category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.PLDs（可编程逻辑器件）' (2797)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	端子表面处理	附加功能	HTS代码	包装方式	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	温度等级	传播延迟	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	输出功能	宏细胞数	JTAG BST	专用输入数量	系统内可编程	产品条款数量	长度	宽度
XC2C64-5CPG56I	AMD Xilinx	数据表	49 In Stock	-	最小起订量: 1 最小包装量: 1	YES	56	LFBGA	BGA56,10X10,20	-40 °C	85 °C	45	3	LFBGA,	BGA	XILINX INC	Obsolete	有	1.8 V	1.7 V	1.9 V	GRID ARRAY, LOW PROFILE, FINE PITCH	SQUARE	PLASTIC/EPOXY	e1	有	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)		8542.39.00.01		BOTTOM	BALL	260	0.5 mm	compliant	30	56	S-PBGA-B56		不合格	INDUSTRIAL	5 ns			0 DEDICATED INPUTS, 45 I/O	1.35 mm	闪存 PLD	MACROCELL						6 mm	6 mm
XCR5128C-12TQ128C	AMD Xilinx	数据表	902 In Stock	-	最小起订量: 1 最小包装量: 1	YES	128	LFQFP,	63 MHz	96	70 °C	PLASTIC/EPOXY	LFQFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	5.25 V	4.75 V	5 V	Obsolete	XILINX INC	QFP					8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown		128	R-PQFP-G128		不合格	COMMERCIAL	12 ns			2 DEDICATED INPUTS, 96 I/O	1.6 mm	EE PLD	MACROCELL			2			20 mm	14 mm
PAL16R8A-2CJ	AMD	数据表	324 In Stock	-	最小起订量: 1 最小包装量: 1	NO	20	DIP	DIP, DIP20,.3	18 MHz	75 °C	CERAMIC, GLASS-SEALED	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.25 V	4.75 V	5 V	无	Obsolete	ADVANCED MICRO DEVICES INC	e0		锡铅		8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-GDIP-T20	8	不合格	商业扩展	25 ns	PAL-TYPE	8	8 DEDICATED INPUTS, 0 I/O		OT PLD	REGISTERED			8		64
XCR3032-8PC44C	AMD Xilinx	数据表	185 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	74 MHz	33	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	3.6 V	3 V	3.3 V	Obsolete	XILINX INC	LCC	QCCJ,					8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	10.5 ns			2 DEDICATED INPUTS, 33 I/O	4.57 mm	EE PLD	MACROCELL			2			16.5862 mm	16.5862 mm
MACH211SP-10JI	AMD	数据表	820 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	Obsolete	ADVANCED MICRO DEVICES INC	LCC	QCCJ, LDCC44,.7SQ	80 MHz	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	无	e0		锡铅	4 PAL BLOCKS; BURIED MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	INDUSTRIAL	14 ns			0 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD	MACROCELL	64	NO		YES		16.5862 mm	16.5862 mm
MACH211SP-10JI	Vantis Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	74 MHz	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	无	Transferred	VANTIS CORP	e0		Tin/Lead (Sn/Pb)	由PIA连接的PAL块			QUAD	J BEND		1.27 mm	unknown			S-PQCC-J44		不合格	INDUSTRIAL	14 ns			0 DEDICATED INPUTS, 32 I/O		EE PLD	MACROCELL	64	NO		YES
GAL16V8-35LP	Lattice Semiconductor Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1
PZ3128IS15BE-S	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	PLASTIC/EPOXY	QFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK	3.3 V	无	Transferred	飞利浦半导体	QFP, QFP128,.63X.87,20	85 °C	-40 °C	e0		Tin/Lead (Sn/Pb)	YES	8542.39.00.01	TRAY	QUAD	鸥翼		0.5 mm	unknown			R-PQFP-G128		不合格	INDUSTRIAL	17.5 ns					EE PLD		128	YES		YES
