类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 输出低电流-最大值 | 负电源电压 | 标准 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 长度 | 宽度 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | SC11066CV/ABE | Sierra Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TA31081P | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP, | 85 °C | -35 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 活跃 | TOSHIBA CORP | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 16 | R-PDIP-T16 | 不合格 | OTHER | 6.2 mA | 4.45 mm | 电信电路 | 19.25 mm | 7.62 mm | |||||||||||||||||||||||
![]() | SC11006CN | Sierra Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | DIP-28 | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | SIERRA SEMICONDUCTOR | e0 | 锡铅 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T28 | 不合格 | COMMERCIAL | 0.07 mA | MODEM | -5 V | ||||||||||||||||||||||||||
![]() | TCM1512AP | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | DIP, DIP8,.3 | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | TEXAS INSTRUMENTS INC | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T8 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||
![]() | PEB2085P | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5 V | PLASTIC, DIP-40 | DIP | INFINEON TECHNOLOGIES AG | Obsolete | 无 | 70 °C | PLASTIC/EPOXY | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-PDIP-T40 | 不合格 | COMMERCIAL | 144 Mbps | 5.1 mm | isdn控制器 | 0.007 A | CCITT I.430 | BASIC | S/T | 2.4 V | 0.45 V | 50.9 mm | 15.24 mm | ||||||||||||||
![]() | RF5611 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 12 | RF MICRO DEVICES INC | QFN | VQCCN, | 75 °C | -10 °C | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | 3.3 V | 有 | Transferred | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 12 | S-PQCC-N12 | 不合格 | 商业扩展 | 0.5 mm | 射频和基带电路 | 2 mm | 2 mm | ||||||||||||||||||||||
![]() | TPS657202YFFR | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 25 | 2016-05-20 | VFBGA, | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.6 V | 有 | Preview | TEXAS INSTRUMENTS INC | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 0.4 mm | compliant | 30 | S-PBGA-B25 | INDUSTRIAL | 0.625 mm | 电信电路 | 2.086 mm | 2.086 mm | ||||||||||||||||||
![]() | MCP2551T-I/SNG | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | SOIC | SOIC-8 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | e3 | 有 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | INDUSTRIAL | 75 mA | 1000 Mbps | 1.75 mm | TS 16949 | 可收发器 | 1 | 4.9 mm | 3.9 mm | |||||||||||||
![]() | RF5722SR | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | RF MICRO DEVICES INC | 2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8 | 2 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 有 | Transferred | e3 | 5A991.G | 哑光锡 | 8517.70.00.00 | QUAD | 无铅 | 260 | 1 | 0.65 mm | unknown | 30 | S-XQCC-N8 | OTHER | 0.5 mm | 电信电路 | 2.2 mm | 2.2 mm | ||||||||||||||||||||
![]() | S2020A | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 225 | APPLIED MICRO CIRCUITS CORP | PGA | BGA, HPGA224,18X18 | 5 V | 网格排列 | SQUARE | HPGA224,18X18 | BGA | CERAMIC, METAL-SEALED COFIRED | 70 °C | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 | 2.54 mm | unknown | 225 | S-CBGA-B225 | 不合格 | COMMERCIAL | 589 mA | 10.4648 mm | 电信电路 | -5.2 V | 47.244 mm | 47.244 mm | |||||||||||||||||||
![]() | MC145029P | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP, DIP16,.3 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | MOTOROLA INC | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | INDUSTRIAL | 电信电路 | |||||||||||||||||||||||||||
![]() | BT8953AEPJC | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | Obsolete | 康讯系统 | LCC | QCCJ, LDCC68,1.0SQ | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 3 | 1.27 mm | unknown | 68 | S-PQCC-J68 | 不合格 | INDUSTRIAL | 80 mA | 1168 Mbps | 5.08 mm | FRAMER | 24.23 mm | 24.23 mm | ||||||||||||||||||
![]() | RF5506SB | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | -10 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | Transferred | RF MICRO DEVICES INC | HVQCCN, | 70 °C | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N16 | COMMERCIAL | 0.58 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||||||||||||
![]() | RF3858 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | Transferred | RF MICRO DEVICES INC | LGA | LGA, LCC32,.32SQ,40 | 85 °C | -40 °C | UNSPECIFIED | LGA | LCC32,.32SQ,40 | SQUARE | 网格排列 | 3.6 V | 有 | 有 | 5A991.G | 8517.70.00.00 | BOTTOM | 无铅 | 未说明 | 1 | 1 mm | compliant | 未说明 | 32 | S-XBGA-N32 | 不合格 | INDUSTRIAL | 0.85 mA | 1.2 mm | 射频前端电路 | 8 mm | 8 mm | |||||||||||||||||
