类别是'category.片上系统(SoC)' (7720)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

Core

厂商

操作温度

包装

系列

JESD-609代码

零件状态

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

HTS代码

电容量

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

基本部件号

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

界面

内存大小

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

核心架构

最高频率

逻辑块数(LABs)

速度等级

主要属性

逻辑块数量

逻辑单元数

核数量

闪光大小

产品长度

产品宽度

长度

宽度

无铅

MPFS095T-1FCSG325E
MPFS095T-1FCSG325E
Microchip Technology 数据表

2826 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

276 I/O

0 C

+ 100 C

1

Bulk

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

0°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS095TL-FCSG325I
MPFS095TL-FCSG325I
Microchip Technology 数据表

2932 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS160TL-FCVG484I
MPFS160TL-FCVG484I
Microchip Technology 数据表

2194 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160T-FCVG484I
MPFS160T-FCVG484I
Microchip Technology 数据表

2249 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TLS-FCVG484I
MPFS160TLS-FCVG484I
Microchip Technology 数据表

2705 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS250TL-FCG1152E
MPFS250TL-FCG1152E
Microchip Technology 数据表

2270 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-1152

1152-FCBGA (35x35)

RV64GC, RV64IMAC

微芯片技术

372 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250TS-FCG1152I
MPFS250TS-FCG1152I
Microchip Technology 数据表

2381 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-1152

1152-FCBGA (35x35)

RV64GC, RV64IMAC

微芯片技术

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250TS-1FCG1152I
MPFS250TS-1FCG1152I
Microchip Technology 数据表

2330 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-1152

1152-FCBGA (35x35)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

SMD/SMT

This product may require additional documentation to export from the United States.

Tray

活跃

1

+ 100 C

- 40 C

372 I/O

254000 LE

-

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS160TL-FCSG536I
MPFS160TL-FCSG536I
Microchip Technology 数据表

2260 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

+ 100 C

1

SMD/SMT

This product may require additional documentation to export from the United States.

Tray

活跃

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TL-FCSG536E
MPFS160TL-FCSG536E
Microchip Technology 数据表

2554 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160T-1FCSG536E
MPFS160T-1FCSG536E
Microchip Technology 数据表

2953 In Stock

-

最小起订量: 1

最小包装量: 1

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

0°C ~ 100°C

Tray

PolarFire®

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095T-FCSG325E
MPFS095T-FCSG325E
Microchip Technology 数据表

2468 In Stock

-

最小起订量: 1

最小包装量: 1

FCSG-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

276 I/O

0 C

+ 100 C

1

Bulk

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

0°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS095TL-FCSG325E
MPFS095TL-FCSG325E
Microchip Technology 数据表

2529 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

276 I/O

0 C

+ 100 C

1

Bulk

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

0°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS095T-FCVG784I
MPFS095T-FCVG784I
Microchip Technology 数据表

2837 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

276 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095T-FCVG784E
MPFS095T-FCVG784E
Microchip Technology 数据表

2152 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

276 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TLS-FCG1152I
MPFS250TLS-FCG1152I
Microchip Technology 数据表

733 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-1152

1152-FCBGA (35x35)

RV64GC, RV64IMAC

微芯片技术

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

5ASTFD5K3F40I3N
5ASTFD5K3F40I3N
ALTERA 数据表

2 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

1.18 V

5.29

MCU - 208, FPGA - 540

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASTFD5K3F40I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

-40°C ~ 100°C (TJ)

Tray

Arria V ST

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASTFD5

S-PBGA-B1517

540

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

40 mm

40 mm

5ASXBB3D4F40I5N
5ASXBB3D4F40I5N
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

1.13 V

5.27

MCU - 208, FPGA - 540

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASXBB3D4F40I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXBB3

S-PBGA-B1517

540

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

40 mm

40 mm

5CSEBA5U23I7
5CSEBA5U23I7
ALTERA 数据表

2315 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

YES

672-UBGA (23x23)

672

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

无

5CSEBA5U23I7

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.55

MCU - 181, FPGA - 145

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SE

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

23 mm

23 mm

5CSEMA5U23C8N
5CSEMA5U23C8N
ALTERA 数据表

2709 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

YES

672-UBGA (23x23)

672

MCU - 181, FPGA - 145

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEMA5U23C8N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.25

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEMA5

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

OTHER

600MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

23 mm

23 mm

5CSEBA5U23C8N
5CSEBA5U23C8N
ALTERA 数据表

2689 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

YES

672-UBGA (23x23)

672

1.13 V

2

MCU - 181, FPGA - 145

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEBA5U23C8N

FBGA

SQUARE

Intel Corporation

活跃

FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

INTEL CORP

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

e1

活跃

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEBA5

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

OTHER

600MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

23 mm

23 mm

5CSEMA6U23C6N
5CSEMA6U23C6N
ALTERA 数据表

2737 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

YES

672-UBGA (23x23)

672

1.13 V

5.56

MCU - 181, FPGA - 145

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEMA6U23C6N

FBGA

SQUARE

Intel Corporation

活跃

FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

INTEL CORP

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEMA6

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

OTHER

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 110K Logic Elements

110000

--

23 mm

23 mm

5CSEBA5U23I7N
5CSEBA5U23I7N
ALTERA 数据表

2810 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

YES

672

672-UBGA (23x23)

672

有

1.07 V

未说明

1.1 V

BGA672,28X28,32

MCU - 181, FPGA - 145

8542390000

Compliant

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

3

PLASTIC/EPOXY

1.99

1.13 V

INTEL CORP

活跃

Intel Corporation

SQUARE

FBGA

622 MHz

5CSEBA5U23I7N

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SE

e1

活跃

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

800 MHz

5CSEBA5

S-PBGA-B672

145

不合格

1.13 V

1.1,1.2/3.3,2.5 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

556.3 kB

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

85000

ARM

800 MHz

32075

7

FPGA - 85K Logic Elements

85000

--

23 mm

23 mm

无铅

MPFS250T-1FCVG484T2
MPFS250T-1FCVG484T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

微芯片技术

MCU - 136, FPGA - 108

Tray

活跃

-40°C ~ 125°C (TJ)

-

-

2.2MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128KB

M2S050-FGG896
M2S050-FGG896
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

896-BGA

896-FBGA (31x31)

微芯片技术

Tray

M2S050

活跃

-

166 MHz

56340 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

10%

1.2000 V

377

0 to 85 °C

SmartFusion®2

1 uF

896

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

3.2 mm

3.2 x 2.5 x 2.79 mm