N/A

-

表面贴装

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

Tantalum

160

70 °C

有

EPM7160SQC160-10N

125 MHz

QFP

SQUARE

Intel Corporation

Obsolete

104

INTEL CORP

5.25 V

6.96

10 V

Compliant

104

160

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

EEPROM

QFP, QFP160,1.2SQ

FLATPACK

3

PLASTIC/EPOXY

QFP160,1.2SQ

5 V

40

4.75 V

0°C ~ 70°C (TA)

Tray

MAX® 7000S

5 %

e3

Obsolete

SMD/SMT

EAR99

Matte Tin (Sn)

125 °C

-55 °C

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

82 nF

可编程逻辑器件

CMOS

5 V

QUAD

鸥翼

245

0.65 mm

1.25 mm

compliant

125 MHz

EPM7160

S-PQFP-G160

不合格

2012

0805

X7R

3.3/5,5 V

COMMERCIAL

系统内可编程

10 ns

10 ns

0 DEDICATED INPUTS, 104 I/O

4.07 mm

EE PLD

10

3200

149.3 MHz

104

10

10

MACROCELL

160

YES

4.75 V ~ 5.25 V

5.25 V

4.75 V

10.0ns

10

YES

1.45 mm

2 mm

1.25 mm

Unknown

无铅

N/A

-

表面贴装

表面贴装

100-LBGA

YES

28

100-FBGA (11x11)

100

40 mA

SQUARE

Intel Corporation

活跃

76

CPLD, MAX II

INTEL CORP

1.89 V

1.34

Compliant

76

440

FLASH

LBGA, BGA100,10X10,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA100,10X10,40

1.8 V

40

1.71 V

85 °C

有

EPM570GF100C5N

LBGA

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

SMD/SMT

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

1 mm

compliant

1.8797 GHz

EPM570

S-PBGA-B100

不合格

1.5/3.3,1.8 V

OTHER

系统内可编程

Parallel

1 kB

8

8.7 ns

8.7 ns

40 mA

0 DEDICATED INPUTS, 76 I/O

Analog, Digital

1.7 mm

闪存 PLD

1 B

570

25 µs

1 LSB

304 MHz

76

2

57

5

MACROCELL

440

YES

1.71 V ~ 1.89 V

3.3 V

2.7 V

5.4ns

570

YES

11 mm

11 mm

无

Unknown

无铅

N/A

-

表面贴装

表面贴装

100-TQFP

100

100-TQFP (14x14)

Altera

8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

Compliant

EEPROM

Bulk

EPM7064

活跃

68

64

0°C ~ 70°C (TA)

Tray

MAX® 7000B

Obsolete

70 °C

0 °C

250 MHz

EPM7064

系统内可编程

5 ns

4

1250

303 MHz

68

4

2.375 V ~ 2.625 V

3.6 V

3 V

5.0ns

4

含铅

N/A

-

表面贴装

表面贴装

144-LQFP

YES

44

144-TQFP (20x20)

144

EPM7512AETC144-10

87 MHz

LFQFP

SQUARE

Altera Corporation

Transferred

120

ALTERA CORP

3.6 V

3.8

QFP

120

512

Compliant

EEPROM

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

3.3 V

30

3 V

70 °C

无

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

无

活跃

3A991

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

220

0.5 mm

unknown

125 MHz

EPM7512

144

S-PQFP-G144

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

10 ns

0 DEDICATED INPUTS, 120 I/O

1.6 mm

EE PLD

32

10000

116.3 MHz

36

32

MACROCELL

512

YES

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

32

YES

20 mm

20 mm

含铅

N/A

-

表面贴装

表面贴装

64-TQFP Exposed Pad

YES

64

64-EQFP (7x7)

64

25 µA

SQUARE

Intel Corporation

活跃

54

CPLD, MAX V, 64 cell 184.1MHz, EQFP64 EP 5M80ZE64C4N, CPLD MAX V Flash 64 Cells, 54 I/O, 80 Labs, 7.9ns, ISP, 1.71 u2192 1.89 V 64-Pin EQFP

INTEL CORP

1.89 V

1.53

Non-Compliant

64

54

FLASH

HTFQFP, TQFP64,.35SQ,16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

TQFP64,.35SQ,16

1.8 V

未说明

1.71 V

85 °C

有

5M80ZE64C4N

184.1 MHz

HTFQFP

0°C ~ 85°C (TJ)

