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类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量																	厂商																				操作温度	系列	尺寸/尺寸	容差	JESD-609代码	终止次数	温度系数	类型	电阻	端子表面处理	组成	功率(瓦特)	附加功能	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	资历状况	电源	速度	数据总线宽度	输入数量
M2S025T-FG484I	Microchip	数据表	2043 In Stock	1: ¥1,197.883241 10: ¥1,130.078526 100: ¥1,066.111820 500: ¥1,005.765869 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	微芯片技术		1.2000 V	1.14 V	1.26 V	Non-Compliant	267	Tray	M2S025	活跃		-40 to 100 °C	SmartFusion®2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA						STD	FPGA - 25K Logic Modules				256KB
M2S025T-1FG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术		1.2000 V	1.14 V	1.26 V	267	Tray	M2S025	活跃			0 to 85 °C	SmartFusion®2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA						1	FPGA - 25K Logic Modules				256KB
XCZU7CG-2FBVB900E	AMD	数据表	793 In Stock	1: ¥23,075.796264 10: ¥22,317.017661 25: ¥22,161.884471 50: ¥22,007.829665 查看所有的价格 -	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		0.8500 V	0.808 V	0.892 V	204	Tray	XCZU7	活跃			0 to 100 °C	Zynq® UltraScale+™ MPSoC CG																						533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						2	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-
XCZU9EG-1FFVB1156E	AMD	数据表	975 In Stock	1: ¥22,694.246756 10: ¥21,948.014270 25: ¥21,795.446145 50: ¥21,643.938581 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	328	0.979 V	328	Tray	XCZU9	活跃				599,550	0.9500 V	0.922 V	0 to 100 °C	Zynq® UltraScale+™ MPSoC EG																						500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	XCZU9EG	MCU, FPGA					扩展工业	1	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	548,160			-
AGFB014R24B2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Cell (36)	-	Tycon Systems Inc.		Box	TPS-12	活跃	2.19 A	768			-40°C ~ 85°C	-	21.457 L x 19.291 W x 1.378 H (545.00mm x 490.00mm x 35.00mm)					Monocrystalline																1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							FPGA - 1.4M Logic Elements				-		16.92 V	35 W	2.07 A	20.87 V
AGIB027R31B3I3E	Intel	数据表	825 In Stock	1: ¥201,312.156943 10: ¥194,692.608262 25: ¥193,339.233630 50: ¥191,995.266757 查看所有的价格 -	最小起订量: 1 最小包装量: 1	-	-	PEI-Genesis				Bulk	活跃	720	-40°C ~ 100°C (TJ)	*																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							FPGA - 2.7M Logic Elements				-
AGFA008R24C2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805	KOA Speer Electronics, Inc.				活跃	RN73R2A	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	576	-55°C ~ 155°C	RN73R	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.5%		2	±50ppm/°C		59 Ohms		Thin Film	0.125W, 1/8W									-			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							FPGA - 764K Logic Elements				-	Automotive AEC-Q200, Moisture Resistant						0.024 (0.60mm)			AEC-Q200
AGFC023R25A1E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel				480	Tray	活跃	0°C ~ 100°C (TJ)	Agilex F																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							FPGA - 2.3M Logic Elements				-
AGFA008R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel				576	Tray	活跃	0°C ~ 100°C (TJ)	Agilex F																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							FPGA - 764K Logic Elements				-
XCZU49DR-2FFVF1760I	AMD	数据表	241 In Stock	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD				622	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC																						533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA							Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
AGFD019R25A2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel				480	Tray	活跃	-40°C ~ 100°C (TJ)	Agilex F																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							FPGA - 1.9M Logic Elements				-
AGFA027R24C2E1VR2	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel				744	Tray	活跃	0°C ~ 100°C (TJ)	Agilex F																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							FPGA - 2.7M Logic Elements				-
10AS048	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	PEI-Genesis				Bulk	活跃				*
