLASTIC/EPOXY	-25 °C	85 °C	8000000	8388608 words	3	TFBGA,	BGA	SPANSION INC	Obsolete	无	3 V	GRID ARRAY, THIN PROFILE, FINE PITCH	RECTANGULAR	TFBGA	e0		EAR99	锡铅	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		64	R-PBGA-B64	不合格	3.6 V	OTHER	2.7 V	ASYNCHRONOUS		8MX16	1.2 mm	16		134217728 bit		存储器电路							11.6 mm	8 mm
RD28F3204W30B70	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	80	2000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	1.8 V	Obsolete	INTEL CORP	BGA	LFBGA,	2097152 words			EAR99		SRAM IS CONFIGURED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		80	R-PBGA-B80	不合格	1.9 V	OTHER	1.7 V	SYNCHRONOUS		2MX16	1.4 mm	16		33554432 bit		存储器电路							14 mm	8 mm
XC17S20VOG8I	AMD Xilinx	数据表	974 In Stock	-	最小起订量: 1 最小包装量: 1	YES	8	85 °C	-40 °C	PLASTIC/EPOXY	TSOP2	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	5 V	TSOP2,	TSOP	XILINX INC	Obsolete	有	3	178144 words	178144	e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	鸥翼	260	1	1.27 mm	compliant	30	8	R-PDSO-G8	不合格	5.5 V	INDUSTRIAL	4.5 V	SYNCHRONOUS		178144X1	1.2 mm	1		178144 bit		存储器电路							4.9 mm	3.9 mm
S72NS512PE0KFFG00	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	TFBGA,	33554432 words	32000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	有	Obsolete	SPANSION INC	BGA			3A991.B.1.A		DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE	8542.32.00.51	BOTTOM	BALL	260	1	0.65 mm	unknown	40	128	S-PBGA-B128	不合格	1.95 V	OTHER	1.7 V	ASYNCHRONOUS		32MX16	1.05 mm	16		536870912 bit		存储器电路							12 mm	12 mm
TH50VSF1421ACXB	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	-20 °C	PLASTIC/EPOXY	BGA	BGA48,6X8,40	RECTANGULAR	网格排列	无	Transferred	TOSHIBA CORP	BGA, BGA48,6X8,40	100 ns	85 °C	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	BOTTOM	BALL			1 mm	unknown			R-PBGA-B48	不合格		OTHER			0.04 mA				0.00003 A			存储器电路						FLASH+SRAM
SST34HF1642C-70-4E-L1PE	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	1000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	Obsolete	SILICON STORAGE TECHNOLOGY INC	BGA	LFBGA,	1048576 words			EAR99		SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		56	R-PBGA-B56	不合格	3.3 V	OTHER	2.7 V	ASYNCHRONOUS		1MX16	1.4 mm	16		16777216 bit		存储器电路							10 mm	8 mm
S71WS256NC0BFWAP2	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	85 °C	-25 °C	PLASTIC/EPOXY	FBGA	BGA84,10X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V	有	活跃	ADVANCED MICRO DEVICES INC	FBGA, BGA84,10X12,32	80 ns			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant			R-PBGA-B84	不合格		OTHER			0.066 mA				0.00004 A			存储器电路						FLASH+PSRAM
FM24VN02-G	Ramtron International Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8	SOP8,.25	SOP	PLASTIC/EPOXY	-40 °C	85 °C	32000	32768 words	3.4 MHz	SOP, SOP8,.25	SOIC	RAMTRON INTERNATIONAL CORP	Obsolete	3.3 V	小概要	RECTANGULAR			EAR99			8542.32.00.71	DUAL	鸥翼		1	1.27 mm	unknown		8	R-PDSO-G8	不合格	3.6 V		2 V	SYNCHRONOUS	0.0001 mA	32KX8	1.75 mm	8	0.00015 A	262144 bit	SERIAL	FRAM	I2C	100000000000000 Write/Erase Cycles	10	HARDWARE	2 V		4.9 mm	3.9 mm
