类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | 端子表面处理 | 应用 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 长度 | 宽度 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | PEB4264 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | SOIC | PLASTIC, SO-20 | 70 °C | PLASTIC/EPOXY | SOP | SOP20,.56 | RECTANGULAR | 小概要 | 5 V | 无 | Transferred | INFINEON TECHNOLOGIES AG | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | not_compliant | 20 | R-PDSO-G20 | 不合格 | COMMERCIAL | 0.0013 mA | 3.7 mm | SLIC | RESISTIVE | 25 dB | 2-4 CONVERSION | -24 AND -48 V | 15.9 mm | 11 mm | ||||||||||||||
![]() | SI3211-BTR | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 38 | SILICON LABORATORIES INC | TSSOP | TSSOP, TSSOP38,.25,20 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP38,.25,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 38 | R-PDSO-G38 | 不合格 | INDUSTRIAL | 1.2 mm | SLIC | CONSTANT CURRENT | 40 dB | -96 TO -10 V | 15 dBrnC | 9.7 mm | 4.4 mm | ||||||||||||||
![]() | SY69712BC | Synergy Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | RECTANGULAR | FLATPACK | 5 V | 无 | Transferred | SYNERGY SEMICONDUCTOR CORP | PLASTIC/EPOXY | QFP | HQFP100,.7X.9 | e0 | Tin/Lead (Sn/Pb) | ATM; SDH; SONET | QUAD | 鸥翼 | 1 | 0.635 mm | unknown | R-PQFP-G100 | 不合格 | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||||||
![]() | SY69712BC | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | PLASTIC/EPOXY | HQFP | RECTANGULAR | FLATPACK, HEAT SINK/SLUG | 5 V | 无 | 活跃 | MICROCHIP TECHNOLOGY INC | 14 X 20 MM, HQFP-100 | 1 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.4 mm | ATM/SONET/SDH TRANSCEIVER | 20 mm | 14 mm | |||||||||||||||||||||||
![]() | MCP2003T-E/SNV02 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 7 V | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC-8 | 125 °C | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G8 | 1.75 mm | TS 16949 | LIN TRANSCEIVER | 1 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||
![]() | DS21354 | Dallas Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TEA1095/C1 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | 75 °C | -25 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | NXP SEMICONDUCTORS | DIP | DIP, | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 24 | R-PDIP-T24 | 不合格 | 商业扩展 | 5.1 mm | 免提电话电路 | 31.7 mm | 15.24 mm | ||||||||||||||||||||||
![]() | SY6703HFC | Silergy Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68185RC | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 68 | MOTOROLA INC | PGA | PGA, PGA68,11X11 | 85 °C | -40 °C | PLASTIC/EPOXY | PGA | PGA68,11X11 | SQUARE | 网格排列 | 5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 1 | 2.54 mm | unknown | 68 | S-PPGA-P68 | 不合格 | INDUSTRIAL | 2000 Mbps | 2.59 mm | MODEM | 26.92 mm | 26.92 mm | |||||||||||||||||
![]() | MC68185RC | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 68 | PGA, PGA68,11X11 | 85 °C | -40 °C | CERAMIC | PGA | PGA68,11X11 | SQUARE | 网格排列 | 5 V | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-XPGA-P68 | 不合格 | 5 V | INDUSTRIAL | |||||||||||||||||||||||||
![]() | TCP-3033N-DT | onsemi | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | 567KD | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 有 | Obsolete | ON SEMICONDUCTOR | VFBGA, | 有 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | R-PBGA-B10 | OTHER | 0.611 mm | 电信电路 | 1.029 mm | 0.722 mm | ||||||||||||||||||||||||
![]() | RS8953SPBEPF | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | 康讯系统 | QFP | QFP-80 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | 3.3 V | 无 | Obsolete | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | compliant | 80 | R-PQFP-G80 | 不合格 | INDUSTRIAL | 21.1 mA | 1168 Mbps | 3.1 mm | FRAMER | 20 mm | 14 mm | |||||||||||||||
![]() | BCM5382M | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.2 V | 无 | Obsolete | BROADCOM CORP | BGA | BGA, | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 324 | S-PBGA-B324 | 不合格 | ETHERNET SWITCH | ||||||||||||||||||||||||||||