![]() | STLC60444 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TH71111 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK | Obsolete | THESYS GESELLSCHAFT FUR MIKROELEKTRONIK MBH | QFP | LQFP, | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 32 | S-PQFP-G32 | 不合格 | INDUSTRIAL | 1.6 mm | 电信电路 | 7 mm | 7 mm | |||||||||||||||||||||||||
![]() | TQM879006 | TriQuint Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | Obsolete | TRIQUINT SEMICONDUCTOR INC | QFN | HQCCN, | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | 5 V | 有 | e4 | 镍镀金 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.7 mm | compliant | 28 | S-PQCC-N28 | 不合格 | INDUSTRIAL | 1.12 mm | 射频和基带电路 | 6 mm | 6 mm | ||||||||||||||||||||
![]() | BCM5401 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | TBGA-256 | 1 | PLASTIC/EPOXY | BGA | 网格排列 | 1.8 V | 无 | Obsolete | BROADCOM CORP | BGA | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 256 | 不合格 | 以太网收发器 | ||||||||||||||||||||||||||||||
![]() | BCM7041 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA, | PLASTIC/EPOXY | BGA | UNSPECIFIED | 网格排列 | 1.8 V | 无 | Obsolete | BROADCOM CORP | BGA | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 256 | X-PBGA-B256 | 不合格 | 电信电路 | ||||||||||||||||||||||||||||||
![]() | LM96530SQE | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 60 | 70 °C | UNSPECIFIED | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | 5 V | Obsolete | TEXAS INSTRUMENTS INC | QFN | VQCCN, | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 60 | S-XQCC-N60 | COMMERCIAL | 0.8 mm | 电信电路 | -5 V | 9 mm | 9 mm | |||||||||||||||||||||||||
![]() | RFAC3612TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | -40 °C | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | 2.85 V | Obsolete | RF MICRO DEVICES INC | BCC, | 85 °C | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | unknown | R-PBCC-B10 | INDUSTRIAL | 1.195 mm | 电信电路 | 2.5 mm | 2 mm | |||||||||||||||||||||||||||
![]() | TGA8652-SL | TriQuint Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 12 | SQUARE | 网格排列 | Obsolete | TRIQUINT SEMICONDUCTOR INC | LGA | LGA, | PLASTIC/EPOXY | LGA | e4 | 镍上闪金 | 8542.39.00.01 | BOTTOM | 无铅 | 1 | unknown | 12 | S-PBGA-N12 | 不合格 | 2.1336 mm | 电信电路 | |||||||||||||||||||||||||||||
![]() | TEA7088AFP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | STMICROELECTRONICS | SOIC | SOP, SOP28,.4 | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | 小概要 | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | not_compliant | 28 | R-PDSO-G28 | 不合格 | OTHER | 2.65 mm | 电话多功能电路 | 17.9 mm | 7.5 mm | |||||||||||||||||||||
![]() | WE9215 | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | WINBOND ELECTRONICS CORP | 70 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T28 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||
![]() | PX1011BI-EL1/G | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 81 | 有 | Obsolete | NXP SEMICONDUCTORS | BGA | LFBGA, | SOT-643-1 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 30 | 81 | S-PBGA-B81 | 不合格 | INDUSTRIAL | 1.6 mm | 电路接口 | 9 mm | 9 mm |
SC11066CV/ABE
Sierra Semiconductor
分类:Interface - Telecom
TA31081P
Toshiba America Electronic Components
分类:Interface - Telecom
SC11006CN
Sierra Semiconductor
分类:Interface - Telecom
TCM1512AP
Texas Instruments
分类:Interface - Telecom
PEB2085P
Infineon Technologies AG
分类:Interface - Telecom
RF5611
RF Micro Devices Inc
分类:Interface - Telecom
TPS657202YFFR
Texas Instruments
分类:Interface - Telecom
MCP2551T-I/SNG
Microchip Technology Inc
分类:Interface - Telecom
RF5722SR
RF Micro Devices Inc
分类:Interface - Telecom
S2020A
Applied Micro Circuits Corporation
分类:Interface - Telecom
MC145029P
Motorola Semiconductor Products
分类:Interface - Telecom
BT8953AEPJC
Conexant Systems Inc
分类:Interface - Telecom
RF5506SB
RF Micro Devices Inc
分类:Interface - Telecom
RF3858
RF Micro Devices Inc
分类:Interface - Telecom
STLC60444
STMicroelectronics
分类:Interface - Telecom
TH71111
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
TQM879006
TriQuint Semiconductor
分类:Interface - Telecom
BCM5401
Broadcom Limited
分类:Interface - Telecom
BCM7041
Broadcom Limited
分类:Interface - Telecom
LM96530SQE
Texas Instruments
分类:Interface - Telecom
RFAC3612TR7
RF Micro Devices Inc
分类:Interface - Telecom
TGA8652-SL
TriQuint Semiconductor
分类:Interface - Telecom
TEA7088AFP
STMicroelectronics
分类:Interface - Telecom
WE9215
Winbond Electronics Corp
分类:Interface - Telecom
PX1011BI-EL1/G
NXP Semiconductors
分类:Interface - Telecom
