类别是'category.FPGA(可编程逻辑门阵列)' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 密度 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 最大结点温度(Tj) | 逻辑单元数 | 专用输入数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XC7K160T-1FBG676I | Xilinx Inc. | 数据表 | 490 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | YES | 400 | -40°C~100°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7K160 | 676 | S-PBGA-B676 | 400 | 11.83.3V | 1.4MB | 1818MHz | 120 ps | 400 | 现场可编程门阵列 | 162240 | 11980800 | 12675 | -1 | 202800 | 0.74 ns | 2.54mm | 27mm | 27mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | LCMXO2-1200HC-4TG144C | Lattice Semiconductor Corporation | 数据表 | 1607 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | FLASH | 107 | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 144 | 108 | 2.5V | 2.5/3.3V | 17.3kB | 3.49mA | 8kB | 7.24 ns | 现场可编程门阵列 | 1280 | 64 kb | 65536 | 160 | 640 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
![]() | XC6SLX25-2CSG324I | Xilinx Inc. | 数据表 | 272 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 324-LFBGA, CSPBGA | 324 | 226 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | XC6SLX25 | 324 | 226 | 不合格 | 1.2V | 117kB | 667MHz | 现场可编程门阵列 | 24051 | 958464 | 1879 | 2 | 30064 | 1.5mm | 15mm | 15mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | LCMXO2-2000HC-4TG100I | Lattice Semiconductor Corporation | 数据表 | 1712 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | 79 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-2000 | 100 | 80 | 2.5V | 2.5/3.3V | 21.3kB | 80μA | 9.3kB | 7.24 ns | 现场可编程门阵列 | 2112 | 75776 | 264 | 1056 | 1.4mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
![]() | XC6SLX4-2TQG144C | Xilinx Inc. | 数据表 | 149 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 102 | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | XC6SLX4 | 144 | 100 | 不合格 | 1.2V | 27kB | 667MHz | 现场可编程门阵列 | 3840 | 221184 | 300 | 600 | 2 | 4800 | 300 | 1.6mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | LCMXO2-1200HC-4TG100C | Lattice Semiconductor Corporation | 数据表 | 12000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | 79 | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 100 | 80 | 2.5V | 2.5/3.3V | 17.3kB | 3.49mA | 8kB | 7.24 ns | 现场可编程门阵列 | 1280 | 64 kb | 65536 | 160 | 640 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||
![]() | XC7K325T-2FFG900I | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 900-BBGA, FCBGA | YES | DDR3 | 500 | -40°C~100°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 未说明 | 1V | 1mm | not_compliant | 未说明 | XC7K325T | 900 | S-PBGA-B900 | 500 | 不合格 | 11.83.3V | 1GB | 2MB | 1818MHz | 500 | 现场可编程门阵列 | 326080 | 16404480 | 25475 | -2 | 407600 | 0.61 ns | 3.35mm | 31mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | LCMXO2-2000HC-4TG144I | Lattice Semiconductor Corporation | 数据表 | 455 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 144-LQFP | 144 | FLASH | 111 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-2000 | 144 | 112 | 2.5V | 2.5/3.3V | 21.3kB | 82μA | 9.3kB | 7.24 ns | 现场可编程门阵列 | 2112 | 75776 | 264 | 1056 | 1.4mm | 20mm | 20mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
![]() | XC7A200T-2FFG1156I | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 1156-BBGA, FCBGA | YES | DDR3 | 500 | -40°C~100°C TJ | Tray | 2009 | Artix-7 | e1 | yes | 活跃 | 4 (72 Hours) | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 1V | 1mm | XC7A200T | S-PBGA-B1156 | 500 | 1V | 1GB | 1.6MB | 1286MHz | 110 ps | 110 ps | 500 | 现场可编程门阵列 | 215360 | 13455360 | 16825 | -2 | 269200 | 1.05 ns | 3.1mm | 35mm | 35mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | XC6SLX25-2FTG256C | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 186 | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | XC6SLX25 | 256 | 186 | 不合格 | 1.2V | 117kB | 667MHz | 现场可编程门阵列 | 24051 | 958464 | 1879 | 2 | 30064 | 1.55mm | 17mm | 17mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | XC7A75T-2FGG484I | Xilinx Inc. | 数据表 | 920 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 484-BBGA | 484 | XC7A75T-2FGG484I | CMOS | 285 | -40°C~100°C TJ | Tray | 2010 | Artix-7 | e1 | yes | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 未说明 | 484 | 285 | 不合格 | 1V | 472.5kB | 850 ps | 850 ps | 现场可编程门阵列 | 75520 | 3870720 | 5900 | 1 | 94400 | 100°C | 2.6mm | 23mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | XC7K325T-2FFG900C | Xilinx Inc. | 数据表 | 980 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 900-BBGA, FCBGA | YES | 500 | 0°C~85°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 未说明 | 1V | 1mm | not_compliant | 未说明 | XC7K325T | 900 | S-PBGA-B900 | 500 | 不合格 | 1V | 11.83.3V | 2MB | 1818MHz | 500 | 现场可编程门阵列 | 326080 | 16404480 | 25475 | -2 | 407600 | 0.61 ns | 3.35mm | 31mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | XC6SLX9-2TQG144C | Xilinx Inc. | 数据表 | 1814 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 102 | 0°C~85°C TJ | Tray | 1999 | Spartan®-6 LX | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | XC6SLX9 | 144 | 102 | 不合格 | 1.2V | 72kB | 667MHz | 现场可编程门阵列 | 9152 | 589824 | 715 | 1430 | 2 | 11440 | 715 | 1.45mm | 20mm | 20mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | XC6SLX16-2FTG256C | Xilinx Inc. | 数据表 | 1980 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 186 | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | XC6SLX16 | 256 | 186 | 1.2V | 72kB | 667MHz | 现场可编程门阵列 | 14579 | 589824 | 1139 | 2 | 18224 | 1.55mm | 17mm | 17mm | 无 | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | XC7K160T-2FBG484I | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-BBGA, FCBGA | YES | 285 | -40°C~100°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7K160 | 484 | S-PBGA-B484 | 285 | 11.83.3V | 1.4MB | 1286MHz | 100 ps | 285 | 现场可编程门阵列 | 162240 | 11980800 | 12675 | -2 | 202800 | 0.61 ns | 2.54mm | 23mm | 23mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | LCMXO256C-3TN100C | Lattice Semiconductor Corporation | 数据表 | 9800 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | SRAM | 78 | 0°C~85°C TJ | Tray | 2000 | MachXO | e3 | yes | 活跃 | 3 (168 Hours) | 100 | SMD/SMT | EAR99 | Matte Tin (Sn) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 500MHz | 30 | LCMXO256 | 100 | 78 | 3.3V | 256B | 13mA | 0B | 4.9 ns | 4.9 ns | 闪存 PLD | 256 | 2 kb | 32 | MACROCELL | 128 | 256 | 7 | 1.6mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||
![]() | XC6SLX9-2TQG144I | Xilinx Inc. | 数据表 | 1500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 102 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 160MHz | 30 | XC6SLX9 | 144 | 102 | 不合格 | 1.2V | 72kB | 现场可编程门阵列 | 9152 | 589824 | 715 | 1430 | 2 | 11440 | 715 | 100°C | 1.6mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | XC6SLX16-2FTG256I | Xilinx Inc. | 数据表 | 280 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 186 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | XC6SLX16 | 256 | 186 | 不合格 | 1.2V | 72kB | 667MHz | 现场可编程门阵列 | 14579 | 589824 | 1139 | 2 | 18224 | 1.55mm | 17mm | 17mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | XC6SLX25-2FTG256I | Xilinx Inc. | 数据表 | 2390 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 186 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | XC6SLX25 | 256 | 186 | 不合格 | 1.2V | 117kB | 667MHz | 现场可编程门阵列 | 24051 | 958464 | 1879 | 2 | 30064 | 1.55mm | 17mm | 17mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | XC6SLX16-2CSG324I | Xilinx Inc. | 数据表 | 60 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 324-LFBGA, CSPBGA | 324 | 232 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | XC6SLX16 | 324 | 232 | 不合格 | 1.2V | 72kB | 667MHz | 现场可编程门阵列 | 14579 | 589824 | 1139 | 2 | 18224 | 1.5mm | 15mm | 15mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | XC5VLX50T-1FFG1136C | Xilinx Inc. | 数据表 | 607 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 1136-BBGA, FCBGA | 1136 | 480 | 0°C~85°C TJ | Tray | 1999 | Virtex®-5 LXT | e1 | yes | 活跃 | 4 (72 Hours) | SMD/SMT | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 0.95V~1.05V | BOTTOM | BALL | 245 | 1V | not_compliant | 550MHz | 30 | XC5VLX50 | 480 | 不合格 | 270kB | 现场可编程门阵列 | 46080 | 2211840 | 50000 | 3600 | 1 | 2.8mm | 35mm | 35mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
