类别是'category.片上系统(SoC)' (7695)

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设备核心

XCVM1402-2MLINBVB1024
XCVM1402-2MLINBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD 赛灵思

1

Xilinx

Xilinx

424

活跃

+ 110 C

- 40 C

-40°C ~ 100°C (TJ)

SOC - Systems on a Chip

800 mV

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 1.2M Logic Cells

-

SoC FPGA

XCVM1802-2LLEVFVC1760-5189
XCVM1802-2LLEVFVC1760-5189
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0 C

1

Xilinx

Xilinx

+ 110 C

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

SoC FPGA

AGFC023R25A3E4X
AGFC023R25A3E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCZU11EG-2FFVC1156I
XCZU11EG-2FFVC1156I
AMD 数据表

587 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

360

Tray

XCZU11

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

AGIB027R31B2I3V
AGIB027R31B2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

720

-40°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFB006R16A2I3V
AGFB006R16A2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

384

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

AGIB019R18A2E3E
AGIB019R18A2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XCZU5EV-2SFVC784I
XCZU5EV-2SFVC784I
AMD 数据表

743 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU5

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XAZU2EG-1SFVC784Q
XAZU2EG-1SFVC784Q
AMD 数据表

974 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

128

Tray

XAZU2

活跃

-40°C ~ 125°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XC7Z045-2FF900I
XC7Z045-2FF900I
AMD 数据表

598 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

130

Tray

XC7Z045

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

AGFB023R25A3I3E
AGFB023R25A3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGFB023R25A2E2V
AGFB023R25A2E2V
Intel 数据表

200 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCZU17EG-3FFVC1760E
XCZU17EG-3FFVC1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

512

Tray

XCZU17

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

AGIB022R31B1E1V
AGIB022R31B1E1V
Intel 数据表

536 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

AGFB008R24C2I3V
AGFB008R24C2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

576

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

XCZU11EG-1FFVC1156I
XCZU11EG-1FFVC1156I
AMD 数据表

980 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

360

Tray

XCZU11

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCVC1502-1MLIVSVA2197
XCVC1502-1MLIVSVA2197
AMD 数据表

646 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Tray

活跃

586

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

AGFA008R24C3I3E
AGFA008R24C3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

576

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

XCVC1502-1MLIVSVA1596
XCVC1502-1MLIVSVA1596
AMD 数据表

791 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

AMD

478

Tray

活跃

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

AGFD019R25A2E3V
AGFD019R25A2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

MAX32680GLR
MAX32680GLR
Analog Devices 数据表

577 In Stock

-

最小起订量: 1

最小包装量: 1

88-VFLGA Exposed Pad

88-LGA (10x10)

100 MHz

+ 85 C

3.6 V

- 40 C

Analog Devices Inc./Maxim Integrated

2 V

SMD/SMT

I2C, SPI, UART

128 kB

MSL 3 - 168 hours

36

Tray

活跃

-40°C ~ 85°C (TA)

-

I2C, I2S, SPI, UART

100MHz

128kB

ARM® Cortex®-M4F

DMA, I²S, PWM, WDT

512KB

Bluetooth, I²C, SPI, UART

MCU

32bit

-

512kB

ARM Cortex-M4F

XCVC1802-1MSIVIVA1596
XCVC1802-1MSIVIVA1596
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD 赛灵思

500

活跃

+ 110 C

- 40 C

-40°C ~ 100°C (TJ)

800 mV

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVM1802-2MSIVSVA2197
XCVM1802-2MSIVSVA2197
Xilinx 数据表

720 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD 赛灵思

Tray

活跃

770

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1802-2MSIVSVD1760
XCVM1802-2MSIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

726

活跃

-40°C ~ 100°C (TJ)

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1802-1MSIVSVD1760
XCVM1802-1MSIVSVD1760
Xilinx 数据表

3000 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

Tray

活跃

726

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-