![]() | MC33742EGR2 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3 | 有 | Obsolete | FREESCALE SEMICONDUCTOR INC | e3 | 哑光锡 | 260 | unknown | 40 | ||||||||||||||||||||||||||||||||||||||||
![]() | BCM20736A0KML2G | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | 有 | 活跃 | INFINEON TECHNOLOGIES AG | QFN-32 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N32 | OTHER | 1 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||||||||
![]() | EHV62-H36B1 | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 2 | 长式 | 活跃 | TDK CORP | ROHS COMPLIANT, PACKAGE-2 | 125 °C | -40 °C | UNSPECIFIED | ROUND | 8542.39.00.01 | AXIAL | WIRE | 1 | unknown | O-XALF-W2 | AUTOMOTIVE | GAS DISCHARGE TUBE SUPPRESSOR | |||||||||||||||||||||||||||||||
![]() | MC34014FN | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 60 °C | -20 °C | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | 无 | Obsolete | MOTOROLA INC | QCCJ, LDCC20,.4SQ | e0 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | S-PQCC-J20 | 不合格 | COMMERCIAL | 4.57 mm | 电话语音电路 | 8.965 mm | 8.965 mm | |||||||||||||||||||||
![]() | TISP61060D | Power Innovations International, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOP | RECTANGULAR | 小概要 | Transferred | POWER INNOVATIONS LTD | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G8 | 不合格 | INDUSTRIAL | 1.75 mm | 浪涌保护电路 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||
![]() | TISP61060D | Bourns Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 无 | Obsolete | BOURNS INC | SOIC | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | 未说明 | 8 | R-PDSO-G8 | 不合格 | INDUSTRIAL | 1.75 mm | 浪涌保护电路 | 4.9 mm | 3.905 mm | ||||||||||||||||||||
![]() | SK70708PE | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | QCCJ, LDCC44,.7SQ | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5 V | Obsolete | INTEL CORP | LCC | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | INDUSTRIAL | 1168 Mbps | 4.57 mm | 数码单反 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||
![]() | MDBT42Q-PAT | Raytec Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM7100 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | 无 | Obsolete | BROADCOM CORP | compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | PE-67523T | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SKY77448 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 10 | 85 °C | -20 °C | UNSPECIFIED | RECTANGULAR | 微电子组件 | 有 | 活跃 | SKYWORKS SOLUTIONS INC | MODULE | , | 有 | 8542.39.00.01 | UNSPECIFIED | UNSPECIFIED | 260 | 1 | unknown | 40 | 10 | R-XXMA-X10 | OTHER | 射频和基带电路 | |||||||||||||||||||||||||
![]() | SIM7070G S2-108HK-Z30BC | SIMCom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
PEB4264
Infineon Technologies AG
分类:Interface - Telecom
SI3211-BTR
Silicon Laboratories Inc
分类:Interface - Telecom
SY69712BC
Synergy Semiconductor Corp
分类:Interface - Telecom
SY69712BC
Microchip Technology Inc
分类:Interface - Telecom
MCP2003T-E/SNV02
Microchip Technology Inc
分类:Interface - Telecom
DS21354
Dallas Semiconductor
分类:Interface - Telecom
TEA1095/C1
NXP Semiconductors
分类:Interface - Telecom
SY6703HFC
Silergy Corporation
分类:Interface - Telecom
MC68185RC
Motorola Mobility LLC
分类:Interface - Telecom
MC68185RC
Freescale Semiconductor
分类:Interface - Telecom
TCP-3033N-DT
onsemi
分类:Interface - Telecom
RS8953SPBEPF
Conexant Systems Inc
分类:Interface - Telecom
BCM5382M
Broadcom Limited
分类:Interface - Telecom
MC33742EGR2
Freescale Semiconductor
分类:Interface - Telecom
BCM20736A0KML2G
Infineon Technologies AG
分类:Interface - Telecom
EHV62-H36B1
TDK Corporation
分类:Interface - Telecom
MC34014FN
Motorola Semiconductor Products
分类:Interface - Telecom
TISP61060D
Power Innovations International, Inc.
分类:Interface - Telecom
TISP61060D
Bourns Inc
分类:Interface - Telecom
SK70708PE
Intel Corporation
分类:Interface - Telecom
MDBT42Q-PAT
Raytec Corporation
分类:Interface - Telecom
BCM7100
Broadcom Limited
分类:Interface - Telecom
PE-67523T
Pulse Electronics Corporation
分类:Interface - Telecom
SKY77448
Skyworks Solutions Inc
分类:Interface - Telecom
SIM7070G S2-108HK-Z30BC
SIMCom
分类:Interface - Telecom
