类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 最高工作温度 | 最小工作温度 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 内存大小 | 工作电源电流 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | EEPROM 大小 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||||
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![]() | XCVM1802-1MSIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-1FCVG784T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 微芯片技术 | Tray | 活跃 | MCU - 136, FPGA - 312 | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R31C2E1V | Intel | 数据表 | 577 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 720 | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R25A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 624 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-L1FBVB900I | AMD | 数据表 | 930 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-1MSEVSVA1596 | AMD | 数据表 | 527 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 活跃 | Tray | 478 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQA-S283 | Infineon | 数据表 | 22 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 34 | Tray | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 4900 | Infineon | Infineon Technologies | Details | -40°C ~ 85°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4146LQE-S263T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | A/D 16x10b, 16x12b SAR; D/A 2x7b | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 48MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126LQS-S453 | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 4900 | Infineon | Infineon Technologies | Details | 34 | Tray | -40°C ~ 105°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126LQS-S453T | Infineon | 数据表 | 33 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 64KB (64K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQE-S263 | Infineon | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 34 | Tray | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 4900 | Infineon | Infineon Technologies | Details | -40°C ~ 125°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K3F40E2SG | ALTERA | 数据表 | 808 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | 0.176370 oz | 1 | SMD/SMT | 82500 LAB | 973542 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, | 网格排列 | PLASTIC/EPOXY | 0.9 V | 0.87 V | 100 °C | 有 | 10AS066K3F40E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048E3F29E2LG | ALTERA | 数据表 | 905 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-780 | 1.2 GHz | 480000 LE | 0.176370 oz | SMD/SMT | 60000 LAB | 973488 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | 360 | 2 x 32 kB | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH3F35E3VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | Tray | 活跃 | 392 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R24C3I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R25A3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 624 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24B2E3V | Intel | 数据表 | 580 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 768 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC5C6U23C6N | ALTERA | 数据表 | 2877 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | INTEL CORP | 1.13 V | 2.07 | MCU - 181, FPGA - 145 | Compliant | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSXFC5C6U23C6N | FBGA | SQUARE | Intel Corporation | 活跃 | FPGA - Field Programmable Gate Array Cyclone V SX dual -core ARM Cortex-A9 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 85 °C | 0 °C | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSXFC5 | S-PBGA-B672 | 145 | 不合格 | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 556.3 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | 85000 | 800 MHz | 32075 | 6 | 6 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||
![]() | AGFA027R31C2I2V | Intel | 数据表 | 994 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 720 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM2202-1LSEVSVC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LSINBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD 赛灵思 | 1 | Xilinx | Xilinx | 424 | Tray | 活跃 | + 110 C | - 40 C | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSENBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD 赛灵思 | 1 | Xilinx | Xilinx | 424 | Tray | 活跃 | + 110 C | 0 C | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2HSINBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD 赛灵思 | 1 | Xilinx | Xilinx | 424 | Tray | 活跃 | + 110 C | - 40 C | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 880 mV | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1FG484 | Microchip Technology | 数据表 | 2308 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | N | SMD/SMT | 100 MHz | - | - | 64 kB | 2000 LE | 161 I/O | 0 C | + 85 C | 有 | - | 60 | SmartFusion | Tray | A2F200 | 活跃 | 0°C ~ 85°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB |
XCVM1802-1MSIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
MPFS160T-1FCVG784T2
Microchip
分类:Embedded - System On Chip (SoC)
AGFA027R31C2E1V
Intel
分类:Embedded - System On Chip (SoC)
218,653.821227
AGFA027R25A2E3V
Intel
分类:Embedded - System On Chip (SoC)
XCZU7EV-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
28,778.749329
XCVC1502-1MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
94,345.062904
CY8C4147LQA-S283
Infineon
分类:Embedded - System On Chip (SoC)
38.906803
CY8C4146LQE-S263T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126LQS-S453
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126LQS-S453T
Infineon
分类:Embedded - System On Chip (SoC)
40.617278
CY8C4147LQE-S263
Infineon
分类:Embedded - System On Chip (SoC)
45.020985
10AS066K3F40E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
36,575.120440
10AS048E3F29E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
23,383.981993
1SX065HH3F35E3VG
Intel
分类:Embedded - System On Chip (SoC)
AGFA014R24C3I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA027R24C3I3V
Intel
分类:Embedded - System On Chip (SoC)
AGFB022R25A3E3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA012R24B2E3V
Intel
分类:Embedded - System On Chip (SoC)
56,710.937466
5CSXFC5C6U23C6N
ALTERA
分类:Embedded - System On Chip (SoC)
2,622.885695
AGFA027R31C2I2V
Intel
分类:Embedded - System On Chip (SoC)
257,388.442873
XCVM2202-1LSEVSVC2197
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-1LSINBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-2MSENBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-2HSINBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
A2F200M3F-1FG484
Microchip Technology
分类:Embedded - System On Chip (SoC)
777.875848