Tray

MAX® V

e3

活跃

EAR99

哑光锡

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

QUAD

鸥翼

未说明

0.4 mm

compliant

5M80Z

S-PQFP-G64

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

7.9 ns

25 µA

54 I/O

1.2 mm

闪存 PLD

80

152 MHz

54

8

MACROCELL

64

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

80

YES

1.05 mm

7 mm

7 mm

N/A

-

表面贴装

STQFN-14

14-STQFN (1.6x2)

Dialog Semiconductor GmbH

1

Amphenol

Amphenol Aerospace

38999

Details

126 ns

23

+ 85 C

5.5 V

- 40 C

2.3 V

SMD/SMT

25 MHz

10

Tape & Reel (TR)

活跃

-40°C ~ 85°C (TA)

MouseReel

D38999 III

Circular Connectors

2.5 V to 5 V

OTP

军规圆形连接器

2.3V ~ 5.5V

军规圆形连接器

N/A

-

表面贴装

表面贴装

240-BFQFP Exposed Pad

YES

240

240-RQFP (32x32)

240

146 mA

SQUARE

FQFP

100 MHz

EPM9560RI240-20

无

85 °C

4.5 V

30

5 V

-40 °C

HQFP240,1.37SQ,20

PLASTIC/EPOXY

Non-Compliant

191

560

EEPROM

POWER, RQFP-240

FLATPACK, FINE PITCH

3

QFP

5.39

5.5 V

ALTERA CORP

191

Transferred

Altera Corporation

-40°C ~ 85°C (TA)

Tray

MAX® 9000

e0

无

Obsolete

Tin/Lead (Sn/Pb)

85 °C

-40 °C

772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

5 V

QUAD

鸥翼

220

0.5 mm

unknown

100 MHz

EPM9560

240

S-PQFP-G240

不合格

3.3/5,5 V

INDUSTRIAL

系统内可编程

20 ns

20 ns

146 mA

0 DEDICATED INPUTS, 191 I/O

4.1 mm

EE PLD

35

12000

100 MHz

191

35

20

MACROCELL

560

YES

4.5 V ~ 5.5 V

5.5 V

4.5 V

20.0ns

35

YES

32 mm

32 mm

无

含铅

N/A

-

表面贴装

表面贴装

100-TFBGA

YES

100

100-MBGA (6x6)

100

25 µA

85 °C

1.71 V

40

1.8 V

BGA100,11X11,20

PLASTIC/EPOXY

79

128

Compliant

FLASH

TFBGA, BGA100,11X11,20

GRID ARRAY, THIN PROFILE, FINE PITCH

1.55

1.89 V

INTEL CORP

79

活跃

Intel Corporation

SQUARE

TFBGA

118.3 MHz

5M160ZM100C5N

有

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

EAR99

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

0.5 mm

compliant

1.4749 GHz

5M160Z

S-PBGA-B100

不合格

1.2/3.3,1.8 V

OTHER

系统内可编程

1 kB

14 ns

25 µA

79 I/O

1.2 mm

闪存 PLD

160

152 MHz

79

8

5

MACROCELL

128

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

160

YES

6 mm

6 mm

无

N/A

-

表面贴装

表面贴装

256-LBGA

YES

256

256-FBGA (17x17)

256

2 mA

BGA256,16X16,40

PLASTIC/EPOXY

GRID ARRAY, LOW PROFILE

LBGA, BGA256,16X16,40

Altera 5M1270ZF256C4N, Complex Programmable Logic Device CPLD MAX V Flash 980 Cells, 211 I/O, 1270 Labs, 8.1ns, ISP,

INTEL CORP

1.89 V

1.57

211

980

Compliant

FLASH

有

5M1270ZF256C4N

247.5 MHz

LBGA

SQUARE

Intel Corporation

活跃

211

85 °C

1.71 V

40

1.8 V

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

3A991

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

1 mm

compliant

2.3148 GHz

5M1270

S-PBGA-B256

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

8.1 ns

2 mA

211 I/O

1.55 mm

闪存 PLD

1270

304 MHz

211

1270

MACROCELL

980

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

6.2ns

1270

YES

1.25 mm

17 mm

17 mm

N/A

-

表面贴装

表面贴装

68-TFBGA

68

68-MBGA (5x5)

25 µA

FLASH

Compliant

52

64

-40°C ~ 100°C (TJ)

Tray

MAX® V

活跃

85 °C

-40 °C

5.5 V

1.4749 GHz

5M80Z

1

3.65 V

系统内可编程

1 kB

10 A

25 µA

80

152 MHz

52

8

5

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

80

N/A

-

表面贴装

表面贴装

44-TQFP

YES

44

44-TQFP (10x10)

