类别是'category.USB闪存驱动器' (1612)

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引导模块

W25Q128FVEIG/REEL
W25Q128FVEIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3.3|3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q128FVFIQ/REEL
W25Q128FVFIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOIC W

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

Obsolete

16

Sectored

4Kbyte x 4096

256byte

W25Q128FVCIG/TRAY
W25Q128FVCIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

6

8

24

TFBGA

85

-40

25

20

2.7 to 3.6

3.6

3|3.3

104

2.7

Serial (SPI, Dual SPI, Quad SPI)

3/Page

200/Chip

7

Synchronous

16M

8

24

Symmetrical

128M

NOR

3A991.b.1.a

Compliant

Industrial

100000

表面贴装

0.85

Obsolete

24

Sectored

4Kbyte x 4096

256byte

W25Q128FVEIG TRAY
W25Q128FVEIG TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25N01GVZEIT/REEL
W25N01GVZEIT/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

32

8

128M

Synchronous

7

0.01/Block

0.7/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

WSON EP

Compliant

3A991.b.1.a

SLC NAND

1G

Symmetrical

Tray

活跃

8

Sectored

128Kbyte x 1024

2Kbyte

W25Q128JVPIM/TRAY
W25Q128JVPIM/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

2.7

133

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

Tube

活跃

8

Sectored

4Kbyte x 4096

256byte

W25Q128JVFIM/TRAY
W25Q128JVFIM/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3.3|3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC W

Gull-wing

Compliant

3A991.b.1.a

Tube

活跃

16

Sectored

4Kbyte x 4096

256byte

W29GL256SL9T/REEL
W29GL256SL9T/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256M

Symmetrical

24

16

16M

Asynchronous

90

1.1/Sector

15

0.4/Word

25

Parallel

2.7

3

3.6

2.7 to 3.6

60

25

100

-40

85

Industrial

100000

表面贴装

1

18.4

14

56

TSOP

Compliant

3A991.b.1.a

NOR

Obsolete

56

Sectored

128Kbyte x 256

512byte

W25Q128FWEIQ/TRAY
W25Q128FWEIQ/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1.8

1.65

Serial (SPI, Dual SPI, Quad SPI)

5/Page

200/Chip

6

Synchronous

16M

8

24

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

100000

Industrial

85

-40

25

20

1.65 to 1.95

1.95

Tube

LTB

Sectored

4Kbyte x 4096

256byte

W25Q128JVPIQ/REEL
W25Q128JVPIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

Tape and Reel|Tray|Tube

活跃

8

Sectored

4Kbyte x 4096

256byte

W25Q20EWSNIG/TUBE
W25Q20EWSNIG/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

24

8

256K

Synchronous

6

2/Chip

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

20

-40

85

Industrial

100000

表面贴装

1.45

3.9

4.85

8

SOP

SOIC N

Compliant

EAR99

NOR

2M

Symmetrical

Tube

活跃

8

Sectored

4Kbyte x 64

256byte

W25Q128FVSIG TUBE
W25Q128FVSIG TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3.3|3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

3A991.b.1.a

NOR

Tube

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q128FVPIG/REEL
W25Q128FVPIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3.3|3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q256JWPIQ/REEL
W25Q256JWPIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

32M

Synchronous

6

400/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.7

1.8

1.95

1.7 to 1.95

20

20

-40

85

Industrial

表面贴装

0.73

6

5

8

WSON EP

Compliant

3A991.b.1.a

NOR

256M

Symmetrical

32

8

Tape and Reel|Tray|Tube

活跃

8

Sectored

4Kbyte x 8192

256byte

W25Q128FVPIQ/TRAY
W25Q128FVPIQ/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q128FWEIG/REEL
W25Q128FWEIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Symmetrical

24

8

16M

Synchronous

6

200/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

128M

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q128FWPIQ/REEL
W25Q128FWPIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8

16M

Synchronous

6

200/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

WSON EP

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

24

Tube|Tray|Tape and Reel

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q16DWSSIG/TRAY
W25Q16DWSSIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

16M

Symmetrical

Top|Bottom

24

8

2M

Synchronous

7

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

20

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC W

Gull-wing

Compliant

EAR99

NOR

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25Q32DWZPIG/TRAY
W25Q32DWZPIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1.8

1.95

1.7 to 1.95

40

12

-40

85

Industrial

Compliant

3A991.b.1.a

NOR

32M

Symmetrical

Bottom|Top

24

8

4M

Synchronous

7.5

30/Chip

3/Page

Serial-SPI

1.7

Obsolete

Sectored

4Kbyte x 1024

256byte

W25Q16DVZPJG/REEL
W25Q16DVZPJG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2M

Synchronous

8

10/Chip

4/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

30

25

-40

105

工业级

表面贴装

0.73

6

5

8

WSON EP

Compliant

EAR99

NOR

16M

Symmetrical

24

8

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25Q32JWSSIM/REEL
W25Q32JWSSIM/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

24

8

4M

Synchronous

6

50/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.7

133

1.8

1.95

1.7 to 1.95

20

20

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOIC

Compliant

3A991.b.1.a

NOR

32M

Symmetrical

Tube

活跃

8

Sectored

4Kbyte x 1024

256byte

W25Q128FVFIQ/TRAY
W25Q128FVFIQ/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOIC W

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

Obsolete

16

Sectored

4Kbyte x 4096

256byte

W25Q64FVTCIG/TRAY
W25Q64FVTCIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

7

100/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.85

6

8

24

BGA

TFBGA

Ball

Compliant

3A991.b.1.a

Obsolete

24

Sectored

4Kbyte x 2048

256byte

W25Q16CLSVIG/REEL
W25Q16CLSVIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2.3

3.3|3|2.5

3.6

2.3 to 3.6

18

25

-40

85

Industrial

100000

Compliant

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

9

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

80

Obsolete

Sectored

4Kbyte x 512

256byte

W25Q16CLSVIG/TRAY
W25Q16CLSVIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2.3

3.3|3|2.5

3.6

2.3 to 3.6

18

25

-40

85

Industrial

100000

Compliant

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

9

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

80

Obsolete

Sectored

4Kbyte x 512

256byte