类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 型芯材料 | 包装数量 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 零件状态 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 样式 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 最大电源电压 | 最小电源电压 | 终端类型 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | 配件类型 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 数据率 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 核心架构 | 总 RAM 位数 | 阀门数量 | 最高频率 | 筛选水平 | 速度等级 | 收发器数量 | 主要属性 | 逻辑单元数 | 完成 | 核数量 | 闪光大小 | 产品类别 | 凸轮长度 | 设备核心 | 长度 | 宽度 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | A2F200M3F-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | 铁粉 | 微芯片技术 | Thru-Hole | 8542310000/8542310000/8542310000/8542310000/8542310000 | 113 | Compliant | Tray | A2F200 | 活跃 | -55°C to +105°C | SmartFusion® | 0.1 | 85 °C | 0 °C | 100 MHz | 1.5 V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575 V | 1.425 V | Pb | 4.5 kB | 7 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100 MHz | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U23I7NTS | ALTERA | 数据表 | 2690 In Stock |
- | 最小起订量: 1 最小包装量: 1 | ABB | Tray | * | 活跃 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM47622LA1KFEBG | Broadcom | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Broadcom Limited | Broadcom Limited | Broadcom / Avago | Details | - | Tray | 活跃 | 588 | - | - | Communication & Networking ICs | 1.5GHz | - | ARM® Cortex®-A7 | DDR3, DDR4, LED | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | MPU | Network Controller & Processor ICs | - | - | Network Controller & Processor ICs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-1FFVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 有 | 表面贴装 | 561 | Tray | 活跃 | Industrial grade | RISC | 1.8, 2.5, 3.3 V | 6 | CAN/Serial I2C/SPI/UART/USB | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 2, 15 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-VFG400I | Microchip | 数据表 | 2140 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 207 | Tray | M2S050 | 活跃 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L2FSVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | Tray | 活跃 | 561 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-2FSVF1760E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | Tray | 活跃 | 622 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FC1152 | Microchip | 数据表 | 2680 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 1 | 微芯片技术 | 146124 LE | 166 MHz | - | 574 | Tray | M2S150 | 活跃 | 64 kB | - | SMD/SMT | 0°C ~ 85°C (TJ) | SmartFusion®2 | No Stopper | 166MHz | 64KB | Cam | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | Zinc-Plated | 1 Core | 512KB | 45.0 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-1VFG256I | Microchip | 数据表 | 152 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | MSL 3 - 168 hours | 161 | Tray | M2S005 | 活跃 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-1FSVE1156I | AMD | 数据表 | 760 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | 活跃 | 366 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-1FFVF1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 有 | 表面贴装 | 622 | Tray | 活跃 | Industrial grade | RISC | 1.8/2.5/3.3 V | FCBGA | CAN/Serial I2C/SPI/UART/USB | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 1760 | 0.85 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-A5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-L1FSVG1517I | AMD | 数据表 | 694 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | Tray | 活跃 | 561 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | Tray | 活跃 | 770 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVG1517I | AMD | 数据表 | 809 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | Tray | 活跃 | 561 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-2FFVB1517I | AMD | 数据表 | 775 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 488 | Tray | XCZU11 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVC1760E | AMD | 数据表 | 977 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 512 | Tray | XCZU11 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-VF256I | Microchip | 数据表 | 21 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | 161 | Tray | M2S005 | 活跃 | - | 166 MHz | 6060 LE | SMD/SMT | - | 64 kB | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 无 | M2S005-VF256I | LFBGA | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 161 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FC1152M | Microchip | 数据表 | 732 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | NC16 | Cully-Minerallac | 574 | Tray | M2S150 | 活跃 | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB023R25A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2FFVB1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 328 | Tray | XCZU9 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-2SBVA484I | AMD | 数据表 | 2443 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 82 | Tray | XCZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFD023R25A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-2FSVF1760I | AMD | 数据表 | 791 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 1.8/2.5/3.3 V | FCBGA | 6 | CAN/Serial I2C/SPI/UART/USB | 有 | 表面贴装 | 622 | Tray | 活跃 | Industrial grade | RISC | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 0.85 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/Arm Cortex-R5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-1FCVG484 | Microchip | 数据表 | 2558 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | 微芯片技术 | M2S150-1FCVG484 | FBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | 273 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | - | 64 kB | VFBGA-484 | GRID ARRAY, FINE PITCH | 4 | PLASTIC/EPOXY | BGA484,22X22,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B484 | 273 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048H1F34I1HG | ALTERA | 数据表 | 533 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 活跃 | INTEL CORP | 5.68 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 480000 LE | + 100 C | - 40 C | 24 | SMD/SMT | 60000 LAB | 965036 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS048H1F34I1HG | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA |
A2F200M3F-1PQG208
Microchip
分类:Embedded - System On Chip (SoC)
5CSEBA6U23I7NTS
ALTERA
分类:Embedded - System On Chip (SoC)
2,697.812007
BCM47622LA1KFEBG
Broadcom
分类:Embedded - System On Chip (SoC)
182.631740
XCZU48DR-1FFVG1517I
AMD
分类:Embedded - System On Chip (SoC)
M2S050T-VFG400I
Microchip
分类:Embedded - System On Chip (SoC)
1,591.036869
XCZU48DR-L2FSVG1517I
AMD
分类:Embedded - System On Chip (SoC)
XCZU49DR-2FSVF1760E
AMD
分类:Embedded - System On Chip (SoC)
M2S150T-1FC1152
Microchip
分类:Embedded - System On Chip (SoC)
3,356.841651
M2S005-1VFG256I
Microchip
分类:Embedded - System On Chip (SoC)
286.545110
XCZU43DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
124,354.560959
XCZU49DR-1FFVF1760I
AMD
分类:Embedded - System On Chip (SoC)
XCZU43DR-L1FSVG1517I
AMD
分类:Embedded - System On Chip (SoC)
178,633.469676
XCVC1902-1LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FFVG1517I
AMD
分类:Embedded - System On Chip (SoC)
252,984.784843
XCZU11EG-2FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
45,019.721170
XCZU11EG-1FFVC1760E
AMD
分类:Embedded - System On Chip (SoC)
34,909.156893
M2S005-VF256I
Microchip
分类:Embedded - System On Chip (SoC)
255.986346
M2S150T-1FC1152M
Microchip
分类:Embedded - System On Chip (SoC)
27,589.810432
AGFB023R25A2E3E
Intel
分类:Embedded - System On Chip (SoC)
XCZU9CG-2FFVB1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU2CG-2SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
3,070.226686
AGFD023R25A2E3E
Intel
分类:Embedded - System On Chip (SoC)
XCZU49DR-2FSVF1760I
AMD
分类:Embedded - System On Chip (SoC)
231,281.682882
M2S150-1FCVG484
Microchip
分类:Embedded - System On Chip (SoC)
1,604.810381
10AS048H1F34I1HG
ALTERA
分类:Embedded - System On Chip (SoC)
37,580.186445