44

3 V

85 °C

有

EPM7064AETI44-7N

135.1 MHz

LQFP

SQUARE

Altera Corporation

Transferred

36

Programmable Logic Device

ALTERA CORP

3.6 V

3.6

QFP

Non-Compliant

EEPROM

36

64

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

TQFP44,.47SQ,32

-40 °C

3.3 V

40

-40°C ~ 85°C (TA)

Tray

MAX® 7000A

e3

有

活跃

EAR99

Matte Tin (Sn) - annealed

85 °C

-40 °C

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

260

0.8 mm

unknown

166.67 MHz

EPM7064

44

S-PQFP-G44

36

不合格

2.5/3.3,3.3 V

INDUSTRIAL

系统内可编程

7.5 ns

7.5 ns

PLA-TYPE

36

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

4

1250

222.2 MHz

4

7

MACROCELL

64

YES

3 V ~ 3.6 V

3.6 V

3 V

7.5ns

4

YES

2048

950 µm

10 mm

10 mm

无

Unknown

无铅

N/A

-

表面贴装

32-VFQFN Exposed Pad

YES

32-QFN (5x5)

32

80 mA

Lattice Semiconductor Corporation

无

ISPGAL22V10AC-75LN

100 MHz

HVQCCN

SQUARE

活跃

10

ROCHESTER ELECTRONICS INC

1.95 V

5.75

QFN

3000

Aptiv

Aptiv (formerly Delphi)

Details

10

Bulk

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1

UNSPECIFIED

1.8 V

30

1.65 V

0°C ~ 75°C (TA)

Reel

ispGAL™

e0

无

锡铅

90 °C

0 °C

汽车连接器

CMOS

QUAD

无铅

240

0.5 mm

unknown

32

S-XQCC-N32

COMMERCIAL

系统内可编程

7.5 ns

11 DEDICATED INPUTS, 10 I/O

1 mm

EE PLD

汽车连接器

166 MHz

MACROCELL

11

1.65V ~ 1.95V

1.95 V

1.65 V

7.5 ns

汽车连接器

5 mm

5 mm

N/A

-

表面贴装

表面贴装

256-BGA

YES

256

256-FBGA (17x17)

256

Altera

3.3 V

40

3 V

70 °C

有

EPM7512AEFC256-12N

71.9 MHz

BGA

SQUARE

Altera Corporation

Transferred

212

ALTERA CORP

3.6 V

5.1

BGA

有

212

512

EEPROM

Bulk

EPM7512

活跃

FINE LINE, BGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e1

有

活跃

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

BOTTOM

BALL

260

1 mm

unknown

100 MHz

EPM7512

256

S-PBGA-B256

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

12 ns

0 DEDICATED INPUTS, 212 I/O

2.1 mm

EE PLD

32

10000

116.3 MHz

212

32

MACROCELL

512

YES

3 V ~ 3.6 V

3.6 V

3 V

12.0ns

32

YES

17 mm

17 mm

无铅

N/A

-

表面贴装

表面贴装

256-BGA

YES

256

256-FBGA (17x17)

AL

256

0 C

90

3 V

SMD/SMT

32

970457

Intel

Intel / Altera

116.3 MHz

MAX 7000

EEPROM

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

3.3 V

30

70 °C

无

EPM7512AEFC256-12

71.9 MHz

BGA

SQUARE

活跃

212

INTEL CORP

5.13

有

212

512

有

7.5 ns

+ 70 C

3.6 V

0°C ~ 70°C (TA)

Tray

1590

e0

活跃

3A991

Tin/Lead (Sn/Pb)

70 °C

0 °C

512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑集成电路

CMOS

3.3 V

BOTTOM

BALL

220

1 mm

compliant

100 MHz

EPM7512

S-PBGA-B256

不合格

2.5/3.3,3.3 V

COMMERCIAL

Flanged Lid

系统内可编程

12 ns

0 DEDICATED INPUTS, 212 I/O

2.1 mm

EE PLD

32

CPLD - Complex Programmable Logic Devices

10000

116.3 MHz

212

32

MACROCELL

512

YES

3 V ~ 3.6 V

3.6 V

3 V

12.0ns

32

YES

Multipurpose

CPLD - Complex Programmable Logic Devices

IP65

17 mm

17 mm

含铅

N/A

-

表面贴装

SMD

100-TQFP

YES

100

100-TQFP (14x14)

