类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 模拟 IC - 其他类型 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 供应电流-最大值(Isup) | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 负电源电压 | 标准 | 增益公差-最大 | 线性编码 | ISDN接入速率 | 参考点 | 长度 | 宽度 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TK5530H-138-PP | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-E7 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 70 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | SOJ8(UNSPEC) | RECTANGULAR | 小概要 | 3.3 V | 有 | Obsolete | MICROCHIP TECHNOLOGY INC | PACKAGE-6 | 8542.39.00.01 | DUAL | J BEND | 1 | 2.54 mm | compliant | R-CDSO-J6 | 3.6 V | 3 V | 锁相环频率合成器 | 4.69 mm | 40 mA | 13.97 mm | 8.89 mm | |||||||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-E7 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | 1 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | 有 | Transferred | MICROSEMI CORP | PACKAGE-6 | e4 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | |||||||||||||||||||||||||||
![]() | PEF2091F | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | -40 °C | PLASTIC/EPOXY | QFP | QFP64,.47SQ,20 | SQUARE | FLATPACK | 5 V | 无 | Obsolete | INFINEON TECHNOLOGIES AG | 85 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | not_compliant | S-PQFP-G64 | 不合格 | INDUSTRIAL | 144 Mbps | CCITT I.430 | BASIC | U | |||||||||||||||||||||||||||||
![]() | PBL3764A/4QN-T | Ericsson | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HI-1568PCT | Holt Integrated Circuits Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | HOLT INTEGRATED CIRCUITS INC | QFN | CSP-44 | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 无 | 活跃 | e0 | 无 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 无铅 | 240 | 2 | 0.5 mm | unknown | 30 | 44 | S-PQCC-N44 | 不合格 | MILITARY | 1 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 7 mm | 7 mm | ||||||||||||||||||||||
![]() | TH72016 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | MELEXIS N V | QFN | HVSON, | 3 | 125 °C | -40 °C | UNSPECIFIED | HVSON | 3 V | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SQUARE | 有 | Obsolete | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | 不合格 | AUTOMOTIVE | 1 mm | 电信电路 | 3 mm | 3 mm | |||||||||||||||||||||||||||
![]() | WM9712LSEFT/RV | Cirrus Logic | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | Obsolete | CIRRUS LOGIC INC | TFQFP, | 85 °C | -25 °C | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | S-PQFP-G48 | OTHER | SYNCHRONOUS | 1.2 mm | PCM 编解码器 | YES | 7 mm | 7 mm | ||||||||||||||||||||||||||||||
![]() | SM5172-M4 | SamHop Microelectronics Corp. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | IN-LINE | 接触制造商 | SAMHOP MICROELECTRONICS CORP | DIP, DIP18(UNSPEC) | PLASTIC/EPOXY | DIP | DIP18(UNSPEC) | RECTANGULAR | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T18 | 不合格 | 电信电路 | |||||||||||||||||||||||||||||||||||||||
![]() | FX-500-LAF-GNJ-A3-D8 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | PACKAGE-6 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | SOJ8(UNSPEC) | RECTANGULAR | 小概要 | 3.3 V | 有 | Obsolete | MICROCHIP TECHNOLOGY INC | 8542.39.00.01 | DUAL | J BEND | 1 | 2.54 mm | compliant | R-CDSO-J6 | 3.6 V | 3 V | 锁相环频率合成器 | 4.69 mm | 40 mA | 13.97 mm | 8.89 mm | ||||||||||||||||||||||||||||
![]() | BCM88272CA1IFSBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TM1250HVB1 | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | SOP, SOP16,.4 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 3.3 V | 无 | 活跃 | PULSE ELECTRONICS CORP | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | R-PDSO-G16 | 不合格 | MILITARY | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||||||||||||
![]() | 88E1340-XX-BAM2C000 | Marvell Technology Group Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | MARVELL SEMICONDUCTOR INC | 8542.39.00.01 | compliant | 以太网收发器 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA18275HN/C1/S1Y | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TA31002AF | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 0.225 INCH, PLASTIC, SOP-8 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 无 | Obsolete | TOSHIBA CORP | SOIC | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | unknown | 未说明 | 8 | R-PDSO-G8 | 不合格 | INDUSTRIAL | 1.9 mm | 电话铃声 | 5 mm | 4.4 mm | ||||||||||||||||||||||||||||
![]() | RFMD2014TR13 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | RF MICRO DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 有 | Transferred | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 24 | S-XQCC-N24 | 不合格 | INDUSTRIAL | 0.231 mA | 0.9 mm | 射频和基带电路 | 4 mm | 4 mm | ||||||||||||||||||||||||||