SST34HF1641C-70-4C-L1P	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	70 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	Obsolete	SILICON STORAGE TECHNOLOGY INC	BGA	LFBGA,	1048576 words	1000000			EAR99		SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		56	R-PBGA-B56	不合格	3.3 V	COMMERCIAL	2.7 V	ASYNCHRONOUS		1MX16	1.4 mm	16		16777216 bit		存储器电路							10 mm	8 mm
FM24VN02-GTR	Ramtron International Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8	SOP, SOP8,.25	3.4 MHz	32768 words	32000	85 °C	-40 °C	PLASTIC/EPOXY	SOP	SOP8,.25	RECTANGULAR	小概要	3.3 V	Obsolete	RAMTRON INTERNATIONAL CORP	SOIC			EAR99			8542.32.00.71	DUAL	鸥翼		1	1.27 mm	unknown		8	R-PDSO-G8	不合格	3.6 V		2 V	SYNCHRONOUS	0.0001 mA	32KX8	1.75 mm	8	0.00015 A	262144 bit	SERIAL	FRAM	I2C	100000000000000 Write/Erase Cycles	10	HARDWARE	2 V		4.9 mm	3.9 mm
S71GL512NC0BFWEZ2	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	BGA	9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	3	33554432 words	32000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	有	Obsolete	SPANSION INC	e1		EAR99	锡银铜	PSRAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	84	R-PBGA-B84	不合格	3.6 V	OTHER	2.7 V	ASYNCHRONOUS		32MX16	1.2 mm	16		536870912 bit		存储器电路							12 mm	9 mm
MC2210511-ER4-C	ATGBICS	数据表	N/A	-	最小起订量: 1 最小包装量: 1
AM27C4096-95DC	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1			活跃	CYPRESS SEMICONDUCTOR CORP												compliant
MC2210130-001-C	ATGBICS	数据表	N/A	-	最小起订量: 1 最小包装量: 1
M4-4101S-Z2	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
SSDPE2KX040T807	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1			Obsolete	INTEL CORP												compliant																存储器电路
HM538253TT-7	Hitachi Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	40	256000	70 °C	PLASTIC/EPOXY	TSOP	TSOP40/44,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	5 V	Obsolete	HITACHI LTD	TSOP, TSOP40/44,.46,32	70 ns	262144 words			EAR99			8542.32.00.71	DUAL	鸥翼			0.8 mm	unknown			R-PDSO-G40	不合格		COMMERCIAL			0.19 mA	256KX8		8	0.007 A	2097152 bit		视频DRAM
M4-4101-Z3	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
TC51832ASPL-85	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28	32768 words	32000	70 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5 V	无	Obsolete	TOSHIBA CORP	DIP	85 ns	e0			锡铅			DUAL	THROUGH-HOLE	240	1	2.54 mm	unknown	未说明	28	R-PDIP-T28	不合格	5.5 V	COMMERCIAL	4.5 V	ASYNCHRONOUS		32KX8	4.45 mm	8		262144 bit	PARALLEL	PSEUDO STATIC RAM							34.9 mm	7.62 mm
MT28C3212P2FL-11TET	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66	BGA	FBGA-66	110 ns	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	LFBGA	BGA66,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	无	Obsolete	MICRON TECHNOLOGY INC	e0		EAR99	Tin/Lead (Sn/Pb)	SRAM ORGANISATION IS 128K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	not_compliant		66	R-PBGA-B66	不合格	2.2 V	INDUSTRIAL	1.65 V	ASYNCHRONOUS	0.025 mA	2MX16	1.4 mm	16	0.00006 A	33554432 bit		存储器电路						FLASH+SRAM	12 mm	8 mm
XC17S40XLSOG20C	AMD Xilinx	数据表	174 In Stock	-	最小起订量: 1 最小包装量: 1	YES	20	SOP,	3	330696 words	330696	70 °C	PLASTIC/EPOXY	SOP	RECTANGULAR	小概要	3.3 V	有	Obsolete	XILINX INC	SOIC	e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	鸥翼	260	1	1.27 mm	compliant	30	20	R-PDSO-G20	不合格	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS		330696X1	2.65 mm	1		330696 bit		存储器电路							12.8 mm	7.5 mm