N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

活跃

M7A3P1000

Tray

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.425V ~ 1.575V

272 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

272 MHz

1

24576

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

有

160

ProASIC3

97

Tray

微芯片技术

M1A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-2FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

有

90

ProASIC3

178

Tray

微芯片技术

M1A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-2FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

SMD/SMT

有

24

微芯片技术

Actel

0.196363 oz

5.5 V

Tray

A42MX24

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-3PQG160I

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

125 I/O

3 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

- 55 C

+ 125 C

SMD/SMT

有

微芯片技术

24

Actel

0.196363 oz

5.5 V

Tray

A42MX24

活跃

A42MX24-1PQG160M

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

有

125 °C

40

3.3 V

-55 °C

PLASTIC/EPOXY

3

FLATPACK

ROHS COMPLIANT, PLASTIC, QFP-160

This product may require additional documentation to export from the United States.

Details

125 I/O

3 V

-55°C ~ 125°C (TC)

Tray

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1

1410

2.1 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

M7A3P1000-2FGG256

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

310 MHz

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

AFS1500-2FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

-40°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

1500000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

M7AFS600

活跃

Details

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

0°C ~ 70°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

STD

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

Tray

M1A3PE3000

活跃

1.575 V

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-FG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7A3P1000-1FG256I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

-40 to 85 °C

Tray

M7A3P1000

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.7 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

256-BBGA

YES

136

0°C~70°C TA

Tray

ACEX-1K®

e1

Obsolete

3 (168 Hours)

256

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

2.375V~2.625V

BOTTOM

BALL

260

2.5V

1mm

compliant

40

EP1K10

S-PBGA-B256

136

不合格

2.52.5/3.3V

37.5MHz

0.5 ns

136

可加载 PLD

576

12288

56000

72

MIXED

576

2.1mm

17mm

17mm

符合RoHS标准

N/A

-

表面贴装

256-BGA

YES

171

0°C~85°C TJ

Tray

FLEX 6000

e0

Obsolete

3 (168 Hours)

256

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

3V~3.6V

BOTTOM

BALL

220

3.3V

1mm

compliant

30

EPF6016

S-PBGA-B256

171

不合格

2.5/3.33.3V

133MHz

171

可加载 PLD

1320

16000

132

MACROCELL

4

2.1mm

17mm

17mm

Non-RoHS Compliant

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

微芯片技术

40

Actel

Tray

A42MX24

活跃

5.5 V

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

A42MX24-1TQG176I

105.57 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

150 I/O

3 V

-40°C ~ 85°C (TA)

Tray

A42MX24

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.5 V

Tray

A42MX24

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-1PQG160I

105.57 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

125 I/O

3 V

-40°C ~ 85°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

175 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

280 MHz

有

微芯片技术

24

Actel

3.6 V

Tray

A54SX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX16P-1PQG208I

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.23

-40°C ~ 85°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3 V, 5 V

3.3,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

Details

175 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

227 MHz

有

24

Actel

2.75 V

Tray

A54SX16

活跃

-40°C ~ 125°C (TA)

Tray

A54SX16A

2.25V ~ 5.25V

2.5 V

24000

1452

STD

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

M7AFS600

活跃

Details

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

1

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M7AFS600-1FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40°C ~ 85°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

174 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

280 MHz

微芯片技术

有

24

Actel

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

3.3 V

40

125 °C

有

A54SX32-1PQG208M

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-55°C ~ 125°C (TC)

Tray

A54SX32

e3

3A001.A.2.C

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

MILITARY

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

微芯片技术

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

AX1000-2FGG676

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

Tray

M7A3P1000

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

85 °C

有

M7A3P1000-2PQG208I

350 MHz

FQFP

SQUARE

不推荐

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

310 MHz

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

微芯片技术

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

AX1000-FGG676

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

Details

360 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

微芯片技术

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

40

70 °C

有

A54SX72A-1FGG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

- 40 C

1.425 V

97 I/O

Details

This product may require additional documentation to export from the United States.

微芯片技术

160

IGLOOe

0.014110 oz

1.575 V

Tray

M1AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1AGL600V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

有

SMD/SMT

+ 85 C

-40°C ~ 85°C (TA)

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

24 In Stock

-

23 Weeks

Tin

表面贴装

表面贴装

144-LQFP

144

114

-40°C~85°C TC

Tray

1997

AT40KAL

yes

活跃

3 (168 Hours)

144

MAXIMUM USABLE GATES 50000

3V~3.6V

QUAD

鸥翼

3.3V

0.5mm

100MHz

AT40K10

192

3.3V

576B

576B

2304 CLBS, 40000 GATES

现场可编程门阵列

576

4608

20000

1

954

2.2 ns

2304

576

40000

20mm

20mm

无

ROHS3 Compliant

无铅