N/A

-

Gold

Polyamide (PA)

Brass

Compliant

125 V

+ 125 C

- 40 C

14 Position

2 Row

2 mm

2 A

Solder

Headers

Vertical

N/A

-

N/A

-

350

TE Connectivity

TE Connectivity

AMPMODU

Details

Bulk

AMPMODU MOD II

Headers & Wire Housings

Headers & Wire Housings

Headers & Wire Housings

N/A

-

N/A

-

Gold

Thermoplastic (TP)

AMPMODU

Details

+ 125 C

- 65 C

85

-

Copper Alloy

TE Connectivity

TE Connectivity

Bulk

AMPMODU MOD II

Unshrouded

54 Position

Headers & Wire Housings

2.54 mm

3 A

焊针

Black

2.54 mm

8.38 mm

Headers & Wire Housings

Headers

Headers & Wire Housings

N/A

-

N/A

-

N/A

-

Gold

表面贴装

Square

Liquid Crystal Polymer (LCP)

Gold

Liquid Crystal Polymer (LCP)

0.157 (4.00mm)

- 55 C

+ 125 C

TE Connectivity Erni

3 Gbps

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

活跃

Copper Alloy

-55°C ~ 125°C

SMC

Solder

Header

26

-

2

Push-Pull

公母针

1.7A per Contact

1.27 mm

-

0.266 (6.76mm)

板对板

All

1.3 A

0.050 (1.27mm)

Black

Solder

0.050 (1.27mm)

-

Shrouded - 4 Wall

Tin

-

Connectors

Vertical

Board Guide, Pick and Place, Solder Retention

-

157.5µin (4.00µm)

1.75 mm

UL94 V-0

N/A

-

Gold

表面贴装

Liquid Crystal Polymer (LCP)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

TE Connectivity Erni

-

活跃

25 Gbps

+ 125 C

- 55 C

Copper Alloy

MICROSPEED

Receptacle

5

1

0.039 (1.00mm)

18 A

-

Solder

Connectors

Vertical

Board Guide, Pick and Place

-

0.150 (3.80mm)

4 mm

N/A

-

Gold

表面贴装

Square

Liquid Crystal Polymer (LCP)

Gold

Liquid Crystal Polymer (LCP)

0.157 (4.00mm)

3 Gbps

+ 125 C

TE Connectivity Erni

- 55 C

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

活跃

Copper Alloy

-55°C ~ 125°C

SMC

Solder

Header

20

-

2

Push-Pull

公母针

1.7A per Contact

1.27 mm

-

0.325 (8.25mm)

板对板

All

1.7 A

0.050 (1.27mm)

Black

Solder

0.050 (1.27mm)

-

Shrouded - 4 Wall

Tin

-

Connectors

Vertical

Board Guide, Pick and Place, Solder Retention

-

157.5µin (4.00µm)

3.25 mm

UL94 V-0

N/A

-

表面贴装

Square

Liquid Crystal Polymer (LCP)

0.157 (4.00mm)

TE Connectivity Erni

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

活跃

Copper Alloy

Gold

-55°C ~ 125°C

SMC

Solder

Header

32

-

2

插销座

公母针

-

0.325 (8.25mm)

Board to Cable/Wire

All

1.7A per Contact

0.050 (1.27mm)

Black

0.050 (1.27mm)

-

Shrouded - 4 Wall

Tin

-

Board Guide, Pick and Place

-

157.5µin (4.00µm)

UL94 V-0

N/A

-

表面贴装

TE Connectivity Erni

活跃

-

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

MICROSTAC

Plug, Non-Gendered

10

1

0.031 (0.80mm)

Gold

电路板指南

-

0.171 (4.35mm)

N/A

-

Gold

表面贴装

Square

Liquid Crystal Polymer (LCP)

Liquid Crystal Polymer (LCP)

3 Gbps

+ 125 C

- 55 C

TE Connectivity Erni

-

Tape & Reel (TR);Cut Tape (CT);

-

-

活跃

Copper Alloy

Gold

-55°C ~ 125°C

SMC

Solder

Receptacle

80

-

2

Push-Pull

内螺纹插座

1.7A per Contact

1.27 mm

-

0.246 (6.25mm)