![]() | SI2108-D-FM | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | HVQCCN, | 70 °C | UNSPECIFIED | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 有 | Obsolete | SILICON LABORATORIES INC | QFN | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | unknown | 未说明 | 44 | R-XQCC-N44 | 不合格 | COMMERCIAL | 1 mm | 电信电路 | 8 mm | 6 mm | |||||||||||||||||||||||||||
![]() | TP13064AN | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | DIP, DIP20,.3 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 未说明 | R-PDIP-T20 | 不合格 | INDUSTRIAL | SYNCHRONOUS/ASYNCHRONOUS | 11 mA | 5.08 mm | PCM 编解码器 | YES | MU-LAW | -5 V | 0.15 dB | 不提供 | 24.325 mm | 7.62 mm | |||||||||||||||||||
![]() | TISP61511D-S | Bourns Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 1 | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 有 | Obsolete | BOURNS INC | SOIC | ROHS COMPLIANT, SOP-8 | e3 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 40 | 8 | R-PDSO-G8 | 不合格 | 1.75 mm | 浪涌保护电路 | 4.9 mm | 3.905 mm | |||||||||||||||||||||||||||
![]() | ET101001DSA | Emerging Display Technolgies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 88E1111-XX-CAA-C000 | Marvell Technology Group Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 96 | FQFP, SLGA96,13X13,24 | UNSPECIFIED | FQFP | SLGA96,13X13,24 | SQUARE | FLATPACK, FINE PITCH | 1 V | 无 | Obsolete | MARVELL SEMICONDUCTOR INC | BCC | IT ALSO REQUIRES 2.5V DIGITAL SUPPLY | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.8 mm | compliant | 96 | S-XBCC-B96 | 不合格 | 1000000 Mbps | 9 mm | 以太网收发器 | 1 | 9 mm | 9 mm | |||||||||||||||||||||||||||
![]() | SLB9670XQ20FW740XUMA2 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 有 | Obsolete | INFINEON TECHNOLOGIES AG | HVQCCN, | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | S-PQCC-N32 | INDUSTRIAL | 0.9 mm | 电信电路 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||
![]() | TM1062FVB1 | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | SOP, SOP28,.76 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP28,.76 | RECTANGULAR | 小概要 | 3.3 V | 无 | 活跃 | PULSE ELECTRONICS CORP | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | R-PDSO-G28 | 不合格 | MILITARY | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||||||||||||
![]() | RF5745 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | Transferred | RF MICRO DEVICES INC | QFN | 3 X 3 MM, 0.5 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-16 | 2 | 65 °C | -15 °C | PLASTIC/EPOXY | HQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | 3.3 V | 有 | e3 | 有 | 5A991.G | Matte Tin (Sn) - annealed | 8517.70.00.00 | QUAD | 无铅 | 260 | 1 | 0.5 mm | unknown | 30 | 16 | S-PQCC-N16 | 不合格 | COMMERCIAL | 射频和基带电路 | 3 mm | 3 mm | |||||||||||||||||||||
![]() | SKY77328 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | QFN | SKYWORKS SOLUTIONS INC | Obsolete | 3.5 V | CHIP CARRIER, HEAT SINK/SLUG | SQUARE | HQCCN | UNSPECIFIED | HQCCN, | 8542.39.00.01 | QUAD | 无铅 | 1 | 1 mm | unknown | 20 | S-XQCC-N20 | 1.25 mm | 射频和基带电路 | 6 mm | 6 mm |
TK5530H-138-PP
Temic Semiconductors
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-E7
Microchip Technology Inc
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-E7
Microsemi Corporation
分类:Interface - Telecom
PEF2091F
Infineon Technologies AG
分类:Interface - Telecom
PBL3764A/4QN-T
Ericsson
分类:Interface - Telecom
HI-1568PCT
Holt Integrated Circuits Inc
分类:Interface - Telecom
TH72016
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
WM9712LSEFT/RV
Cirrus Logic
分类:Interface - Telecom
SM5172-M4
SamHop Microelectronics Corp.
分类:Interface - Telecom
FX-500-LAF-GNJ-A3-D8
Microchip Technology Inc
分类:Interface - Telecom
BCM88272CA1IFSBG
Broadcom Limited
分类:Interface - Telecom
TM1250HVB1
Pulse Electronics Corporation
分类:Interface - Telecom
88E1340-XX-BAM2C000
Marvell Technology Group Ltd
分类:Interface - Telecom
TDA18275HN/C1/S1Y
NXP Semiconductors
分类:Interface - Telecom
TA31002AF
Toshiba America Electronic Components
分类:Interface - Telecom
RFMD2014TR13
RF Micro Devices Inc
分类:Interface - Telecom
SI2108-D-FM
Silicon Laboratories Inc
分类:Interface - Telecom
TP13064AN
Texas Instruments
分类:Interface - Telecom
TISP61511D-S
Bourns Inc
分类:Interface - Telecom
ET101001DSA
Emerging Display Technolgies
分类:Interface - Telecom
88E1111-XX-CAA-C000
Marvell Technology Group Ltd
分类:Interface - Telecom
SLB9670XQ20FW740XUMA2
Infineon Technologies AG
分类:Interface - Telecom
TM1062FVB1
Pulse Electronics Corporation
分类:Interface - Telecom
RF5745
RF Micro Devices Inc
分类:Interface - Telecom
SKY77328
Skyworks Solutions Inc
分类:Interface - Telecom