100

3 V

85 °C

无

EPM3064ATI100-10

100 MHz

LFQFP

SQUARE

Intel Corporation

Obsolete

66

INTEL CORP

3.6 V

5.22

n/a

有

66

64

EEPROM

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

3.3 V

30

-40...+125°C

Tray

LT

e0

Obsolete

EAR99

Tin/Lead (Sn/Pb)

85 °C

-40 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

235

0.5 mm

compliant

100-1000kHz

EPM3064

S-PQFP-G100

不合格

75V

固定式

2.5/3.3,3.3 V

INDUSTRIAL

-

系统内可编程

10 ns

10 ns

0 DEDICATED INPUTS, 66 I/O

1.27 mm

EE PLD

4

1250

222.2 MHz

66

4

10

MACROCELL

64

YES

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

4

YES

4,5V...+40V

14 mm

14 mm

无

含铅

N/A

-

表面贴装

表面贴装

100-TQFP

100

100-TQFP (14x14)

PEI-Genesis

EPM7064

Compliant

EEPROM

Bulk

活跃

68

64

0°C ~ 70°C (TA)

Tray

*

Obsolete

70 °C

0 °C

333.33 MHz

EPM7064

系统内可编程

3.5 ns

3.5 ns

4

1250

303 MHz

68

4

2.375 V ~ 2.625 V

3.6 V

3 V

3.5ns

4

N/A

-

表面贴装

表面贴装

8-SMD, Flat Lead

YES

144

SNT-8A

144

ABLIC Inc.

PLASTIC/EPOXY

QFP144,.63SQ,20

-40 °C

3.3 V

20

3 V

85 °C

无

EPM7256AETI144-7

126.6 MHz

LFQFP

SQUARE

Intel Corporation

活跃

120

INTEL CORP

3.6 V

1.63

Tape & Reel (TR)

S-85S1

活跃

120

256

8542390000

Compliant

EEPROM

LFQFP, QFP144,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

-40°C ~ 85°C (TA)

Tray

S-85S1PD

e0

活跃

3A991

Tin/Lead (Sn/Pb)

85 °C

-40 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

220

0.5 mm

compliant

166.67 MHz

EPM7256

S-PQFP-G144

Step-Down

1

不合格

5.5V

固定式

2.2V

2.5/3.3,3.3 V

INDUSTRIAL

系统内可编程

Positive

200mA

7.5 ns

7.5 ns

3.8V

巴克

1MHz

0 DEDICATED INPUTS, 120 I/O

1.6 mm

EE PLD

有

16

5000

-

172.4 MHz

36

16

7

MACROCELL

256

YES

3 V ~ 3.6 V

3.6 V

3 V

7.5ns

16

YES

20 mm

20 mm

无

含铅

N/A

-

表面贴装

Back Mount

144-LQFP

YES

4

144-TQFP (20x20)

144

2 mA

600 VAC, 600 VDC

未说明

1.71 V

85 °C

有

201.1 MHz

LFQFP

SQUARE

活跃

114

ALTERA - 5M1270ZT144C5N - CPLD, MAX V, 1270 LE, 144TQFP

INTEL CORP

1.89 V

1.56

Turck

CSA, UL

UX02152

980

114

8542390000

Compliant

FLASH

MSL 3 - 168 hours

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

QFP144,.87SQ,20

1.8 V

0°C ~ 85°C (TJ)

Tray

MAX® V

e3

活跃

3A991

哑光锡

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

QUAD

鸥翼

未说明

0.5 mm

compliant

9 A

118.3 MHz

5M1270

S-PQFP-G144

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

6.2 ns

2 mA

114 I/O

1.6 mm

闪存 PLD

1270

--

304 MHz

114

8

5

MACROCELL

980

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

6.2ns

1270

YES

IP68

4 m

20 mm

无

无SVHC

无铅

N/A

-

表面贴装

表面贴装

64-TQFP Exposed Pad

YES

64

64-EQFP (7x7)

64

25 µA

1.71 V

85 °C

有

118.3 MHz

HTFQFP

SQUARE

活跃

54

ALTERA - 5M160ZE64C5N - CPLD, MAX V, 160 LE, 64EQFP

INTEL CORP

1.89 V

0.96

VG7291CT+423AGA

Johnson Controls

54

128

MSL 3 - 168 hours

8542390000

Compliant

FLASH

HTFQFP, TQFP64,.35SQ,16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

TQFP64,.35SQ,16

1.8 V

未说明

0°C ~ 85°C (TJ)

