2334 In Stock

-

8 Weeks

表面贴装

672-BGA

YES

393

-40°C~100°C TJ

Tray

Cyclone® IV GX

活跃

3 (168 Hours)

672

3A991

8542.39.00.01

1.16V~1.24V

BOTTOM

BALL

1.2V

1mm

EP4CGX110

S-PBGA-B672

393

不合格

1.21.2/3.32.5V

393

现场可编程门阵列

109424

5621760

6839

2.4mm

27mm

27mm

Non-RoHS Compliant

173 In Stock

-

10 Weeks

表面贴装

表面贴装

324-LFBGA, CSPBGA

324

210

0°C~100°C TJ

Tray

2010

Artix-7

e1

yes

活跃

3 (168 Hours)

324

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

ALSO OPERATES AT 1V SUPPLY

8542.39.00.01

0.95V~1.05V

BOTTOM

BALL

未说明

0.9V

0.8mm

未说明

324

210

不合格

900mV

0.9V

225kB

1098MHz

850 ps

850 ps

现场可编程门阵列

33208

1843200

2600

1.51 ns

33280

1.5mm

15mm

15mm

ROHS3 Compliant

969 In Stock

-

表面贴装

1508-BBGA, FCBGA

YES

1126

0°C~85°C TJ

Tray

Stratix® II

e0

不用于新设计

3 (168 Hours)

3A001.A.7.A

锡铅

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

220

1.2V

1mm

30

EP2S130

S-PBGA-B1508

1118

不合格

1.21.5/3.33.3V

717MHz

53016 CLBS

现场可编程门阵列

132540

6747840

6627

5.117 ns

53016

3.5mm

40mm

40mm

Non-RoHS Compliant

12 In Stock

-

表面贴装

表面贴装

100-TQFP

100

77

0°C~85°C TJ

Tray

1999

Spartan®

e0

Obsolete

3 (168 Hours)

100

EAR99

锡铅

4.75V~5.25V

QUAD

鸥翼

225

5V

0.5mm

30

XCS20

100

160

5V

5V

1.6kB

166MHz

现场可编程门阵列

950

12800

20000

400

4

1120

1.2 ns

400

400

7000

1.2mm

无

Non-RoHS Compliant

含铅

N/A

-

表面贴装

672-BBGA

YES

508

0°C~85°C TJ

Tray

APEX-20KE®

e0

Obsolete

3 (168 Hours)

672

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

220

1.8V

1mm

compliant

30

EP20K600

S-PBGA-B672

500

不合格

1.81.8/3.3V

160MHz

2.92 ns

500

可加载 PLD

24320

311296

1537000

2432

MACROCELL

4

3.5mm

27mm

27mm

Non-RoHS Compliant

633 In Stock

• 1: ¥6,801.935936
• 10: ¥6,416.920693
• 100: ¥6,053.698765
• 500: ¥5,711.036570
查看所有的价格

-

11 Weeks

表面贴装

表面贴装

484-BBGA, FCBGA

240

0°C~85°C TJ

Tray

2008

Virtex®-6 LXT

e0

活跃

4 (72 Hours)

484

0.95V~1.05V

BOTTOM

BALL

未说明

1V

1mm

not_compliant

未说明

XC6VLX75T

484

S-PBGA-B484

240

不合格

1V

11.2/2.5V

702kB

1412MHz

240

现场可编程门阵列

74496

5750784

5820

3

Non-RoHS Compliant

2174 In Stock

• 1: ¥2,492.465991
• 10: ¥2,351.383008
• 100: ¥2,218.285856
• 500: ¥2,092.722512
查看所有的价格

-

10 Weeks

表面贴装

表面贴装

484-BBGA

484

338

0°C~85°C TJ

Tray

2008

Spartan®-6 LX

e1

yes

活跃

3 (168 Hours)

484

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

1.14V~1.26V

BOTTOM

BALL

250

1V

1mm

30

XC6SLX150

484

338

不合格

1V

12.5/3.3V

603kB

现场可编程门阵列

147443

4939776

11519

184304

0.46 ns

2.6mm

23mm

23mm

ROHS3 Compliant

23 In Stock

-

11 Weeks

表面贴装

144-LQFP Exposed Pad

YES

81

0°C~85°C TJ

Tray

Cyclone® IV E

e0

活跃

3 (168 Hours)

144

锡铅

8542.39.00.01

1.15V~1.25V

QUAD

鸥翼

220

1.2V

0.5mm

30

EP4CE15

S-PQFP-G144

81

不合格

1.21.2/3.32.5V

472.5MHz

81

现场可编程门阵列

15408

516096

963

963

1.65mm

20mm

20mm

Non-RoHS Compliant

N/A

-

表面贴装

256-BGA

YES

191

0°C~70°C TA

Tray

FLEX-10KE®

e0

Obsolete

3 (168 Hours)

256

Tin/Lead (Sn/Pb)