板对板

All

1 A

0.050 (1.27mm)

Black

Solder

0.050 (1.27mm)

-

Tin

Connectors

Vertical

Board Guide, Pick and Place, Solder Retention

-

157.5µin (4.00µm)

6.25 mm

UL94 V-0

N/A

-

Gold

表面贴装

Polyamide (PA)

5mm

TE Connectivity Erni

活跃

- 55 C

+ 125 C

Copper Alloy

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

MICROSTAC

Plug, Non-Gendered

6

1

0.031 (0.80mm)

2.6 A

Gold

Solder

母雄同体连接器

Vertical

电路板指南

-

0.171 (4.34mm)

5 mm

N/A

-

Gold

Surface Mount, Right Angle

Square

Liquid Crystal Polymer (LCP)

Gold

Liquid Crystal Polymer (LCP)

0.157 (4.00mm)

3 Gbps

+ 125 C

TE Connectivity Erni

- 55 C

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

活跃

Copper Alloy

-55°C ~ 125°C

SMC

Solder

Header

26

-

2

Push-Pull

公母针

1.7A per Contact

1.27 mm

-

0.167 (4.25mm)

Board to Cable/Wire

All

1.3 A

0.050 (1.27mm)

Black

Solder

0.050 (1.27mm)

-

Shrouded - 4 Wall

Tin

-

Headers

直角

Board Guide, Solder Retention

-

157.5µin (4.00µm)

UL94 V-0

N/A

-

表面贴装

Square

-

TE Connectivity Erni

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

活跃

Copper Alloy

Gold

Liquid Crystal Polymer (LCP)

-55°C ~ 125°C

SMC

Solder

Receptacle

32

-

2

Push-Pull

内螺纹插座

-

0.246 (6.25mm)

板对板

All

1.7A per Contact

0.050 (1.27mm)

Black

0.050 (1.27mm)

-

Tin

Board Guide, Pick and Place, Solder Retention

-

157.5µin (4.00µm)

UL94 V-0

N/A

-

无

N/A

-

表面贴装

TE Connectivity Erni

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

活跃

SMC

Ribbon Cable, DIP Header

50

Black

2

All

Gold

30 AWG

0.085 (2.15mm)

IDC

0.050 (1.27mm)

0.050 (1.27mm)

Solder Retention

-

N/A

-

Gold

Surface Mount, Right Angle

Square

Liquid Crystal Polymer (LCP)

Liquid Crystal Polymer (LCP)

3 Gbps

+ 125 C

- 55 C

TE Connectivity Erni

-

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

-

活跃

Copper Alloy

Gold

-55°C ~ 125°C

SMC

Solder

Receptacle

12

-

2

Push-Pull

内螺纹插座

1.7A per Contact

1.27 mm

-

0.152 (3.85mm)

板对板

All

1.6 A

0.050 (1.27mm)

Black

Solder

0.050 (1.27mm)

-

Tin

Connectors

直角

Board Guide, Solder Retention

-

157.5µin (4.00µm)

UL94 V-0

N/A

-

N/A

-

Gold

表面贴装

Liquid Crystal Polymer (LCP)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

TE Connectivity Erni

-

活跃

25 Gbps

+ 125 C

- 55 C

Copper Alloy

MICROSPEED

Array, Female Sockets

50

2

0.039 (1.00mm)

1 A

Gold

Solder

Connectors

Vertical

Board Guide, Ground Bus (Plane), Pick and Place

-

0.307 (7.80mm)

8 mm

N/A

-

Samtec

Samtec

-

-

Board to Board & Mezzanine Connectors

-

-

Board to Board & Mezzanine Connectors

Accessories

Board to Board & Mezzanine Connectors

N/A

-

Gold

铝合金

- 55 C

AirBorn

AirBorn

200 V

+ 125 C

200 Position

4 Row

Board to Board & Mezzanine Connectors

1.27 mm

2 A

通孔

Board to Board & Mezzanine Connectors

Receptacles

Vertical

Board to Board & Mezzanine Connectors

N/A

-

Samtec

Samtec

Tray

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors

N/A

-

150

Samtec

Samtec

Reel

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors

Board to Board & Mezzanine Connectors