Tray

MAX® V

e3

活跃

EAR99

哑光锡

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

QUAD

鸥翼

未说明

0.4 mm

compliant

118.3MHz

5M160Z

S-PQFP-G64

不合格

1.2/3.3,1.8 V

OTHER

系统内可编程

1 kB

7.5ns

25 µA

54 I/O

1.2 mm

闪存 PLD

160

152 MHz

54

160

MACROCELL

128

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

160

YES

Sweat

7 mm

7 mm

无SVHC

N/A

-

表面贴装

Back Mount

100-TQFP

4

100-TQFP (14x14)

657.000198 mg

60 VAC, 60 VDC

Turck

128

79

MSL 3 - 168 hours

8542390000

Compliant

FLASH

UX02175

CSA, UL

0°C ~ 85°C (TJ)

Tray

MAX® V

活跃

85 °C

0 °C

1.8 V

2 A

118.3MHz

5M160Z

系统内可编程

1 kB

7.5ns

25 µA

160

152 MHz

8

5

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

160

IP68

1.05 mm

4 m

14 mm

无

无SVHC

N/A

-

表面贴装

表面贴装

100-TQFP

100

100-TQFP (14x14)

27 µA

Compliant

FLASH

VH1241AG+923AGA

Johnson Controls

74

440

MSL 3 - 168 hours

0°C ~ 85°C (TJ)

Tray

MAX® V

活跃

85 °C

0 °C

1.8 V

184.1MHz

5M570Z

系统内可编程

1 kB

9ns

27 µA

570

152 MHz

74

8

4

1.71 V ~ 1.89 V

1.89 V

1.71 V

9.0ns

570

16 mm

16 mm

无

无SVHC

N/A

• 1: ¥2.532209
• 10: ¥2.388876
• 100: ¥2.253656
• 500: ¥2.126092
查看所有的价格

-

表面贴装

8-UFQFN

8-STQFN (1x1.2)

Renesas Design Germany GmbH

SMD/SMT

2 MHz

5

Tape & Reel (TR)

7

活跃

MSL 1 - Unlimited

432.8 ns

+ 85 C

- 40 C

-40°C ~ 85°C (TA)

-

1.8 V, 3.3 V, 5 V

OTP

1.71V ~ 1.89V, 3V ~ 3.6V, 4.5V ~ 5.5V

N/A

-

表面贴装

表面贴装

100-LQFP

100-TQFP (14x14)

AMD

XC2C384

活跃

Non-Compliant

118

Tray

384

0°C ~ 70°C (TA)

CoolRunner II

70 °C

0 °C

2

系统内可编程

2

20 mA

50 V/µs

90 mA

1.8 mV

165 MHz

9000

7

23 µA

1.7V ~ 1.9V

7.1 ns

24

含铅

N/A

-

表面贴装

表面贴装

100-TQFP

YES

100

100-TQFP (14x14)

100

55 mA

活跃

80

CPLD - Complex Programmable Logic Devices CPLD - MAX II 192 Macro 80 IOs

INTEL CORP

2.625 V

0.61

80

192

FLASH

Compliant

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

40

2.375 V

有

EPM240T100I5N

TFQFP

SQUARE

Intel Corporation

-40°C ~ 100°C (TJ)

Tray

MAX® II

e3

活跃

SMD/SMT

EAR99

Matte Tin (Sn) - annealed

100 °C

-40 °C

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

260

0.5 mm

compliant

201.1 MHz

EPM240

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

系统内可编程

1 kB

7.5 ns

7.5 ns

55 mA

0 DEDICATED INPUTS, 80 I/O

1.2 mm

闪存 PLD

240

304 MHz

80

24

5

MACROCELL

192

YES

2.5V, 3.3V

3.6 V

2.375 V

4.7ns

240

YES

1 mm

14 mm

14 mm

无

无SVHC

无铅

N/A

-

表面贴装

表面贴装

100-LBGA

YES

100

100-FBGA (11x11)

100

129.9 MHz

LBGA

SQUARE

Intel Corporation

活跃

84

INTEL CORP

3.6 V

5.09

Non-Compliant

84

128

EEPROM

LBGA, BGA100,10X10,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA100,10X10,40

3.3 V

30

3 V

70 °C

无

EPM7128AEFC100-7

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

活跃

3A991

Tin/Lead (Sn/Pb)

70 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

BOTTOM

BALL

235

1 mm

compliant

166.67 MHz

EPM7128

S-PBGA-B100

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

7.5 ns