![]() | XC3S400A-4FTG256C | Xilinx Inc. | 数据表 | 900 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 195 | 0°C~85°C TJ | Tray | 2007 | Spartan®-3A | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 30 | XC3S400A | 256 | 160 | 不合格 | 1.2V | 1.22.5/3.3V | 45kB | 667MHz | 现场可编程门阵列 | 8064 | 368640 | 400000 | 896 | 4 | 0.71 ns | 896 | 1mm | 17mm | 17mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | XC3S200A-4VQG100C | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | 0°C~85°C TJ | Tray | 2007 | Spartan®-3A | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | XC3S200A | 100 | 62 | 不合格 | 1.2V | 1.21.2/3.33.3V | 36kB | 667MHz | 现场可编程门阵列 | 4032 | 294912 | 200000 | 448 | 4 | 0.71 ns | 448 | 1mm | 14mm | 14mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | XC7A100T-1FGG484C | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 484-BBGA | YES | 484 | 285 | 0°C~85°C TJ | Tray | 2009 | Artix-7 | e1 | 活跃 | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7A100T | 484 | 285 | 不合格 | 1V | 607.5kB | 1098MHz | 现场可编程门阵列 | 101440 | 4976640 | 7925 | -1 | 126800 | 1.27 ns | 2.6mm | 23mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | XC3S200A-4FTG256C | Xilinx Inc. | 数据表 | 2490 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | RAM | 195 | 0°C~85°C TJ | Tray | 1999 | Spartan®-3A | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | XC3S200A | 256 | 160 | 不合格 | 1.2V | 1.22.5/3.3V | 288kB | 667MHz | 4032 | 294912 | 200000 | 448 | 4 | 0.71 ns | 448 | 125°C | 1.55mm | 17mm | 17mm | Unknown | ROHS3 Compliant |
XC7K160T-1FBG676I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
LCMXO2-1200HC-4TG144C
Lattice Semiconductor Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX25-2CSG324I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
LCMXO2-2000HC-4TG100I
Lattice Semiconductor Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX4-2TQG144C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
LCMXO2-1200HC-4TG100C
Lattice Semiconductor Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K325T-2FFG900I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
LCMXO2-2000HC-4TG144I
Lattice Semiconductor Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A200T-2FFG1156I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX25-2FTG256C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A75T-2FGG484I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K325T-2FFG900C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX9-2TQG144C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX16-2FTG256C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K160T-2FBG484I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
LCMXO256C-3TN100C
Lattice Semiconductor Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX9-2TQG144I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX16-2FTG256I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX25-2FTG256I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX16-2CSG324I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC5VLX50T-1FFG1136C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC3S400A-4FTG256C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC3S200A-4VQG100C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A100T-1FGG484C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC3S200A-4FTG256C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
