类别是'category.片上系统(SoC)' (7695)
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![]() | XCVM1502-2HSIVFVC1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | 1 | Xilinx | Xilinx | 30.0000 ppm/°C | 20 kOhm | SOC - Systems on a Chip | 10.0000 W | Power | 880 mV | System-On-Modules - SOM | 5 | SoC FPGA | 47.62 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MSEVBVA1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | 0 C | 1 | Xilinx | Xilinx | 200 ppm/K | 2.15 Ohm | SOC - Systems on a Chip | 0.0625 W | 通用型 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 1 | 0.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-FGG484 | Microchip | 数据表 | 2478 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 1.26 V | 5.81 | Non-Compliant | 267 | Tray | M2S060 | 活跃 | - | 166 MHz | 56520 LE | - | 64 kB | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S060T-FGG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-1FC1152 | Microchip | 数据表 | 2932 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 不锈钢 | 不锈钢 | 1152 | 6.5 X 12 mm X 2 | 1 | 微芯片技术 | MICROSEMI CORP | 1.26 V | 5.81 | Universal | Concealed, Removable | Screw, Weld | 574 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | SMD/SMT | - | 64 kB | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S150-1FC1152 | BGA | SQUARE | Microsemi Corporation | 活跃 | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | Natural | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | Fasteners not included | FPGA - 150K Logic Modules | 146124 | Natural | 1 Core | 60.0 mm | 512KB | 5.0 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-L1FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 热塑橡胶 | 4000 | AMD | 135 °C | -40 °C | 12.5 mm | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 孔扣眼 | Black | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 6.4 mm | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 1.6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM63138DKFSBG | Broadcom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | - | Broadcom Limited | RISC | 2 | Ethernet | 420 | Broadcom Limited | Broadcom | Tray | 活跃 | - | - | Ethernet & Communication Modules | - | Ethernet | Ethernet | - | 32 Bit | Gateways | Gateways | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-FGG256I | Microchip | 数据表 | 905 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | 90 | SMD/SMT | - | Microchip | Microchip Technology / Atmel | SmartFusion | Details | - | 64 kB | Tray | 微芯片技术 | A2F200 | 活跃 | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.5 V | 30 | 1.425 V | 100 °C | 有 | A2F200M3F-FGG256I | 80 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 1.33 | 1.5000 V | 200000 | 200000 | 有 | - | 80 MHz | 2000 LE | 117 I/O | + 100 C | 0.690329 oz | - 40 C | -40 to 100 °C | Tray | A2F200 | e3 | Matte Tin (Sn) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | 不合格 | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 7 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | 现场可编程门阵列 | SoC FPGA | 200000 | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | SoC FPGA | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-FGG256 | Microchip | 数据表 | 300 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 有 | A2F060M3E-FGG256 | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | OTHER | 1536 CLBS, 60000 GATES | 1.7 mm | 现场可编程门阵列 | 1536 | 60000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-1FFVH1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L1FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Corner Holes | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Vinyl | AMD | 活跃 | US | EAR99 | 366 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Green/Red on White | 通用型 | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 不发光 | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Gloss | - | Repositionable Acrylic | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z014S-1CLG400I | AMD | 数据表 | 2429 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 125 | Tray | XC7Z014 | 活跃 | Industrial grade | 65000 | WCBGA | 1.0000 V | 125 | 表面贴装 | -40 to 100 °C | Zynq®-7000 | 400 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Artix™-7 FPGA, 65K Logic Cells | 81200 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-FCVG484I | Microchip | 数据表 | 2243 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | 微芯片技术 | 活跃 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 93000 LE | + 100 C | - 40 C | SMD/SMT | 4 x 32 kB | - | MCU - 136, FPGA - 276 | Tray | -40°C ~ 100°C | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z010-2CLG400I | AMD | 数据表 | 147 In Stock | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 130 | Tray | XC7Z010 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2LLEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB006R16A2I1V | Intel | 数据表 | 932 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 384 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-L1SFVC784I | AMD | 数据表 | 21 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z020-2CLG484CES | AMD | 数据表 | 872 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | AMD | 130 | Tray | XC7Z020 | Obsolete | 0°C ~ 85°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29I1HG | ALTERA | 数据表 | 983 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | 288 | 有 | 2 x 32 kB | 1.2 GHz | 220000 LE | + 100 C | 5.287155 oz | - 40 C | 1 | SMD/SMT | 27500 LAB | 964731 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS022E3F29I1HG | 活跃 | FPGA - Field Programmable Gate Array | INTEL CORP | 2.25 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E4F27I3SG | ALTERA | 数据表 | 783 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-672 | YES | 672 | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027E4F27I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 240 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964926 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E4F27I3SG | ALTERA | 数据表 | 620 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-672 | YES | 672 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E4F27I3SG | BGA | SQUARE | 活跃 | FPGA Arriau00ae 10 SX Family 320000 Cells 20nm Technology 0.9V 672-Pin FC-FBGA | INTEL CORP | 0.93 V | 5.45 | 240 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 973484 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K3F35I2LG | ALTERA | 数据表 | 898 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K3F35I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 24 | SMD/SMT | 82500 LAB | 965077 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH2F55I1VG | ALTERA | 数据表 | 929 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-2912 | 1 GHz | 2800000 LE | + 100 C | - 40 C | 10 | SMD/SMT | 350000 LAB | 960575 | Intel | Intel / Altera | Stratix | Details | 4 x 32 kB | - | 1160 | 有 | This product may require additional documentation to export from the United States. | 4 x 32 kB | -40°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 活跃 | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2800K Logic Elements | 4 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E3F27E2LG | ALTERA | 数据表 | 500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-672 | YES | 672 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E3F27E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 240 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 965338 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K4F40E3SG | ALTERA | 数据表 | 758 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K4F40E3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 21 | SMD/SMT | 82500 LAB | 965103 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 696 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH2F55E2LG | ALTERA | 数据表 | 649 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-2912 | 1 GHz | 2500000 LE | + 100 C | 0 C | 10 | SMD/SMT | 312500 LAB | 960567 | Intel | Intel / Altera | Stratix | Details | 4 x 32 kB | - | 1160 | 有 | This product may require additional documentation to export from the United States. | 4 x 32 kB | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 活跃 | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2500K Logic Elements | 4 Core | -- | SoC FPGA |
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