PZ3128IS15BE-S	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	59 MHz	96	85 °C	-40 °C	PLASTIC/EPOXY	LFQFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	3.6 V	3 V	3.3 V	Transferred	NXP SEMICONDUCTORS	LFQFP,					8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown			R-PQFP-G128		不合格	INDUSTRIAL	17.5 ns			2 DEDICATED INPUTS, 96 I/O	1.6 mm	EE PLD	MACROCELL			2			20 mm	14 mm
PZ3128IS15BE-S	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	无	Obsolete	XILINX INC	QFP	LFQFP, QFP128,.63X.87,20	59 MHz	3	96	85 °C	-40 °C	PLASTIC/EPOXY	LFQFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	3.3 V	2.97 V	3.63 V	e0		锡铅	128 MACROCELLS	8542.39.00.01	TRAY	QUAD	鸥翼		0.5 mm	unknown		128	R-PQFP-G128		不合格	INDUSTRIAL	17.5 ns			2 DEDICATED INPUTS, 96 I/O	1.6 mm	EE PLD	MACROCELL	128	YES	2	YES		20 mm	14 mm
XH95180-7PQG160C	AMD Xilinx	数据表	722 In Stock	-	最小起订量: 1 最小包装量: 1	YES	160	3	133	PLASTIC/EPOXY	QFP	QFP160,1.2SQ	SQUARE	FLATPACK	5 V	有	Transferred	XILINX INC	QFP	PLASTIC, QFP-160	e3	有	哑光锡		8542.39.00.01		QUAD	鸥翼		0.65 mm	compliant		160	S-PQFP-G160		不合格					0 DEDICATED INPUTS, 133 I/O	3.94 mm	MASK PLD	MACROCELL						28 mm	28 mm
PZ5032-6BC	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	PLASTIC/EPOXY	QFP	TQFP44,.47SQ,32	SQUARE	FLATPACK	5 V	无	Obsolete	XILINX INC	QFP, TQFP44,.47SQ,32	3	70 °C				NO	8542.39.00.01		QUAD	鸥翼	240	0.8 mm	unknown	30		S-PQFP-G44		不合格	COMMERCIAL	8 ns					EE PLD		32	NO		NO
XC95108F-15PQG100C	AMD Xilinx	数据表	474 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	XILINX INC	QFP	QFP,	56 MHz	3	81	70 °C	PLASTIC/EPOXY	QFP	RECTANGULAR	FLATPACK	5 V	4.75 V	5.25 V	有	Obsolete	e3		Matte Tin (Sn)		8542.39.00.01		QUAD	鸥翼	250	0.65 mm	compliant	40	100	R-PQFP-G100		不合格	COMMERCIAL	15 ns			0 DEDICATED INPUTS, 81 I/O	3.4 mm	闪存 PLD	MACROCELL						20 mm	14 mm
XC7372-12PQ100I	AMD Xilinx	数据表	224 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	无	Obsolete	XILINX INC	QFP	PLASTIC, QFP-100	62.5 MHz	3	42	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP100,.7X.9	RECTANGULAR	FLATPACK	5.5 V	4.5 V	5 V	e0		锡铅	72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS	8542.39.00.01		QUAD	鸥翼	225	0.65 mm	not_compliant	30	100	R-PQFP-G100		不合格	INDUSTRIAL	28 ns			12 DEDICATED INPUTS, 42 I/O	3.4 mm	OT PLD	MACROCELL	72	NO	12	NO		20 mm	14 mm
XC2C128-7CPGG132C	AMD	数据表	361 In Stock	-	最小起订量: 1 最小包装量: 1	YES	132	8 X 8 MM, 0.50 MM PITCH, CSP-132	119 MHz	100	70 °C	PLASTIC/EPOXY	TFBGA	BGA132,14X14,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.9 V	1.7 V	1.8 V	有	活跃	ADVANCED MICRO DEVICES INC	e3		哑光锡				BOTTOM	BALL		0.5 mm	compliant			S-PBGA-B132	100	不合格	COMMERCIAL	7.5 ns	PLA-TYPE	100	0 DEDICATED INPUTS, 100 I/O	1.1 mm	闪存 PLD	MACROCELL	128					8 mm	8 mm
XC2C128-7CPGG132C	AMD Xilinx	数据表	361 In Stock	-	最小起订量: 1 最小包装量: 1	YES	132	XILINX INC	BGA	8 X 8 MM, 0.50 MM PITCH, CSP-132	119 MHz	100	70 °C	PLASTIC/EPOXY	TFBGA	BGA132,14X14,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.9 V	1.7 V	1.8 V	有	Transferred	e3	无	哑光锡		8542.39.00.01		BOTTOM	BALL		0.5 mm	compliant		132	S-PBGA-B132	100	不合格	COMMERCIAL	7.5 ns	PLA-TYPE	100	0 DEDICATED INPUTS, 100 I/O	1.1 mm	闪存 PLD	MACROCELL	128					8 mm	8 mm
