类别是'category.片上系统(SoC)' (7720)

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容差

JESD-609代码

零件状态

ECCN 代码

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最高工作温度

最小工作温度

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HTS代码

子类别

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JESD-30代码

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最高频率

筛选水平

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主要属性

逻辑单元数

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凸轮长度

设备核心

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无铅

A2F200M3F-1PQG208
A2F200M3F-1PQG208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

208-BFQFP

208

208-PQFP (28x28)

铁粉

微芯片技术

Thru-Hole

8542310000/8542310000/8542310000/8542310000/8542310000

113

Compliant

Tray

A2F200

活跃

-55°C to +105°C

SmartFusion®

0.1

85 °C

0 °C

100 MHz

1.5 V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575 V

1.425 V

Pb

4.5 kB

7 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

400 kbps

MCU, FPGA

2500

ARM

200000

100 MHz

1

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

无铅

5CSEBA6U23I7NTS
5CSEBA6U23I7NTS
ALTERA 数据表

2690 In Stock

-

最小起订量: 1

最小包装量: 1

ABB

Tray

*

活跃

BCM47622LA1KFEBG
BCM47622LA1KFEBG
Broadcom 数据表

10000 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Broadcom Limited

Broadcom Limited

Broadcom / Avago

Details

-

Tray

活跃

588

-

-

Communication & Networking ICs

1.5GHz

-

ARM® Cortex®-A7

DDR3, DDR4, LED

Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi

MPU

Network Controller & Processor ICs

-

-

Network Controller & Processor ICs

XCZU48DR-1FFVG1517I
XCZU48DR-1FFVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

有

表面贴装

561

Tray

活跃

Industrial grade

RISC

1.8, 2.5, 3.3 V

6

CAN/Serial I2C/SPI/UART/USB

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

2, 15 V

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S050T-VFG400I
M2S050T-VFG400I
Microchip 数据表

2140 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

微芯片技术

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

207

Tray

M2S050

活跃

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

XCZU48DR-L2FSVG1517I
XCZU48DR-L2FSVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

Tray

活跃

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-2FSVF1760E
XCZU49DR-2FSVF1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

Tray

活跃

622

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S150T-1FC1152
M2S150T-1FC1152
Microchip 数据表

2680 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FCBGA (35x35)

1

微芯片技术

146124 LE

166 MHz

-

574

Tray

M2S150

活跃

64 kB

-

SMD/SMT

0°C ~ 85°C (TJ)

SmartFusion®2

No Stopper

166MHz

64KB

Cam

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

Zinc-Plated

1 Core

512KB

45.0 mm

M2S005-1VFG256I
M2S005-1VFG256I
Microchip 数据表

152 In Stock

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

MSL 3 - 168 hours

161

Tray

M2S005

活跃

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

191Kbit

FPGA - 5K Logic Modules

128KB

XCZU43DR-1FSVE1156I
XCZU43DR-1FSVE1156I
AMD 数据表

760 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

活跃

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-1FFVF1760I
XCZU49DR-1FFVF1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

有

表面贴装

622

Tray

活跃

Industrial grade

RISC

1.8/2.5/3.3 V

FCBGA

CAN/Serial I2C/SPI/UART/USB

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1760

0.85 V

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-A5

XCZU43DR-L1FSVG1517I
XCZU43DR-L1FSVG1517I
AMD 数据表

694 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

Tray

活跃

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1902-1LSEVSVA2197
XCVC1902-1LSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Tray

活跃

770

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU48DR-2FFVG1517I
XCZU48DR-2FFVG1517I
AMD 数据表

809 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

Tray

活跃

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU11EG-2FFVB1517I
XCZU11EG-2FFVB1517I
AMD 数据表

775 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

488

Tray

XCZU11

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCZU11EG-1FFVC1760E
XCZU11EG-1FFVC1760E
AMD 数据表

977 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

512

Tray

XCZU11

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

M2S005-VF256I
M2S005-VF256I
Microchip 数据表

21 In Stock

-

最小起订量: 1

最小包装量: 1

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.84

161

Tray

M2S005

活跃

-

166 MHz

6060 LE

SMD/SMT

-

64 kB

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

无

M2S005-VF256I

LFBGA

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

161

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

14 mm

14 mm

M2S150T-1FC1152M
M2S150T-1FC1152M
Microchip 数据表

732 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

NC16

Cully-Minerallac

574

Tray

M2S150

活跃

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-55 °C

1.2 V

30

1.14 V

125 °C

无

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

-55°C ~ 125°C (TJ)

SmartFusion®2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

512KB

35 mm

35 mm

AGFB023R25A2E3E
AGFB023R25A2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCZU9CG-2FFVB1156I
XCZU9CG-2FFVB1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

328

Tray

XCZU9

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU2CG-2SBVA484I
XCZU2CG-2SBVA484I
AMD 数据表

2443 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

82

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

AGFD023R25A2E3E
AGFD023R25A2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCZU49DR-2FSVF1760I
XCZU49DR-2FSVF1760I
AMD 数据表

791 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

1.8/2.5/3.3 V

FCBGA

6

CAN/Serial I2C/SPI/UART/USB

有

表面贴装

622

Tray

活跃

Industrial grade

RISC

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

0.85 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/Arm Cortex-R5

M2S150-1FCVG484
M2S150-1FCVG484
Microchip 数据表

2558 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

M2S150-1FCVG484

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.77

273

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

BGA484,22X22,32

1.2 V

40

1.14 V

85 °C

有

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

273

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

273

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

19 mm

19 mm

10AS048H1F34I1HG
10AS048H1F34I1HG
ALTERA 数据表

533 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

活跃

INTEL CORP

5.68

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

+ 100 C

- 40 C

24

SMD/SMT

60000 LAB

965036

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS048H1F34I1HG

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

24 Transceiver

FPGA - 480K Logic Elements

2 Core

--

SoC FPGA