类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 表面贴装的焊盘尺寸 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 终端 | 温度系数 | 电阻 | 最高工作温度 | 最小工作温度 | 组成 | 应用 | 功率(瓦特) | HTS代码 | 电容量 | 子类别 | 额定功率 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 频率稳定性 | 基本部件号 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 箱码(公制) | 箱码(英制) | 工作电源电压 | ESR(等效串联电阻) | 失败率 | 引线间距 | 电源 | 温度等级 | 内存大小 | 极化 | 负载电容 | 阻抗 | 速度 | 内存大小 | 引线样式 | 核心处理器 | 纹波电流@高频 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 输出格式 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 特征 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 无铅 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||
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![]() | AGFA023R25A3I3E | Intel | 数据表 | 640 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Molex | 480 | Bulk | 120122 | 活跃 | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial, Disc | - | Vishay Beyschlag/Draloric/BC Components | Bulk | 活跃 | 440VAC | 480 | -40°C ~ 125°C | WYO | 0.256 Dia (6.50mm) | ±20% | Y5U (E) | Safety | 1000 pF | - | 0.197 (5.00mm) | 1.4GHz | 256KB | Straight | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | - | 0.374 (9.50mm) | - | X1, Y2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F29E2SG | ALTERA | 数据表 | 502 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | Non-Compliant | 288 | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016E3F29E2SG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 1.97 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 288 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | 现场可编程门阵列 | FPGA - 160K Logic Elements | 160000 | -- | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F34I3LG | ALTERA | 数据表 | 882 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 965287 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H4F34I3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 200 V | Compliant | 384 | 有 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 1 % | 活跃 | SMD/SMT | 210 kΩ | 155 °C | -55 °C | 厚膜 | 8542.39.00.01 | SOC - Systems on a Chip | 1 W | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 3246 | 1218 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 550 µm | 3.2 mm | 4.6 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E4F29I3SG | ALTERA | 数据表 | 536 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-780 | YES | 780 | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964848 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E4F29I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 360 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 360 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F35I3SG | ALTERA | 数据表 | 819 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 270000 LE | 1 | SMD/SMT | 33750 LAB | 965052 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H4F35I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E1F27I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 year ago) | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | PRODUCTION (Last Updated: 1 year ago) | 240 | Non-Compliant | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS027E1F27I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.64 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.25 mm | 现场可编程门阵列 | FPGA - 270K Logic Elements | -- | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LLINBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2.5 mm x 2 mm | 1024-BGA (31x31) | AMD 赛灵思 | Tray | 活跃 | Details | CTS电子元件 | CTS | 2.97 V | 3000 | - 40 C | 3.63 V | + 85 C | 316 | -40°C ~ 100°C (TJ) | MouseReel | 625 | Oscillators | 3.6864 MHz | 50 PPM | SMD/SMT | 700 mV | 15 pF | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 标准振荡器 | HCMOS | Versal™ Prime FPGA, 70k Logic Cells | - | 标准时钟振荡器 | 1 mm | 2.5 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2LSENBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2.5 mm x 2 mm | 1024-BGA (31x31) | AMD 赛灵思 | Tray | 活跃 | + 70 C | 3.3 V | - 20 C | 3000 | 3.3 V | CTS | CTS电子元件 | Details | 424 | 0°C ~ 100°C (TJ) | Reel | 625 | Oscillators | 30 MHz | 25 PPM | SMD/SMT | 700 mV | 15 pF | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 标准振荡器 | Versal™ Prime FPGA, 1.2M Logic Cells | - | 标准时钟振荡器 | 1 mm | 2.5 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U23C7N | ALTERA | 数据表 | 2054 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | Molex | Intel Corporation | 活跃 | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | INTEL CORP | 1.13 V | 2.01 | Bulk | 121064 | 活跃 | MCU - 181, FPGA - 145 | Compliant | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEBA6U23C7N | FBGA | SQUARE | 0°C ~ 85°C (TJ) | Tray | * | 活跃 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B672 | 145 | 不合格 | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | 110000 | 800 MHz | 41509 | 7 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R31C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | 1206 | KOA Speer Electronics, Inc. | 720 | Tape & Reel (TR) | RN732B | Obsolete | -55°C ~ 155°C | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 2 | ±50ppm/°C | 111 Ohms | Thin Film | 0.125W, 1/8W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Moisture Resistant | 0.028 (0.70mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-1FFG900C | AMD | 数据表 | 762 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | TE Connectivity Deutsch 连接器 | 130 | Bag | DIV40E15 | 活跃 | 0°C ~ 85°C (TJ) | * | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z015-1CLG485C | AMD | 数据表 | 2352 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial, Can | 485-CSPBGA (19x19) | - | EPCOS - TDK Electronics | 5000 Hrs @ 105°C | 130 | XC7Z015 | Bulk | Obsolete | 25 V | -55°C ~ 105°C | B41858 | 0.492 Dia (12.50mm) | ±20% | 汽车 | 2200 µF | 30mOhm @ 10kHz | 0.197 (5.00mm) | Polar | 25 mOhms | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 2.858 A @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | - | 1.654 (42.00mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H4F34I3LG | ALTERA | 数据表 | 606 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 24 | SMD/SMT | 82500 LAB | 965100 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066H4F34I3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-L2SBG485I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | 活跃 | 130 | Tray | XC7Z030 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-1FCVG784T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 微芯片技术 | MCU - 136, FPGA - 312 | Tray | 活跃 | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2MLIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LSIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LLIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1MLIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1MSIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24B2E3V | Intel | 数据表 | 580 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 768 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM2202-1LSEVSVC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R25A3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-L1FBVB900I | AMD | 数据表 | 930 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 活跃 | 204 | Tray | XCZU7 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - |
AGFA023R25A3I3E
Intel
分类:Embedded - System On Chip (SoC)
96,253.984002
AGFA019R25A2E3E
Intel
分类:Embedded - System On Chip (SoC)
10AS016E3F29E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
6,017.860876
10AS027H4F34I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
14,417.236489
10AS032E4F29I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10,130.657735
10AS027H4F35I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10,259.512417
10AS027E1F27I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
XCVM1302-1LLINBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-2LSENBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
5CSEBA6U23C7N
ALTERA
分类:Embedded - System On Chip (SoC)
2,032.717952
AGFA027R31C3E3E
Intel
分类:Embedded - System On Chip (SoC)
XC7Z045-1FFG900C
AMD
分类:Embedded - System On Chip (SoC)
14,471.395109
XC7Z015-1CLG485C
AMD
分类:Embedded - System On Chip (SoC)
974.342192
10AS066H4F34I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
32,102.361179
XC7Z030-L2SBG485I
AMD
分类:Embedded - System On Chip (SoC)
MPFS160T-1FCVG784T2
Microchip
分类:Embedded - System On Chip (SoC)
XCVM1802-2MLIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1LSIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1LLIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1MLIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1MSIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
AGFA012R24B2E3V
Intel
分类:Embedded - System On Chip (SoC)
56,710.937466
XCVM2202-1LSEVSVC2197
Xilinx
分类:Embedded - System On Chip (SoC)
AGFB022R25A3E3E
Intel
分类:Embedded - System On Chip (SoC)
XCZU7EV-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
28,778.749329