XCR3384XL-7.5CS280C	AMD	数据表	727 In Stock	-	最小起订量: 1 最小包装量: 1	YES	280	SQUARE	BGA280,19X19,32	TFBGA	PLASTIC/EPOXY	70 °C	216	3	CHIP SCALE, BGA-280	ADVANCED MICRO DEVICES INC	活跃	无	GRID ARRAY, THIN PROFILE, FINE PITCH	3.6 V	3 V	3.3 V	e0		锡铅				BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B280		不合格	COMMERCIAL	7.5 ns			216 I/O	1.2 mm	EE PLD	MACROCELL						16 mm	16 mm
PZ5064C10BC	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	FLATPACK	5 V	无	Transferred	飞利浦半导体	70 °C	PLASTIC/EPOXY	QFP	TQFP44,.47SQ,32	SQUARE	e0		Tin/Lead (Sn/Pb)	YES	8542.39.00.01		QUAD	鸥翼		0.8 mm	unknown			S-PQFP-G44		不合格	COMMERCIAL	12.5 ns					EE PLD		64	YES		YES
XC7236A-25WC44I	AMD Xilinx	数据表	597 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	无	Obsolete	XILINX INC	QFJ	WQCCJ, LDCC44,.7SQ	33 MHz	1	30	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	WQCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V				PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-CQCC-J44		不合格	INDUSTRIAL	40 ns			2 DEDICATED INPUTS, 30 I/O	4.826 mm	UV PLD	MACROCELL	36	NO	2	NO		16.51 mm	16.51 mm
PZ5064-10A44	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5 V	无	Transferred	飞利浦半导体	QCCJ, LDCC44,.7SQ	70 °C	PLASTIC/EPOXY	QCCJ	e0		Tin/Lead (Sn/Pb)	NO	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown			S-PQCC-J44		不合格	COMMERCIAL	12.5 ns					EE PLD		64	NO		NO
PZ5064-10A44	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	77 MHz	32	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	Obsolete	NXP SEMICONDUCTORS	LCC	PLASTIC, SOT-187-2, LCC-44					8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	12.5 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD	MACROCELL			2			16.5862 mm	16.5862 mm
PZ5064-10A44	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5 V	无	Obsolete	XILINX INC	3	70 °C	PLASTIC/EPOXY	QCCJ	e0		锡铅	NO	8542.39.00.01		QUAD	J BEND	225	1.27 mm	not_compliant	30		S-PQCC-J44		不合格	COMMERCIAL	12.5 ns					EE PLD		64	NO		NO
PAL1016P8JC	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	DIP	DIP24,.3	RECTANGULAR	IN-LINE	无	Obsolete	NATIONAL SEMICONDUCTOR CORP	DIP, DIP24,.3	4	75 °C	CERAMIC, GLASS-SEALED	e0		锡铅	PROGRAMMABLE OUTPUT POLARITY; SECURITY FUSE	8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	unknown			R-GDIP-T24	8	不合格	商业扩展	6 ns	PAL-TYPE	16	12 DEDICATED INPUTS, 4 I/O	5.715 mm	OT PLD	COMBINATORIAL			12		64		7.62 mm
PAL1016P8JC	National Semiconductor Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	DIP	DIP24,.3	RECTANGULAR	IN-LINE	无	Obsolete	NATIONAL SEMICONDUCTOR CORP	DIP, DIP24,.3	4	75 °C	CERAMIC, GLASS-SEALED	e0		锡铅	PROGRAMMABLE OUTPUT POLARITY; SECURITY FUSE	8542.39.00.01		DUAL	THROUGH-HOLE		2.54 mm	unknown			R-GDIP-T24	8	不合格	商业扩展	6 ns	PAL-TYPE	16	12 DEDICATED INPUTS, 4 I/O	5.715 mm	OT PLD	COMBINATORIAL			12		64		7.62 mm
PZ3032CS10BC-T	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	57 MHz	32	70 °C	PLASTIC/EPOXY	TQFP	SQUARE	FLATPACK, THIN PROFILE	3.63 V	2.97 V	3.3 V	Obsolete	XILINX INC	QFP	TQFP,				32 MACROCELLS	8542.39.00.01		QUAD	鸥翼		0.8 mm	unknown		44	S-PQFP-G44		不合格	COMMERCIAL	13 ns			2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD	MACROCELL			2			10 mm	10 mm