8542.39.00.01

2.375V~2.625V

BOTTOM

BALL

220

2.5V

1mm

compliant

30

EPF10K100

S-PBGA-B256

191

不合格

2.52.5/3.3V

0.5 ns

191

可加载 PLD

4992

49152

257000

624

MIXED

2.1mm

17mm

17mm

Non-RoHS Compliant

N/A

-

表面贴装

240-BQFP

YES

189

0°C~85°C TJ

Tray

APEX-20K®

e3

Obsolete

3 (168 Hours)

240

3A991

Matte Tin (Sn)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

245

2.5V

0.5mm

compliant

40

EP20K100

S-PQFP-G240

183

不合格

2.52.5/3.3V

3.6 ns

183

可加载 PLD

4160

53248

263000

416

MACROCELL

4

4.1mm

32mm

32mm

符合RoHS标准

132 In Stock

-

11 Weeks

表面贴装

表面贴装

1156-BBGA, FCBGA

600

0°C~85°C TJ

Tray

2008

Virtex®-6 LXT

e0

活跃

4 (72 Hours)

0.95V~1.05V

BOTTOM

BALL

未说明

1V

1mm

not_compliant

未说明

XC6VLX130T

S-PBGA-B1156

600

不合格

1V

11.2/2.5V

1.2MB

1412MHz

600

现场可编程门阵列

128000

9732096

10000

3

Non-RoHS Compliant

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

512 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

3 V

0 C

+ 70 C

SMD/SMT

215 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.25 V

Tray

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-2PLG84

117 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

Tray

M1A3P1000

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

1.425V ~ 1.575V

1.5 V

147456

1000000

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

- 55 C

+ 125 C

SMD/SMT

151 MHz

微芯片技术

有

40

Actel

5.5 V

Tray

A42MX36

Obsolete

BGA,

网格排列

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX36-1BGG272M

83 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

202 I/O

3 V

-55°C ~ 125°C (TC)

Tray

A42MX36

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

微芯片技术

60

Fusion

0.014110 oz

1.575 V

活跃

M1AFS1500

Tray

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS1500-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

无铅

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

4.75 V

- 40 C

+ 125 C

SMD/SMT

153 MHz

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX16

活跃

TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-TQG176A

139 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

140 I/O

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

5 V

AUTOMOTIVE

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

STD

2.2 ns

1232

24000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

215 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.5 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-2PLG84I

117 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

-40°C ~ 85°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE3000-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-208

208-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

176 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

151 MHz

有

1

Actel

5.5 V

Tray

5962-9958502

活跃

-55°C ~ 125°C (TJ)

MX

3V ~ 3.6V, 4.5V ~ 5.5V

3.3 V, 5 V

2560

54000

3.4 mm

28 mm

28 mm

750 In Stock

• 1: ¥10,701.489764
• 10: ¥10,349.603253
• 25: ¥10,277.659635
• 50: ¥10,206.216126
查看所有的价格

-

11 Weeks

表面贴装

表面贴装

784-BBGA, FCBGA

240

0°C~85°C TJ

Tray

2008

Virtex®-6 LXT

e0

活跃

4 (72 Hours)

784

锡铅

0.95V~1.05V

BOTTOM

BALL

未说明

1V

1mm

未说明

XC6VLX130T

784

S-PBGA-B784

400

不合格

1V

11.2/2.5V

1.2MB

1412MHz

400

现场可编程门阵列

128000

9732096

10000

3

2.86mm

29mm

29mm

Non-RoHS Compliant

41 In Stock

-

10 Weeks

Copper, Silver, Tin

表面贴装

表面贴装

2892-BBGA, FCBGA

1456

0°C~100°C TJ

Bulk

2012

Virtex® UltraScale™

e1

活跃

4 (72 Hours)

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

0.922V~0.979V

BOTTOM

BALL

未说明

0.95V

1mm

not_compliant

未说明

950mV

11.1MB

现场可编程门阵列

5540850

90726400

316620

2

5.06592e+06

3.83mm

55mm

55mm

ROHS3 Compliant

914 In Stock

-

表面贴装

896-BBGA, FCBGA

YES

384

0°C~85°C TJ

Tray

Arria V GX

e1

Obsolete

3 (168 Hours)

896

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5AGXMA7

S-PBGA-B896

384

不合格

1.11.2/3.32.5V

670MHz

384

现场可编程门阵列

242000

15470592

11460

2.7mm

31mm

31mm

符合RoHS标准

N/A

-

表面贴装

484-BBGA

YES

316

0°C~85°C TJ

Tray

APEX-20KE®

e0

Obsolete

3 (168 Hours)

484

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

220

1.8V

1mm

compliant

30

EP20K160

S-PBGA-B484

308

不合格

1.81.8/3.3V

160MHz

2.29 ns

308

可加载 PLD

6400

81920

404000

640

MACROCELL

4

2.1mm

23mm

23mm

Non-RoHS Compliant