N/A

-

Stud Mount

DO-203AB, DO-5, Stud

DO-5

微芯片技术

Bulk

30 Ohms

活跃

-65°C ~ 175°C (TJ)

Military, MIL-PRF-19500/358

±5%

10 µA @ 83 V

1.5 V @ 10 A

50 W

110 V

N/A

-

Glenair

活跃

零售包装

*

N/A

-

表面贴装

Axial

Axial

Fairchild Semiconductor

Bulk

74AC573

Obsolete

-65°C ~ 350°C

Bulk

CW

0.312 Dia x 0.875 L (7.92mm x 22.23mm)

±5%

活跃

2

±30ppm/°C

13 Ohms

Wirewound

6.5W

2V ~ 6V

Tri-State

8:8

--

24mA, 24mA

D-Type Transparent Latch

1

8.5ns

Moisture Resistant, Pulse Withstanding

--

N/A

-

表面贴装

20-SOIC (0.295, 7.50mm Width)

20-SOIC

NXP USA Inc.

Bulk

74HC373

活跃

-40°C ~ 125°C

74HC

2V ~ 6V

Tri-State

1:8

7.8mA, 7.8mA

D-Type Transparent Latch

1

30ns

N/A

-

20

Aluminum

Square, Fins

Assorted (BGA, LGA, CPU, ASIC...)

蓝色阳极氧化

Compliant

pushPIN™

活跃

顶部安装

Non-Inverting

8

推销

0.984 (25.00mm)

7.87°C/W @ 100 LFM

7.8 mA

8

8

--

--

--

1.772 (45.00mm)

1.772 (45.00mm)

无铅

N/A

-

表面贴装

4527 J-Lead

4527

Vishay Dale

Tape & Reel (TR)

活跃

74HCT573

-65°C ~ 275°C

WSR

0.455 L x 0.275 W (11.56mm x 6.98mm)

±1%

2

±75ppm/°C

15 mOhms

金属元素

5W

4.5V ~ 5.5V

Tri-State

1:8

-

6mA, 6mA

D-Type Transparent Latch

1

17ns

Anti-Sulfur, Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding

0.100 (2.54mm)

AEC-Q200

N/A

-

表面贴装

Axial

Axial

Vishay Dale

Tape & Reel (TR)