M2S060TS-FGG676I	Microchip	数据表	2706 In Stock	1: ¥2,078.690409 10: ¥1,961.028690 100: ¥1,850.027065 500: ¥1,745.308548 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	微芯片技术	活跃	MICROSEMI CORP	1.26 V	5.81		387	Tray	M2S060	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	有	M2S060TS-FGG676I	BGA	SQUARE	Microsemi Corporation	-40°C ~ 100°C (TJ)	SmartFusion®2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm	compliant	S-PBGA-B676	387	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		387	2.44 mm	现场可编程门阵列	FPGA - 60K Logic Modules	56520	256KB	27 mm	27 mm
M2S010-1VFG256I	Microchip	数据表	25 In Stock	1: ¥550.922096 10: ¥519.737823 100: ¥490.318707 500: ¥462.564815 查看所有的价格 -	最小起订量: 1 最小包装量: 1	256-LBGA	YES	256-FPBGA (17x17)	256	微芯片技术	活跃	MICROSEMI CORP	1.26 V	5.77		138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	有	M2S010-1VFG256I	LFBGA	SQUARE	Microsemi Corporation	-40°C ~ 100°C (TJ)	SmartFusion®2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	S-PBGA-B256	138	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		138	1.56 mm	现场可编程门阵列	FPGA - 10K Logic Modules	12084	256KB	14 mm	14 mm
M2S060-1FG676I	Microchip	数据表	2562 In Stock	1: ¥1,933.287468 10: ¥1,823.856101 100: ¥1,720.618964 500: ¥1,623.225434 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	微芯片技术	活跃			Non-Compliant	387	Tray	M2S060	-40°C ~ 100°C (TJ)	SmartFusion®2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA							FPGA - 60K Logic Modules				256KB
M2S005S-1VF256I	Microchip	数据表	25 In Stock	1: ¥334.819232 10: ¥315.867197 100: ¥297.987928 500: ¥281.120682 查看所有的价格 -	最小起订量: 1 最小包装量: 1	256-LFBGA	256-FPBGA (14x14)	微芯片技术	161	Tray	M2S005	活跃	-	166 MHz	6060 LE	SMD/SMT	-	64 kB				-40°C ~ 100°C (TJ)	SmartFusion®2																						166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA							FPGA - 5K Logic Modules			1 Core	128KB
M2S025-1VF256	Microchip	数据表	2360 In Stock	1: ¥982.178221 10: ¥926.583224 100: ¥874.135121 500: ¥824.655772 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	微芯片技术	Non-Compliant	138	Tray	M2S025	活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB			0°C ~ 85°C (TJ)	SmartFusion®2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA							FPGA - 25K Logic Modules			1 Core	256KB
XCZU1EG-L2SFVA625E	AMD	数据表	2914 In Stock	1: ¥3,148.721262 10: ¥2,970.491754 100: ¥2,802.350710 500: ¥2,643.727091 查看所有的价格 -	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD				-	Tray	活跃	0°C ~ 100°C (TJ)	Zynq® UltraScale+™																					CAN/Serial I2C/SPI/U	533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		-		MPU, FPGA							-				-
XCZU67DR-L1FFVE1156I	AMD	数据表	989 In Stock	1: ¥146,519.282035 10: ¥141,701.433307 25: ¥140,716.418376 50: ¥139,738.250623 查看所有的价格 -	最小起订量: 1 最小包装量: 1
XCZU42DR-1FSVE1156E	AMD	数据表	866 In Stock	1: ¥75,330.632149 10: ¥72,853.609430 25: ¥72,347.179173 50: ¥71,844.269286 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD				366	Tray	活跃	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC																						500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA							Zynq®UltraScale+™ FPGA, 489K+ Logic Cells				-
XCZU42DR-2FFVE1156E	AMD	数据表	533 In Stock	1: ¥93,587.345635 10: ¥90,510.005450 25: ¥89,880.839570 50: ¥89,256.047244 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	活跃				RISC	1.8/2.5/3.3 V	CAN/Serial I2C/SPI/UART/USB	有	FPGA/Microcontroller	366	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC																					CAN/Serial I2C/SPI/U	533MHz, 1.333GHz	256 KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	64 Bit						Zynq®UltraScale+™ FPGA, 489K+ Logic Cells				-						ARM Cortex-A53/ARM Cortex-R5F
XCVM1402-1LSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD				726	Tray	活跃	0°C ~ 100°C (TJ)	Versal™ Prime																						400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							Versal™ Prime FPGA, 1.2M Logic Cells				-
XCVE1752-2LSENSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD				500	Tray	活跃	0°C ~ 100°C (TJ)	Versal™ AI Core																						450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							Versal™ AI Core FPGA, 1M Logic Cells				-
XCZU57DR-2FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD				-	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC DR																						533MHz, 1.3GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA							Zynq® UltraScale+™ RFSoC				-