N/A

-

活跃

嵌入式ARIES

Box

0°C ~ 70°C

-

2.760 L x 1.380 W (70.00mm x 35.00mm)

100 Pin

25MHz

128MB

-

FPGA

-

-

N/A

-

活跃

嵌入式ARIES

Box

0°C ~ 70°C

-

2.910 L x 1.650 W (74.00mm x 42.00mm)

360 Pin

600MHz

1GB

ARM Cortex-A9 (Dual Core)

FPGA

4GB

-

N/A

-

活跃

Intel

Bulk

-

N/A

-

Xilinx

1 GB

50 mm x 40 mm

+ 85 C

- 40 C

DP, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, USB 3.0

1 GB

Trenz Electronic GmbH

XCZU3CG-L1SFVC784I

Bulk

活跃

-40°C ~ 85°C

TE0823

1.970 L x 1.570 W (50.00mm x 40.00mm)

USB

3.3 V to 5 V

1 GB

-

1GB

ARM Cortex-A53, ARM® Cortex®-R5

40 mm x 50 mm

MCU, FPGA

128MB

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

N/A

-

活跃

嵌入式ARIES

Box

0°C ~ 70°C

PolarFire™

2.910 L x 1.650 W (74.00mm x 42.00mm)

Board-to-Board (BTB) Socket

-

1GB

-

FPGA

-

-

N/A

-

活跃

嵌入式ARIES

Box

0°C ~ 70°C

PolarFire™

2.910 L x 1.650 W (74.00mm x 42.00mm)

Board-to-Board (BTB) Socket

-

2.5GB

MPFS250T

FPGA

4GB

-

N/A

-

45 mm x 40 mm

Digi

+ 85 C

- 40 C

Box

活跃

-40°C ~ 85°C

*

Pin(s)

1 GB

2GB

单片机核心

32GB

-

N/A

-

活跃

嵌入式ARIES

Box

0°C ~ 70°C

PolarFire™

-

Board-to-Board (BTB) Socket

-

1GB

-

FPGA

-

-

N/A

-

活跃

嵌入式ARIES

Box

-25°C ~ 85°C

-

-

-

528MHz

128MB

SAMA5D42

-

4GB (NAND)

-

N/A

-

活跃

Trenz Electronic GmbH

Bulk

-

N/A

-

Box

嵌入式ARIES

活跃

0°C ~ 70°C

-

2.910 L x 1.650 W (74.00mm x 42.00mm)

360 Pin

800MHz

1GB

ARM Cortex-A9 (Dual Core)

FPGA

4GB

-

N/A

-

活跃

Intel

Bulk

-

N/A

-

活跃

Trenz Electronic GmbH

Bulk

-

TE0820

-

-

-

2GB

-

MPU核心

128MB

-

N/A

-

最后一次购买

Trenz Electronic GmbH

Bulk

-40°C ~ 85°C

TE0714

1.570 L x 1.180 W (40.00mm x 30.00mm)

-

-

-

Artix-7 A35T

FPGA

16MB

Artix-7

N/A

-

Obsolete

Trenz Electronic GmbH

Bulk

-40°C ~ 85°C

TE0720

1.970 L x 1.570 W (50.00mm x 40.00mm)

萨姆泰克 LSHM

125MHz

1GB

ARM Cortex-A9

MCU, FPGA

4GB

Zynq-7000 (Z-7020)

N/A

-

活跃

Trenz Electronic GmbH

Bulk

0°C ~ 85°C

TE0820

1.970 L x 1.570 W (50.00mm x 40.00mm)

Pin(s)

-

2GB

ARM® Cortex®-A53, ARM® Cortex®-R5

MPU核心

128MB

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E

N/A

-

1

Trenz Electronic GmbH

Trenz Electronic

Trenz Electronic

Bulk

Obsolete

-40°C ~ 85°C

TE0823

1.970 L x 1.570 W (50.00mm x 40.00mm)

USB

Computing

-

1GB

ARM Cortex-A53, ARM® Cortex®-R5

System-On-Modules - SOM

MCU, FPGA

128MB

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

System-On-Modules - SOM

N/A

-

活跃

Trenz Electronic GmbH

Bulk

0°C ~ 85°C

TE0820

1.970 L x 1.570 W (50.00mm x 40.00mm)

Pin(s)

-

2GB

ARM® Cortex®-A53, ARM® Cortex®-R5

MPU核心

128MB

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E

N/A

-

3

10bit

有

51Series

42

有

有

3.8V~5.5V

Low-Voltage Detection;CCP capture/comparison;Watchdog

有

Tray

60KB

true

2KB

FLASH

-40℃~+85℃

2

1

N/A

-

Tray

true

N/A

-

Tray

true

N/A

-

Tray

true

N/A

-

Box-packed

true

N/A

-

3

10bit

有

51Series

17

有

有

有

1.9V~5.5V

Low-Voltage Detection;CCP capture/comparison;Watchdog

Tray

true

8KB

16bit

有

1

1.25KB

FLASH

-40℃~+85℃

2

1

N/A

-

Tray

true