ERC55

活跃

-65°C ~ 175°C

ERC

0.097 Dia x 0.280 L (2.46mm x 7.11mm)

±1%

2

±25ppm/°C

9.09 kOhms

Metal Film

0.25W, 1/4W

4.5V ~ 5.5V

Tri-State

8:8

-

32mA, 64mA

D-Type Transparent Latch

2

1.4ns

Moisture Resistant

-

N/A

-

YES

40

QORVO INC

QCCN, LCC40,.5SQ,40

85 °C

CERAMIC

QCCN

LCC40,.5SQ,40

SQUARE

CHIP CARRIER

无

活跃

8542.39.00.01

QUAD

无铅

4

1 mm

compliant

S-XQCC-N40

不合格

OTHER

10G

COMPLEMENTARY

D FLIP-FLOP

0.95 ns

积极优势

N/A

-

N/A

-

YES

16

Obsolete

RENESAS ELECTRONICS CORP

SOIC

SOP, SOP16,.3

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.3

RECTANGULAR

小概要

5 V

8542.39.00.01

DUAL

鸥翼

2

1.27 mm

compliant

16

R-PDSO-G16

不合格

5.5 V

INDUSTRIAL

4.5 V

2

ACT

2.2 mm

COMPLEMENTARY

J-K FLIP-FLOP

NEGATIVE EDGE

14 ns

80 MHz

80000000 Hz

10.06 mm

5.5 mm

N/A

-

N/A

-

N/A

-

YES

16

有

生命周期结束

TOSHIBA CORP

TSSOP

TSSOP, TSSOP16,.25

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

e4

有

镍钯金

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

unknown

30

16

R-PDSO-G16

不合格

3.6 V

INDUSTRIAL

2 V

6

LV/LV-A/LVX/H

1.2 mm

TRUE

D FLIP-FLOP

0.004 A

14.5 ns

积极优势

21 ns

95 MHz

55000000 Hz

5 mm

4.4 mm

N/A

-

N/A

-

NO

20

活跃

E2V TECHNOLOGIES PLC

,

50 pF

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

LG_MAX

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

R-GDIP-T20

5.5 V

4.5 V

8

ABT

5.08 mm

TRUE

D FLIP-FLOP

0.048 A

积极优势

6.8 ns

30 mA

150 MHz

150000000 Hz

25.019 mm

7.62 mm

N/A

-

NO

20

Obsolete

TEXAS INSTRUMENTS INC

DIP

DIP,

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

LG_MAX

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

20

R-GDIP-T20

5.5 V

MILITARY

4.5 V

8

ABT

5.08 mm

TRUE

D FLIP-FLOP

积极优势

6.8 ns

150 MHz

25.019 mm

7.62 mm

N/A

-

YES

14

无

Obsolete

TEXAS INSTRUMENTS INC

DFP

DFP, FL14,.3

25 pF

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DFP

FL14,.3

RECTANGULAR

FLATPACK

5 V

带独立设定输入

8542.39.00.01

DUAL

FLAT

未说明

1

1.27 mm

not_compliant

未说明

14

R-GDFP-F14

不合格

5.5 V

MILITARY

4.5 V

2

TTL/H/L

2.03 mm

COMPLEMENTARY

J-K FLIP-FLOP

38535Q/M;38534H;883B

NEGATIVE EDGE

20 ns

38 mA

40 MHz

8.725 mm

6.35 mm

N/A

-

YES

20

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

SOIC

SOP, SOP20,.4

50 pF

1

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

小概要

3.3 V

e0

锡铅

8542.39.00.01

DUAL

鸥翼

225

1

1.27 mm

not_compliant

20

20

R-PDSO-G20

不合格

3.6 V

INDUSTRIAL

2.7 V

8

LVC/LCX/Z

3-STATE

2.65 mm

TRUE

D FLIP-FLOP

0.024 A

积极优势

9.5 ns

12.8 mm

7.5 mm

N/A

-

YES

114

RENESAS ELECTRONICS CORP

BGA

LFBGA,

70 °C

PLASTIC/EPOXY

LFBGA

2.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

RECTANGULAR

BGA114,6X19,32

不推荐

8542.39.00.01

BOTTOM

BALL

1

0.8 mm

compliant

114

R-PBGA-B114

不合格

2.7 V

COMMERCIAL

2.3 V

24

SSTV

1.4 mm

TRUE

D FLIP-FLOP

积极优势

3.1 ns

200 MHz

16 mm

5.5 mm

N/A

-

YES

8

有

活跃

TOSHIBA CORP

SSOP-8

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

VSSOP

TSSOP8,.12,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

5 V

DUAL

鸥翼

未说明

1

0.5 mm

unknown

未说明

R-PDSO-G8

不合格

6 V

INDUSTRIAL

2 V

1

HC/UH

0.9 mm

COMPLEMENTARY

D FLIP-FLOP

0.0052 A

38 ns

积极优势

190 ns

25 mA

29 MHz

25000000 Hz

2.3 mm

2 mm

N/A

-

YES

16

无

Obsolete

TOSHIBA CORP

SOIC

LSSOP, SSOP16,.25

50 pF

85 °C

-40 °C

PLASTIC/EPOXY

LSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

3.3 V

DUAL

鸥翼

1

0.65 mm

unknown

16

R-PDSO-G16

不合格

5.5 V

INDUSTRIAL

2 V

4

AHC/VHC

1.6 mm

COMPLEMENTARY

D FLIP-FLOP

0.008 A

10.5 ns

积极优势

17 ns

125 MHz

75000000 Hz

5 mm

4.4 mm

N/A

-

NO

16

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP16,.3

125 °C

-55 °C

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

无

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

6

2.54 mm

unknown

R-XDIP-T16

不合格

MILITARY

D FLIP-FLOP

38535Q/M;38534H;883B

MASTER-SLAVE

123 mA

250000000 Hz

N/A

-

NO

14

Obsolete

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

125 °C

-55 °C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

unknown

R-XDIP-T14

不合格

MILITARY

J-K FLIP-FLOP

38535Q/M;38534H;883B

NEGATIVE EDGE

N/A

-

N/A

-

NO

16

Obsolete

SGS-ATES COMPONENTI ELECTRONICI S P A

DIP, DIP16,.3

125 °C

-55 °C

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-XDIP-T16

不合格

MILITARY

8

D 拉锁